HPE today announced, in partnership with the U.S. Department of Energy (DOE), National Nuclear Security Administration (NNSA) and Los Alamos National Laboratory (LANL), that it has been selected to deliver two state-of-the-art supercomputers, named "Mission" and "Vision". The next-generation systems will be based on the new direct liquid-cooled HPE Cray Supercomputing GX5000 system and feature upcoming NVIDIA Vera Rubin Superchips. Mission and Vision are part of the DOE's $370 million investment to accelerate scientific discovery, advance AI initiatives and strengthen national security.

"For decades, HPE and Los Alamos National Laboratory have collaborated on innovative supercomputing designs that deliver powerful capabilities to solve complex scientific challenges and bolster national security efforts," said Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions at HPE. "We are proud to continue powering the lab's journey with the upcoming Mission and Vision systems. These innovations will be among the first to feature next-generation HPE Cray supercomputing architecture to drive AI innovation and scientific impact."

Sandisk kicked off the countdown to the FIFA World Cup 2026 today with the launch of its collection of officially licensed products. Purpose-built for what's set to be one of the most content-rich sporting events in history, the Sandisk Official Licensed Product Collection for the FIFA World Cup 2026 empowers fans, creators, and professionals alike to capture, preserve, and relive the most iconic moments from the world's biggest stage in sports.

Blending heritage with innovation, the design-led products honor host nations and iconic moments through whistle-inspired USB-C drives to SSDs in tournament colors and pro-level memory cards to capture history-making moments. Each product proudly bears official FIFA World Cup 2026 licensing marks and host nation-inspired details, making them authentic pieces of football history.

Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is showcasing its advanced AI infrastructure solutions at NVIDIA GTC in Washington, D.C. this week, highlighting systems tailored to meet the stringent requirements of federal customers. Supermicro announced its plans to deliver next-generation NVIDIA AI platforms, including the NVIDIA Vera Rubin NVL144 and NVIDIA Vera Rubin NVL144 CPX in 2026. Additionally, Supermicro introduces U.S.-manufactured, TAA (Trade Agreements Act)-compliant systems, including the high-density 2OU NVIDIA HGX B300 8-GPU system with up to 144 GPUs per rack and an expanded portfolio featuring a Super AI Station based on NVIDIA GB300 and the new rack-scale NVIDIA GB200 NVL4 HPC solutions.

"Our expanded collaboration with NVIDIA and our focus on U.S.-based manufacturing position Supermicro as a trusted partner for federal AI deployments. With our corporate headquarters, manufacturing, and R&D all based in San Jose, California, in the heart of Silicon Valley, we have an unparalleled ability and capacity to deliver first-to-market solutions are developed, constructed, validated (and manufactured) for American federal customers," said Charles Liang, president and CEO, Supermicro. "The result of many years of working hand-in-hand with our close partner NVIDIA—also based in Silicon Valley—Supermicro has cemented its position as a pioneer of American AI infrastructure development."

Quantum Machines (QM), the leading provider of quantum control solutions, today announced its integration with NVIDIA NVQLink, the new open platform for real-time orchestration between quantum and classical computing resources. This marks a major step that extends QM's first-of-its-kind, field-proven, µs-latency quantum-classical integration solution.

Building on the foundation of NVIDIA DGX Quantum - the first system to connect a quantum controller directly with the NVIDIA accelerated computing stack - QM's platform will support the new NVQLink open architecture, providing seamless interoperability between quantum processors (QPUs), control hardware, CPUs, and GPUs. The result is real-time data exchange and control at microsecond latency, enabling the demanding workloads required for logical qubits and large-scale quantum error correction.

AI factories continue to grow at unprecedented scale, processing structured, unstructured and emerging AI-native data. With demand for trillion-token workloads exploding, a new class of infrastructure is required to keep pace. At NVIDIA GTC Washington, D.C, NVIDIA revealed the NVIDIA BlueField-4 data processing unit, part of the full-stack BlueField platform that accelerates gigascale AI infrastructure, delivering massive computing performance, supporting 800 Gb/s of throughput and enabling high-performance inference processing.

Powered by software-defined acceleration across AI data storage, networking and security, NVIDIA BlueField-4 transforms data centers into secure, intelligent AI infrastructure—designed to accelerate every workload, in every AI factory. It's purpose-built as the end-to-end engine for a new class of AI storage platforms, bringing AI data storage acceleration to the foundation of AI data pipelines for efficient data processing and breakthrough performance at scale.

Razer, the leading global lifestyle brand for gamers, today unveiled the Razer Huntsman V3 Pro 8KHz and Razer Huntsman V3 Pro Tenkeyless 8KHz, its most advanced esports gaming keyboards to date. The Huntsman V3 Pro 8KHz and Huntsman V3 Pro Tenkeyless 8KHz build on the award-winning Huntsman legacy, introducing next-generation responsiveness and refined keystroke feel for a truly competitive edge.

"The Huntsman V3 Pro 8KHz is a reflection of our relentless pursuit of esports excellence. With the evolution of our Analog Optical Switches and the introduction of 8000 Hz HyperPolling, we've pushed performance to new heights," said Barrie Ooi, Head of Razer's PC Gaming Division. "It delivers the speed, control and precision that elite players demand. It's a showcase of what happens when engineering meets competitive ambition."

After the success of the highly acclaimed and award-winning Arx 500 and Arx 700 cases, ENDORFY presents their younger, equally ambitious sibling. The new Arx 500 White ARGB, finished in an elegant white color scheme, is a natural evolution of the series and another step toward a complete product portfolio that allows to build a reliable, visually consistent ENDORFY ecosystem. Designed with attention to detail, the white Arx 500 impresses with perfectly matched shades of white, ensuring that it looks great both right out of the box and after long-term use. It's a blend of performance and design that creators, gamers and professionals alike will appreciate.

Technology In Its Purest Form
Behind its beautiful form lies thoughtful engineering. The spacious interior can accommodate up to seven fans and radiators up to 360 mm, and it's compatible with ATX, microATX, and Mini-ITX motherboards. Straight out of the box, the case comes equipped with four pre-installed Stratus 140 White PWM ARGB fans, developed in collaboration with Synergy Cooling. Each operates between 200 and 1400 RPM, delivering not only excellent airflow but also silence.

Kensington, a worldwide leader of desktop computing and mobility solutions for IT, business, and home office professionals, today announced the Expert Mouse TB800 EQ Trackball, a next-generation, finger-operated ergonomic trackball that delivers premium performance and precise control for creative professionals and consumers.

A recipient of a prestigious 2025 iF Design Award, the TB800 enhances user comfort and productivity through advanced customization options, an adjustable scroll ring, exceptional tracking, an ambidextrous design, and seamless wireless connectivity. Featuring an innovative symmetrical design that is ideal for use by left- and right-handed users, the TB800 incorporates a slight angle that enables users to operate the trackball with their hands in a natural resting position that maximizes comfort and potentially reduces fatigue and repetitive strain injuries.

LG Electronics (LG) today announced the signing of a memorandum of understanding (MOU) with SK Enmove (SKEN) and Green Revolution Cooling (GRC) to jointly develop and expand next-generation liquid immersion cooling solutions optimized for artificial intelligence data centers (AIDCs). Under the agreement, the three companies will collaborate to explore new business opportunities, conduct joint marketing and deliver proof of concept (PoC) demonstrations for integrated solutions and business models in liquid immersion cooling for AIDCs.

SKEN, a leading company in advanced lubricating base oils and premium lubricants, provides next-generation thermal management solutions, including immersion cooling fluids, and is strengthening its global partnerships to foster an immersion cooling ecosystem. In 2022, SKEN became the first company in Korea to develop immersion cooling fluids. Through an equity investment in GRC, SKEN is also leading the way in innovation in the future cooling market, jointly developing data center immersion cooling systems with the company.

AMD's expertise in the supercomputers sector seems to pay off as the company secured a $1 billion partnership with the U.S. Department of Energy (DoE) to build two next-generation supercomputers aimed at scientific and national security challenges, from nuclear fusion research to cancer treatments. Energy Secretary Chris Wright said the initiative will "supercharge" progress in nuclear energy, defense technologies and drug discovery, accelerating breakthroughs that traditionally take decades. The first system, Lux, is set to go online within six months. Co-developed by AMD, Hewlett Packard Enterprise, Oracle Cloud Infrastructure, and Oak Ridge National Laboratory (ORNL), Lux will be powered by AMD's Instinct MI355X AI accelerators alongside AMD CPUs and networking chips. ORNL Director Stephen Streiffer noted that Lux will deliver roughly three times the AI performance of today's top supercomputers, while AMD CEO Lisa Su called it "the fastest deployment of this scale we've ever seen." A second system, dubbed Discovery, will follow later in the decade. Built on AMD's upcoming MI430 AI chips, the more advanced machine is expected to be completed by 2028 and operational by 2029. Both systems are part of a broader U.S. effort to maintain leadership in high-performance computing and artificial intelligence.

According to Reuters, the DoE's choice of AMD reflects confidence in the company's proven HPC track record, particularly with Frontier and El Capitan, the world's fastest supercomputers, which also runs on AMD hardware. Wright added that these new systems will help simulate complex processes like plasma dynamics for fusion energy and molecular interactions for drug development. "We're going to see massively faster progress toward harnessing fusion and treating diseases that are still death sentences today," he said. Together, Lux and Discovery mark a milestone for both AMD and U.S. scientific computing and build momentum for AMD's upcoming MI400 accelerators series.

Qualcomm Technologies, Inc. today announced the launch of its next-generation AI inference-optimized solutions for data centers: the Qualcomm AI200 and AI250 chip-based accelerator cards, and racks. Building off the Company's NPU technology leadership, these solutions offer rack-scale performance and superior memory capacity for fast generative AI inference at high performance per dollar per watt—marking a major leap forward in enabling scalable, efficient, and flexible generative AI across industries.

Qualcomm AI200 introduces a purpose-built rack-level AI inference solution designed to deliver low total cost of ownership (TCO) and optimized performance for large language & multimodal model (LLM, LMM) inference and other AI workloads. It supports 768 GB of LPDDR per card for higher memory capacity and lower cost, enabling exceptional scale and flexibility for AI inference.

Announced at their recent event in San Francisco, the OCA Ecosystem will democratize chip design, lower development costs, and accelerate innovation, enabling heterogeneous chiplets for plug-and-play interoperability. There are now more than 50 partners involved in the ecosystem, from leading semiconductor companies and global conglomerates to academic institutions.

For decades, the semiconductor industry has relied on monolithic, system-on-chip (SoC) designs, a process that has become increasingly complex, expensive, and time-consuming. The Open Chiplet Atlas Ecosystem directly addresses this challenge by defining a complete solution to chiplet interoperability in physical, transport, protocol, as well as, system, and software layers.

A new Ryzen 5 7500X3D has surfaced in a UK retail listing hinting that AMD is preparing another entry-level X3D CPU for launch at CES 2026. The listing, shared by @momomo_us includes OPN code 100-000001904, confirming it as a new SKU within the "Raphael" lineup. The 7500X3D is expected to feature 6 cores and 12 threads, 96 MB of total cache (32 MB L3 + 64 MB 3D V-Cache), and a 65 W TDP. Boost clocks will likely come in below 4.7 GHz, roughly 300-400 MHz lower than the 7600X3D. If accurate, it would be AMD's most affordable 3D V-Cache CPU yet, aimed at budget-conscious gamers.

The new chip would join AMD's growing list of X3D models, including the 7800X3D, 7900X3D, 7950X3D, and 7600X3D. With multiple Zen 5 X3D refresh parts rumored for a CES 2026 launch; such as Ryzen 7 9850X3D and Ryzen 9 9950X3D2, AMD's X3D family is seeing another expansion in early 2026. The rumored Ryzen 9 9950X3D2 is particularly interesting as it appears to be AMD's next flagship model featuring 16 cores, 32 threads, 192 MB of L3 cache, and 200 W TDP. As for the Ryzen 5 7500X3D, there's currently no confirmation of global availability but given AMD's past moves with region-specific launches like the 5600X3D, wider distribution is possible.

Montage Technology today announced the mass production of its Gen 4 DDR5 Registering Clock Driver (RCD04) chip. As a core component of high-performance server and data center memory systems, this chip delivers significant memory performance improvements for next-generation computing platforms.

The RCD04 chip supports data transfer rates of up to 7200 MT/s, an increase of over 12.5% compared to its predecessor. By adopting an innovative power management architecture and advanced signal processing technology, the chip not only achieves higher transfer speed but also enhances power efficiency and signal integrity, thereby ensuring stable and efficient operation of large-scale data centers.

Razer, the leading global lifestyle brand for gamers, has unveiled the Esports Green Collection, a bold new colorway across its elite competitive peripherals. These products, favored by top esports athletes across titles such as VALORANT, Counter-Strike 2 (CS2), Call of Duty, Street Fighter, and more - are now available in Razer's signature green, reinforcing their status as the gear of champions.

Built for Performance. Designed to Stand Out.
This launch celebrates Razer's iconic 802C green, the official Pantone color code that defines the brand's signature hue. Recognized instantly across the gaming world, 802C is synonymous with Razer's identity and its enduring legacy in professional esports. The Esports Green Collection marks a new chapter in the brand's commitment to competitive excellence, the spirit of champions, and the unity of a global community driven by performance.

IBM says it has successfully executed one of its key quantum computing algorithms in real time on AMD field-programmable gate arrays (FPGAs), marking a step toward cheaper and more practical hybrid quantum systems. The algorithm, designed to dynamically detect and correct quantum errors, was first announced in June and is now running on widely available AMD reconfigurable hardware rather than costly, custom-built control units. Jay Gambetta, IBM's VP of Quantum, told Reuters that the FPGA-based implementation performs 10× faster than required for live error correction, calling it "a big deal" for real-world quantum computing. The demonstration suggests IBM's development timeline is a full year ahead of schedule for its 2029 Starling quantum system roadmap. Quantum computers use qubits that can show both 0 and 1 at the same time but often face problems from outside factors that lead to errors in calculations. IBM's new method tackles this issue by keeping an eye on and fixing these errors as they happen, which keeps the system steady during quantum tasks. By running this quantum computing algorithm on regular AMD chips, we see how classical and quantum systems are coming together more and more opening doors to mixed setups where normal hardware handles fixing errors and running things in real time.

IBM's approach might help close the gap between the early quantum machines we have now and future ones that don't make mistakes. By showing that off-the-shelf chips you'd find in data centers can do this job well, IBM cuts down on costs and makes things simpler while also making it easier to improve performance as systems get bigger. These are big steps in moving quantum computing out of labs and into the business world. The partnership between IBM and AMD appears to be bearing fruit. Back in August, the two companies announced a close collaboration to develop next-generation computing architectures that combine quantum computing and high-performance computing, a concept known as quantum-centric supercomputing. More recently, in early October, IBM and AMD also revealed a joint effort to deliver advanced AI infrastructure to Zyphra, an open-source AI research and product company based in San Francisco. Under a multi-year agreement, IBM will provide Zyphra with a large cluster of AMD Instinct MI300X GPUs hosted on IBM Cloud, enabling the training of next-generation multimodal foundation models.

Google has announced a major breakthrough in quantum computing with its new Willow processor claiming a 13,000× performance advantage over the world's fastest supercomputers. The 105-qubit chip successfully executed a physics simulation using a new algorithm called Quantum Echoes completing in seconds what classical systems would take days to compute. The experiment simulated out-of-time-order correlators (OTOCs), a benchmark for complex quantum interference, marking what Google calls the first verifiable demonstration of quantum advantage with real-world applications. The Quantum Echoes algorithm was built to leverage quantum parallelism showing both high speed and accuracy.

Google says the achievement, announced on October 22 demonstrates practical potential for quantum workloads in molecular modeling, materials science, and NMR spectroscopy. While widespread applications remain several years out, the company notes that the result validates its long-term roadmap pairing hardware like Willow with custom algorithms to achieve scalable, fault-tolerant quantum computation. Meanwhile, IBM 1,121-qubit Condor processor announced in December 2023 has yet to demonstrate comparable real-world performance. However, the scope of IBM's Condor quantum processor was to pave the way for its smaller 156-qubit Heron processor integrated into IBM's Quantum System Two. Despite Willow's smaller qubit count Google's results highlight the importance of algorithmic efficiency and error correction, suggesting that raw qubit numbers alone are no longer the key determinant of quantum computing progress.

Sandisk and Crayola today announced that the companies have partnered together to launch the Sandisk Crayola USB-C Flash Drive, the first officially licensed Crayola USB flash drive available for purchase starting today. Teachers, parents, and students are no strangers to stacks of schoolwork or growing collections of precious artwork. Now, they can store art projects, homework assignments, favorite photos, games, and more in an adorable crayon-shaped flash drive - perfect for making space for even more creativity.

These colorful USB-C flash drives celebrate the iconic Crayola brand, empowering artists and creators for more than 120 years. From the playful crayon shape to the signature Crayola crayon box packaging, the Sandisk Crayola USB-C Flash Drive combines nostalgia, creativity, and practicality. It is available in a range of vibrant colors, including Mango Tango, Cerulean Blue, Electric Lime, and Vivid Violet, making it a collectible and fun accessory for Crayola fans of all ages.

Intel has posted stronger than expected third-quarter 2025 results, boosted by aggressive cost-cutting measures under CEO Lip-Bu Tan and fresh capital injections from NVIDIA, SoftBank, and the U.S. government. Shares rose about 5% after its share price drop of about 60% last year. Team Blue reported $2.5 billion in operating cash flow, its fourth straight quarter of improved execution, and noted that demand is now outpacing supply heading into 2026. CFO David Zinsner said the new funding increases Intel's operational flexibility and highlights its importance to the broader semiconductor ecosystem.

Recently Intel unveiled its Core Ultra Series 3 "Panther Lake" processors and Xeon 6+ "Clearwater Forest", both built on Intel 18A process technology, alongside a new inference GPU, "Crescent Island." Meanwhile, Fab 52 in Chandler, Arizona is now fully operational, producing 18A wafers, part of Intel's $100 billion domestic expansion plan. Intel strengthened its balance sheet in Q3 with several major deals. The company received $5.7 billion from a planned $8.9 billion U.S. government, while NVIDIA invested $5 billion and agreed to co-develop future PC and datacenter platforms using NVLink. SoftBank added $2 billion to support Intel's U.S. fab expansion, and the Altera stake sale generated an additional $5.2 billion in cash. Compared to Q3 2024 Intel Foundry's revenue is still down 2% while Data Center and AI dropped 1% indicating that both divisions are still under pressure. For the fourth quarter of 2025, Intel expects revenue between $12.8 billion and $13.8 billion.

Razer, the leading global lifestyle brand for gamers, today announced the launch of the Razer Raiju V3 Pro, a next-generation wireless gaming controller engineered for use with the PlayStation 5 console. Featuring symmetrical TMR (Tension Magnetic Resistance) thumbsticks, Razer Pro HyperTriggers, and 4 removable mouse-click back buttons, the Raiju V3 Pro is designed to give console players the competitive edge they need.

"The Raiju V3 Pro is a game-changer on the PS5," said HyDra, 2023 Call of Duty World Champion, 100 Thieves. "The TMR thumbsticks are laser-precise, and the customization lets me fine-tune every input to match my playstyle. It gives me the speed, control, and confidence to stay locked in and clutch up."

BOOX, a global leader in E Ink technology and innovation, has announced the launch of two new additions to its product lineup: the Note Air5 C, a 10.3-inch color ePaper tablet designed for light productivity and creativity, and the Palma 2 Pro, a 6.13-inch color mobile ePaper device that brings true portability and connectivity to digital reading and note-taking.

BOOX Note Air5 C: Light Productivity Meets Premium Design
Building on the success of the Note Air4 C, the new Note Air5 C introduces seamless keyboard connectivity, Android 15, and the upgraded Pen3 stylus. Designed for professionals, students, and creatives alike, the Note Air5 C combines power and flexibility in a thin, elegant frame.

TP-Link Systems Inc., a leading global provider of consumer and business networking products, today announced the launch of the Archer GE400 Dual-Band Wi-Fi 7 Gaming Router. Expanding on the success of the flagship Archer GE800 and mid-tier Archer GE650, the GE400 delivers next-generation Wi-Fi 7 gaming features at an accessible $219.99, making it the perfect entry point into TP-Link's gaming router lineup.

As the first-to-market brand in Wi-Fi 7, TP-Link is committed to making the benefits of this new standard available to gamers at every level. The Archer GE400 is the most affordable way to experience the speed, low latency and stability of Wi-Fi 7 gaming, delivering the features serious players need without the premium price tag.

IBM today announced third-quarter 2025 earnings results.

"This quarter we accelerated performance across all of our segments, and again exceeded expectations for revenue, profit and free cash flow. Clients globally continue to leverage our technology and domain expertise to drive productivity in their operations and deliver real business value with AI. Our AI book of business now stands at more than $9.5 billion," said Arvind Krishna, IBM chairman, president and chief executive officer. "Given the strength of our business, we are raising our full-year outlook for revenue growth and free cash flow."

When it comes to gaming, speed is everything. The new YUNZII RT75 PRO redefines this standard—now equipped with Dual 8K polling rate in both wired and 2.4G modes. Designed for magnetic switch enthusiasts, this next-generation keyboard merges artistic aesthetics and pro-level gaming performance in stunning black and pink colorways. Let's dive into what makes the RT75 PRO a true game-changer.

Gaming Keyboard with Hall Effect Magnetic Switches
The YUNZII RT75 PRO delivers an 8K polling rate in both wired and 2.4G modes, achieving 0.1 ms wired and 1 ms wireless response for lightning-fast precision. Built with Hall Effect magnetic switches, this triple-mode keyboard (USB-C, 2.4G, Bluetooth) ensures unmatched responsiveness and reliability for competitive gaming.

NextSilicon, a startup company founded in 2017 has detailed its Maverick-2 Intelligent Compute Accelerator (ICA), claiming it outperforms NVIDIA's HGX B200 GPU and Intel's Sapphire Rapids CPUs in high-performance computing and AI workloads. Built on TSMC's 5 nm node, Maverick-2 is available as a single-die PCIe card with 96 GB of HBM3e (300 W) or a dual-die OAM version with 192 GB of HBM3e (600 W). According to internal benchmarks, Maverick-2 delivers up to 4× higher FP64 performance-per-watt than the HGX B200 and over 20× higher efficiency than Intel's Xeon Sapphire Rapids. In GUPS benchmarks, it reached 32.6 GUPS at 460 W, reportedly 22× faster than CPUs and 6× faster than GPUs. In HPCG workloads it achieved 600 GFLOPS at 750 W, while consuming roughly half the power of competing solutions. The company attributes these gains to a data-flow based architecture that shifts overhead management from hardware to adaptive software, allowing most silicon area to be used for computation rather than control logic.

Alongside Maverick-2, NextSilicon announced Arbel, a RISC-V-based enterprise-grade chip also built on TSMC's 5 nm process. The company claims Arbel already surpasses current RISC-V designs as well as Intel Lion Cove and AMD Zen 5 cores. Arbel features a 10-wide instruction pipeline with a 480-entry reorder buffer for high core utilization, running at 2.5 GHz. The chip can execute up to 16 scalar instructions in parallel and includes four 128-bit vector units for data-parallel workloads. A 64 KB L1 cache and large shared L3 cache ensure high memory throughput and low latency to reduce bottlenecks in compute-intensive applications. No release date or full benchmarks were disclosed, but NextSilicon says Arbel represents a move toward a fully open, software-adaptive silicon platform for future HPC and AI systems.

A new generation of SK hynix DDR5 memory chips has surfaced online, reportedly marking the debut of second-generation 3 GB A-die ICs. First shown by Team Group's Kevin Wu on Facebook, the chip carries the X021 marking and "AKBD" part code. According to leaker @unikoshardware, the X021 label identifies it as the successor to the 3 GB M-die used in early DDR5 modules. Based on SK hynix's internal binning scheme, the "KB" designation in AKBD likely corresponds to a native 7200 MT/s JEDEC speed following the company's established progression from "EB" (4800 MT/s) through "HB" (6400 MT/s). This new bin suggests SK hynix is preparing faster DDR5 ICs aimed at next-generation Intel platforms, with Panther Lake and Arrow Lake Refresh expected to support up to DDR5-7200.

The sample shown reportedly uses an 8-layer PCB, which could limit headroom for extreme overclocking beyond 8000 MT/s. To fully exploit the new A-die's potential, manufacturers are expected to move to 10 or 12-layer PCBs for greater signal integrity. While SK hynix has yet to officially unveil the part, this early appearance of the 3 GB A-die AKBD hints that production may already be underway. To add some background, Samsung was reigning supreme in the DDR4 days with high-end memory modules pretty much always having Samsung's hand-picked B-die chips. However, things have changed in the DDR5 world with SK hynix taking the lead with its A-die and M-die chips grabbing all the attention.

TCL China Star Optoelectronics Technology (TCL CSOT), a global leader in advanced display technologies and a subsidiary of TCL Technology, today announced the commencement of construction of the world's first 8.6-generation Inkjet Printing OLED (IJP OLED) production line in Guangzhou, China. The new project, referred to as "t8", which officially broke ground on October 21, will have a designed monthly capacity of 22.5 thousand sheets (based on 2290 mm x 2620 mm substrate size), focusing on high-end displays for tablets, laptops, and monitors, with a total investment estimated to reach over approximately USD 4 billion.

"Our t8 production line marks a breakthrough for the global display industry, showcasing technological capabilities and market potential in the high-generation AMOLED sector," said Jun Zhao, Senior Vice President of TCL Technology and CEO of TCL CSOT. "By bringing together the entire value chain, from foundational materials to final product assembly, we are building a fully integrated, end-to-end industrial cluster designed to compete on a global scale."

beyerdynamic introduces a new DJ headphone, available in two versions. While the DJ 300 PRO X embodies a clean, focused aesthetic, the stylish CLUB edition stands out with a bold, distinctive design. Both models can be used as on-ear and over-ear headphones, giving DJs full freedom when producing and performing. The ear cups of both versions can also be customized with unique designs via the beyerdynamic online configurator. The DJ 300 PRO X and DJ 300 PRO X CLUB will make their public debut at the Amsterdam Dance Event (ADE).

Seamless transition between on-ear and over-ear
The new DJ headphones from beyerdynamic represent flexibility and individual expression like no other. Thanks to their unique 2-in-1 system, the modular design can be transformed from on-ear to over-ear headphones in just a few simple steps. Users simply swap the included ear pads for either configuration. No matter which option they choose, the ear pads ensure long-lasting comfort in every situation.

Advantech is proud to announce the release of the DPX S460, the newest member of its S-series gaming platform family. Powered by AMD's Ryzen Embedded 8000 Series APUs, the DPX S460 combines cutting-edge Zen 4 architecture, RDNA 3 graphics, and integrated AI acceleration, making it a game-changer in regulated gaming markets.

"The DPX S460 exemplifies our dedication to leveraging advanced technologies to create powerful and flexible gaming solutions," said Craig Stapleton, Product Director for Advantech. "With AMD's 8000 Series chipset, we're delivering a platform that meets the most demanding requirements of the gaming industry."

Intel Arrow Lake refresh is getting closer with new details starting to appear, and this time is about a CPU reportedly named Core Ultra 7 270K Plus. According to a recent Geekbench 6 entry, the processor features 8 P-cores and 16 E-cores, which aligns it more closely with the current Core Ultra 9 285K rather than the 20-core (8P+12E) Ultra 7 265K it was rumored. The benchmark lists a 3.7 GHz base clock and 5.5 GHz boost, matching the 265K, and shows the chip paired with an RTX 5090D GPU, hinting that it was tested on a new Lenovo desktop system in China. Performance results came in at 3215 points (single-core) and 22,720 points (multicore), essentially on par with the Ultra 9 285K.

While Intel hasn't confirmed any of this information, the leak also suggests potential official memory support up to 7200 MT/s, possibly part of a broader Arrow Lake refresh expected in Q1 2026. Other rumored models include a Core Ultra 9 290K Plus (24 cores) and Core Ultra 5 250K (14 cores). Intel is unlikely to change core configurations dramatically but may introduce new SKU names and tuned frequencies to align with the refreshed lineup. However, we still don't know for sure Intel's complete plan for Arrow Lake Refresh. For now, all we can hope for is something like Intel's Application Performance Optimizations (APO) applied out of the box for Arrow Lake Refresh. The current APO stack targets modern Intel Core desktop and mobile processors with six or more performance cores. It requires BIOS enablement of Intel Dynamic Tuning Technology and Windows 11. Advanced Mode unlocks wider compatibility for other 12th-generation and newer processors when Intel DTT version 11405 or later is present. Intel cautioned that real-world responsiveness may vary based on system configuration and graphics hardware. Additionally, Intel's promise back in August was to deliver more APO tuning. The latest update introduces 15 new titles, which can yield up to a 14% FPS increase, and as much as a 21% increase in 1% lows.

PFU America, Inc., the primary authorized distributor of the award-winning Happy Hacking Keyboard (HHKB) in the United States, today announced the launch of HHKB Professional Classic Type-S—a high-performance, cost-effective, wired, compact keyboard that preserves HHKB's original minimalist design and simple configuration while featuring the Type-S key structure HHKB enthusiasts have come to know and love.

Making its public debut in 1996, the HHKB design embraces a unique 60% HHKB key layout that prioritizes simplicity and efficiency. The HHKB Professional Classic Type-S—available with stamped legends in charcoal, white, and snow—offers the next evolution in original minimalist design, while integrating key technological advances based upon customer feedback.

In a world where gaming rigs and creator workstations are getting louder as they get faster, silence has become a luxury. SAMA's new L70 AIO liquid cooler, launching globally, is designed to change that. Delivering powerful thermal performance with noise levels as low as 28 dBA, the L70 gives builders the freedom to push high-performance CPUs and overclocked systems without filling their environment with fan noise.

Designed to be seen and not heard
At the heart of the L70 is SAMA's in-house engineered pump, a custom ceramic design built for long-term reliability and optimized acoustics. Unlike generic OEM pump solutions, the L70's pump is tuned specifically for SAMA's radiator and fan system, ensuring smoother liquid flow, lower vibrations, and extended durability.

Lenovo unveiled its new generation of ThinkCentre desktop next-gen AI PCs powered by AMD Ryzen AI 300 Series processors with up to 50 TOPS of integrated NPU capability: the streamlined ThinkCentre neo 55a Gen 6 all-in-one (AIO), the small form factor ThinkCentre neo 55s Gen 6, and the tiny ThinkCentre neo 55q Gen 6. Designed for small and medium-sized businesses looking to supercharge their productivity with AI, the ThinkCentre neo Gen 6 desktop family offers unique Copilot+ PC experiences, the performance to excel, the flexibility and expandability to adapt, and the efficiency and support for peace of mind.

"AI has, is, and will continue to reshape the way we interact with technology - with 90 percent of organizations planning or exploring AI-powered PC rollouts this year," said Sanjeev Menon, vice president and general manager, Worldwide Desktop Business in Intelligent Devices Group, Lenovo. "Lenovo is helping businesses of all sizes become smarter, more efficient and even more productive through our extensive AI portfolio. The new Lenovo ThinkCentre neo 55 Gen 6 family of desktop AI PCs offer a unique selection that adapts to individual business needs with personalized AI experiences, stable performance, scalability and data security."

Crucial, a brand of Micron Technology, Inc., is deepening its commitment to gamers with the debut of Crucial DDR5 Pro Overclocking (OC) 6400 CL32 Gaming DRAM. Engineered for tech enthusiasts and offered in 32 GB kits or 16 GB single modules, this new memory delivers faster speeds, lower latency and a bold new design that looks as good as it performs. This launch cements Crucial's commitment to PC gamers with new 10-nanosecond/CL32-class latency and delivers on feedback related to aesthetics, now with a new elevated heat spreader design.

"Today's AAA games are more immersive, fast paced and demanding than ever. They push systems to their limits with real-time action, intense multitasking and ultra-high frame rates," said Dinesh Bahal, corporate vice president and general manager of Micron's Commercial Products Group. "Gamers need memory that can keep up. Crucial DDR5 Pro OC 6400 CL32 is designed for those who want to win on both performance and style. It helps players load games faster, react instantly and stay ahead of the competition. It's fast, reliable and looks incredible inside your rig."

[Editor's note: Our in-depth Crucial Pro OC DDR5-6400 32 GB CL32 Review is now live]

Sharp Imaging and Information Company of America (SIICA), a division of Sharp Electronics Corporation (SEC), today refreshed its professional projector portfolio with the A series models XP-A824U, XP-A104U, XP-A155U, XP-A175U, and the V series models XP-V731U and XP-V801U. Designed with WUXGA native resolution and 4K input support, these laser projectors deliver exceptional brightness to overcome ambient light and help ensure clear, vivid images in well-lit spaces. With flexible installation options, including optional long and short-throw lenses, they adapt easily to diverse environments from classrooms to corporate venues.

A Series: Extreme Brightness and Dust-Free Reliability
The XP-A824U (8,200 lumens), XP-A104U (10,000 lumens), XP-A155U (15,000 lumens), and XP-A175U (17,000 lumens) deliver uncompromising image quality through Sharp's proprietary high-performance video processing and scaling chip, paired with a dual blue laser system. Unique to the A Series is its IP5X-rated Sealed LCD cooling system, which prevents dust from entering the optical path - ensuring consistent brightness, pristine image clarity, and virtually maintenance-free operation without filters.

Corsair is thrilled to announce the launch of the groundbreaking AIR 5400 triple-chamber mid-tower case. This unique and innovative PC chassis separates the hottest components from each other with isolated cooling zones that reduce heat and fan noise and enhance performance. With dual airflow ducts in the main chamber, a wraparound glass exterior with swing-open doors, pre-installed reverse-rotor RGB fans, and a wide-open CPU chamber exhaust, the AIR 5400 delivers class-leading thermal performance and innovation. Just as Corsair brought dual-chamber cases into the mainstream in 2013 with the original AIR 540, it is poised to once again disrupt the status-quo of the PC case market with an even more functionally elegant solution.

Unique Triple-Chamber Design
Winner of multiple "Best of Computex" awards when the prototype was revealed in May 2025, the AIR 5400 sets new standards for visuals and cooling performance in ATX mid-tower cases. Its triple-chamber layout transcends the case design mold by introducing a third chamber made for a 360 mm all-in-one (AIO) CPU liquid cooler (sold separately). Most single- and dual-chamber cases require mounting an AIO in the top of the case, which provides the CPU cooler with air warmed by the GPU, which can result in less efficient CPU cooling.

Axelera AI, the leading provider of purpose-built AI hardware acceleration technology, today announced Europa, an AI processor unit (AIPU) that sets a new performance/price standard for multi-user generative AI and computer vision applications. Europa's combination of processing power, energy and thermal efficiency, compact packaging, and multiple form factor options make it ideal for compute-intensive, multi-modal AI inference applications from the edge to enterprise servers. Designed to be cost-effective and accessible, Europa enables any organization to unlock the power of cutting-edge AI applications.

Next Gen Architecture For Real World AI Processing Power
The Europa AIPU features eight second-generation AI cores, each incorporating Axelera's advanced Digital In-Memory Compute (D‑IMC) technology and large vector engines, delivering up to 629 TOPS at INT8 precision. Complementing the AI cores are two clusters of eight dedicated RISC‑V vector processing cores for non-AI pre- and post-processing, achieving a peak performance of 4915 GOPS. An integrated H.264/H.265 decoder further offloads media tasks, enabling customers to reserve the host CPU entirely for business logic and application-level workloads. These cores, programmable through the Voyager SDK, will provide better total cost of ownership than having to offload to other hardware.

How do you make a great desktop into a fantastic desktop? Easy—chip away at the rough bits, polish the good stuff, and add awesomeness. After 29 years of development, KDE's got the foundation nailed down. Plasma 6.5 is all about fine-tuning, fresh features, and a making everything smooth and sleek for everyone. Ready to see what's new? Let's dive into Plasma 6.5!

New Features
Plasma 6.5 includes a number of highly-requested features:
First up: rounded bottom window corners! Breeze-themed windows will now have the same level of roundness in all four corners. If you don't like this, you can un-round them, too.

D-Link, one of the global leaders in networking and connectivity solutions, proudly announces the launch of the DGS-1530 Series Gigabit Stackable Smart Managed Switches purpose-built to address the growing demands of digital transformation, cloud workloads, and increasingly complex enterprise networks. As organizations face rising challenges of bandwidth-hungry applications, stronger security requirements, and modern cyber threats, along with the need for efficient operations, D-Link delivers innovative, solution-oriented, and future-ready infrastructure that safeguards against vulnerabilities and empowers IT teams to scale with confidence. This new portfolio reflects D-Link's commitment to creative innovation, one-stop service, and sustainable design, helping enterprises accelerate digitalization while building resilient networks for the intelligent era.

Available in models ranging from 8 to 48 Gigabit ports, the DGS-1530 Series Gigabit port and 10G uplink connectivity, for seamless performance for bandwidth-heavy applications such as cloud computing, video conferencing, 4K/8K streaming, and large-scale data transfers. This versatility makes it an ideal choice for enterprises and SMBs seeking to balance scalability with high-performance networking at a competitive total cost of ownership.

ASUS today announced the Call of Duty: Black Ops 7 Special Edition of the TUF Gaming Radeon RX 9070 XT graphics card, created in collaboration with AMD and Call of Duty. This unique graphics card features the Call of Duty: Black Ops 7 insignia with orange accents in signature Black Ops style. First displayed at the Call of Duty NEXT press event in Las Vegas on September 30, this limited-edition card will be sold at select retailers around the world and bundled with a digital copy of the standard PC version of the game.

TUF Gaming Radeon RX 9070 XT cards feature the latest RDNA 4 architecture from AMD, 16 GB of VRAM, and AMD Software with the new ML-Powered AMD FSR 4 Upscaling Technology. This card offers next-level immersion with the latest AI-powered features from AMD, and improved gaming experiences with faster ray tracing. In addition, AMD Software can upgrade select FidelityFX Super Resolution 3.12 games to the latest ML-powered model, delivering an incredible balance of detailed imagery and fluid frame rates to over 85+ games. Plus, DisplayPort 2.1 outputs give users massive bandwidth for going big on resolution while supporting high-end refresh rate.