Apple is widely believed to have adopted TSMC's SoIC packaging for its upcoming M5 Pro and M5 Max chips, bringing with it an unprecedented level of silicon-related flexibility and granularity. Now, Apple's new Mac configurator is giving tantalizing confirmatory signals as to this eventuality. The new Apple Mac configurator brings flexibility and granularity to the front We noted recently that, as per leaked anecdotes, Apple appears to be opting for TSMC's SoIC-MH packaging technology for its upcoming M5 Pro and M5 Max chips. For the benefit of those who might not be aware, the SoIC is a 3D packaging solution that […]

Read full article at https://wccftech.com/apples-new-packaging-tech-for-m5-pro-and-m5-max-chips-hinted-within-the-revamped-mac-configurator/