Microsoft's Project Silica now explores two different methods to store data on glass medium, but neither is close enough for commercialization.

Despite broad industry support, UALink's adoption may be slowed by the absence of several features like In-Network Collectives and the 128G PHY spec.

After 10 years and hundreds of billions of investments, China's semiconductor supply chain is still decades behind chip supply chain in America and Taiwan.

AMD's Helios rack-scale solution based on the MI455X accelerators, the company's major hope for AI market, may slip to 2027, whereas Nvidia may speed up roll out of the Vera Rubin platform if the latest market rumors are to be believed.

TSMC, other companies to invest $250 billion in the U.S. as part of trade deal, TSMC reportedly mulls additional $100 billion investment and four more fab modules.