Normal view

Yesterday — 28 October 2025Main stream

NVIDIA Shows Next-Gen Vera Rubin Superchip For The First Time, Two Massive GPUs Primed For Production Next Year

28 October 2025 at 21:30

NVIDIA circuit board displayed on stage shows TWW 2538 on chips.

NVIDIA has shown off its next-gen Vera Rubin Superchip for the first time at GTC in Washington, primed to spark the next wave of AI. NVIDIA Has Received Its First Rubin GPUs In The Labs, Ready For Vera Rubin Superchip Mass Production Next Year, Around The Same Time or Earlier At GTC October 2025, NVIDIA's CEO Jensen Huang showcased the next-gen Vera Rubin Superchip. This is the first time that we are seeing an actual sample of the motherboard, or Superchip as NVIDIA loves to call it, featuring the Vera CPU and two massive Rubin GPUs. The motherboard also hosts […]

Read full article at https://wccftech.com/nvidia-shows-next-gen-vera-rubin-superchip-two-massive-gpus-production-next-year/

Before yesterdayMain stream

NVIDIA’s AI GPU Performance Can Be Increased To Bring Payback To The Order Of “Single Digit Months,” Says Phononic Chief Product Officer

27 October 2025 at 20:50

Unbranded microchip balanced on fingertip.

After NVIDIA launched its Rubin AI GPUs last month, we decided to interview Larry Yang, the chief product officer at Phononic. We were wondering about the new chips' cooling requirements given that energy constraints are closely related to AI rollout. Larry is an industry veteran with more than 30 years of experience under his belt. He has previously worked at Google, IBM, Microsoft and Cisco. Our conversation revolved around the cooling requirements for NVIDIA's and other AI chips. It also covered AI ASICs, commonly known as custom AI processors. Larry outlined that high bandwidth memory (HBM) chips are one reason […]

Read full article at https://wccftech.com/nvidias-ai-gpu-performance-can-be-increased-to-bring-payback-to-the-order-of-single-digit-months-says-phononic-chief-product-officer/

❌
❌