A few days ago, we reported that AMD is seemingly ending driver support for its Ryzen Z1 Extreme SoC, just two and a half years after its launch. Since Lenovo issued product guidance that the company will no longer provide updates, and ASUS's own ROG Ally handheld console had not received an update in over six months, the situation was dire. However, ASUS today released a new driver update for its ROG Ally handheld console, which had been stuck with six-month-old SoC drivers from August 2025. This changes the situation from the platform being completely abandoned for half a year to a periodic update window that will likely continue unless gamers encounter a surprise change.

Initially, we couldn't determine the "blame" for this irregular driver update cycle, as it could have been either AMD or OEMs being slow with the driver updates. As AMD offers configurable TDP (cTDP) for the Z1 Extreme with values ranging from 9 to 30 W, this means that OEMs can get SoCs in various configurations, each needing to be tested and verified before distributing an official driver. To add more to the mess, Lenovo Korea has confirmed that their own driver update plan for the product has stopped, leaving users to switch to other platforms or use Linux-based operating systems that carry their own drivers for these platforms to extract maximum longevity. Hence, the entire situation is now more complicated.

Samsung is officially ending the production of its 2D NAND flash storage this year, and the company will be repurposing its old production lines to better fit the AI-driven demand. According to The Elec Korea, Samsung plans to officially stop 2D NAND production at its Hwaseong site, with Line 12 being the one carrying this aging technology. Instead of completely abandoning this facility, which houses plenty of chip-making tools, Samsung will repurpose them for DRAM metallization, which is the process of applying actual pathways within the DRAM itself to connect memory cells. Interestingly, the Hwaseong Line 12 holds a monthly wafer production capacity of 80,000 to 100,000 12-inch wafers. This is a significant number of wafers, which are now only used for 2D NAND Flash, a technology that is no longer needed in the wake of 3D NAND Flash technology.

Continuing the Line 12 legacy will be Samsung's 6th-generation 10 nm-class 1c DRAM, a technology used for HBM4, and Samsung expects the total wafer capacity for 1c DRAM to reach about 200,000 wafers per month in the second half of the year. Adapting the old 2D NAND Flash production site will definitely help, and Samsung will run this production along with Pyeongtaek Line 3 and Line 4.

The popular hardware diagnostics utility HWiNFO launched its latest v8.42 version on February 24th. Interestingly, one of the main features of this release is the improved support for Intel "Nova Lake" processors, despite this CPU generation being months away from commercial launch. This means that the tool can now distinguish between different Intel processors and even run diagnostics on engineering samples of "Nova Lake-S," despite the processor not being commercially available for another few quarters. It is possible that the utility is now raising a flag when detecting "Nova Lake," which has its own unique processor ID, and this could be found in some early compiler patches for GCC and LLVM that are enabling these processors before launch. With the launch of v8.42, the tool also gains NPU stress testing, but only in the Pro version.Below is the complete changelog.

Apple is preparing a massive refresh cycle for its 2026 MacBook Pro laptops, with the major redesign being at the very center of the laptop. According to Bloomberg's Mark Gurman, one of the most reliable sources of Apple news, the company is preparing to implement its Dynamic Island feature on its MacBook Pro 14 and MacBook Pro 16 versions, both of which will carry the new feature. Alongside Dynamic Island, which is replacing the traditional notch we have on MacBooks today, Apple is also implementing OLED display technology that will replace the current Mini LED display found on the current generation of MacBooks.

For the Dynamic Island, Apple will bring over much of the functionality from its iPhone models, which includes status updates and a front camera cutout, but in a different shape. As the iPhone uses the Dynamic Island to host Face ID sensors, the MacBook Pro version should only include a camera sensor cutout with software support from the OS. However, the most interesting part of the announcement should be the touchscreen ability with OLED panels. Apple is reportedly optimizing its new operating system to unlock new gestures for touch, where each touch will invoke a new panel or a new interface. This design will reportedly not be similar to the iPad, but just another sensory aid to the current input method with a keyboard and a mouse.

NVIDIA has posted multiple job openings, which give us several hints about the company's plans for gaming on Linux and what the possible plan could look like. According to the now-removed listing, NVIDIA is hiring engineers to diagnose CPU and GPU performance bottlenecks on Linux when running the Proton compatibility layer and Vulkan graphics API. This suggests that NVIDIA is either refining its product support for the massive wave of gamers transitioning to Linux or preparing for an entirely new platform. For example, as NVIDIA is currently preparing N1/N1X SoCs for laptops, the company could create dedicated handheld chips for devices like Valve's Steam Deck, which currently runs on AMD's SoC. There are multiple handheld vendors now, and NVIDIA could be powering a new handheld with its laptop N1/N1X chips under Linux.

The job descriptions clearly indicate that the work will cover everything from the game engine and translation layers, such as Proton, to drivers and hardware interaction. This focus suggests that efforts will not be limited to profiling but will also include proposing API usage changes, building repeatable test cases, and collaborating with translation-layer and distribution maintainers to implement fixes. Anyone using NVIDIA graphics under Linux will also be impacted, as the company's polishing of the software stack will bring a definitive quality of life improvement to games. This can include fewer stutters, better frame pacing, and reduced CPU overhead in titles that rely on Vulkan or run under Proton, which translates Windows-specific API calls and optimizes games to run on Linux.

Retail DDR5 prices in Germany have finally shown a small sign of cooling down after the steep climb in the past months. The decline is small and not yet uniform across models, but it is the first sustained easing many DIY PC enthusiasts and small shops have noticed since prices began to spike in late 2025 and reached astronomical levels recently. A widely shared community chart tracking an average 32 GB DDR5 kit across the European Union captured the climb from autumn into early February and then a late-period dip. That chart is useful as a broad signal, but it leaves open important details such as the exact kit measured, which countries were included, and whether listed prices include taxes.

To add more context, independent checks of historical listings on Amazon Germany using CamelCamelCamel show that several mainstream 32 GB DDR5 kits have dropped from their highs. Two of the larger declines were visible on popular models from Corsair and Kingston, while other brands recorded smaller pullbacks. There are a few likely reasons for the softening. Buyers may be pausing upgrades after a period of rapid price increases. Some retailers could be cutting prices to move stock and reduce inventory risk. It is also possible that a small amount of additional supply has filtered through the distribution chain, away from the AI supply chain. However, any of these explanations still need more substance. For a complete return to normal pricing, we will probably need to see clearer improvements in production capacity or a sustained drop in demand, and this improvement could only be a short term correction.

Samsung Foundry has struck gold as its utilization rate has jumped to an impressive 80% this quarter. This comes after many years of struggling to achieve a good utilization rate, while competitors like TSMC have consistently led the adoption of newer nodes and gained a massive customer base. However, the situation has now changed, and Samsung's foundries are now operating at about 80% of total capacity, consistently producing silicon, with the Pyeongtaek Campus P2 and P3 leading the charge. Previously, these lines were only achieving a 50% booking rate last year and even struggled with insufficient production volume in the second half of 2024. Samsung uses these sites to manufacture 4 nm, 5 nm, and 7 nm nodes, which are now considered "mature," as the leading edge shifts to sub-3 nm production.

Part of the foundry revival is attributed to the strong demand for its 6th-generation HBM, coming in the form of HBM4 with a custom base die manufactured on the 4 nm node. While competitors are making HBM4 base dies on older nodes, Samsung is using a 4 nm custom base die that provides higher design density for any logic that ASIC makers want to implement. This can include some data processing that will aid the main accelerator in AI workloads. This has translated into high demand for Samsung Foundry products from external customers, who are now keeping production at high capacity.

According to the latest job listings, we learn that Intel is planning the return of a unified core architecture, something we haven't been accustomed to in the last few years. Starting with the 12th Generation "Alder Lake" processors, Intel began selling hybrid core processors that combine "Golden Cove" performance cores and "Gracemont" efficient cores. These became commonly known as P and E-Cores, which are now being used across Intel products in hybrid designs or P/E-core-only Xeon processors, of course, with the latest designs and iterations. However, as the new job listings suggest, Intel is assembling a team of engineers for its "Unified Core" design group that will deliver the new microarchitecture to power the next generation of processors.

Separating the core design into P-Cores and E-Cores has yielded Intel the desired results that the company hoped for. This includes product separation and many goals across platforms. For example, in the consumer sector, E-Cores run a lot of side and background tasks in the operating system, while P-Cores power main applications like games. To extract maximum performance, Intel has a dedicated Thread Director that makes the entire process work and dictates just what application goes to which core, in tandem with the operating system. Intel also provides P-Core-only and E-Core-only Xeon server processors that serve either performance sectors like HPC and AI or the cloud sector that needs many cores with somewhat lower performance, but in a dense 100-core+ package.

AMD has reportedly stopped driver updates for its Ryzen Z1 Extreme APU solution for handheld consoles, according to the latest Lenovo Korea update. This means that only after 2 and a half years, AMD is pulling support for its SoC, leaving many enthusiasts in a difficult spot. Confirmation from multiple sources are piling up as Reddit users and customers of other handheld consoles are stating that support for their specific devices, based on the Ryzen Z1 Extreme SoC, are also stuck using drivers that are several months old. For example, a user has commented that his ASUS ROG Ally non-X version based on the Ryzen Z1 Extreme SoC has been stuck with six-month-old SoC drivers from August 2025. This means that AMD has effectively placed the Ryzen Z1 and Ryzen Z1 Extreme chips into a periodic update window, with no latest driver support coming to this 2023 SoC.

However, the situation is quite complex. OEMs like Lenovo and ASUS receive drivers from AMD and test them for their specific configurations. AMD offers configurable TDP (cTDP) for the Z1 Extreme with values ranging from 9 to 30 W. This means that OEMs can get a SoC with reduced clocks and power settings to match their desired handheld designs, or simply run the most aggressive 30 W configuration that will sacrifice some battery life but deliver overall higher CPU and GPU clocks. Hence, drivers must be tested to ensure they work properly on the specific TDP configuration by the OEM before they are installed by the user. Finding the "blame" is proving to be difficult, as it could be that AMD is not bothering with new updates, or OEMs are not eager to test their specific configurations.

In a new letter to channel partners, Lenovo has stated that the company expects PC price hikes in March amid the memory crunch affecting the industry. The letter, obtained by CRN, notes that Lenovo's North America channel chief, Wade McFarland, mentioned there will be some pricing changes to certain products and configurations that Lenovo offers, which will be communicated later with the exact specification changes. In the letter, Wade McFarland noted that there have been some changes to the ordering policy for the Intelligent Devices Group (IDG), responsible for PCs like desktops, notebooks, and tablets, while the Infrastructure Solutions Group (ISG) unit responsible for server solutions is also experiencing the same changes. Lenovo's North American president, Ryan McCurdy, noted that "we've absolutely had to adjust and continue to adjust [pricing]. There's no way around it."

However, the company has advised its partners to submit orders while it is still February, as that will lock in the pricing at which Lenovo can supply PCs before the price hike expected in March. "Pricing is influenced by both order timing and fulfillment timing, and Lenovo reviews pricing periodically in response to evolving market conditions," notes Wade McFarland, adding that Lenovo's memory suppliers have been good and that the company has been informed of every pricing change in advance so that it can effectively communicate with its clients and warn them before any changes happen. That way, clients don't experience pricing shocks that may impact their purchasing decisions, as Lenovo sells millions of PCs every month. A slight, unexpected price change may result in a significant change in purchasing decisions, so communication with clients is key.

The name synonymous with Xbox—Phil Spencer—is leaving Microsoft after nearly 40 years at the company. He started as an intern back in 1988 and has been with the Xbox team since 2001, helping the project thrive in the following decades. According to the announcement, Microsoft is overhauling its Gaming division with some new names, while the old executive team has left the company. In addition to Phil Spencer, Xbox president Sarah Bond has also left the company. From now on, Asha Sharma, who currently serves as the company chief for the CoreAI product, will be taking on the new role as the CEO of Microsoft Gaming. Microsoft's CEO Satya Nadella shared a memo with all Microsoft employees about the status of this update.

Satya NadellaLast year, Phil Spencer made the decision to retire from the company, and since then we've been talking about succession planning. I want to thank Phil for his extraordinary leadership and partnership. Over 38 years at Microsoft, including 12 years leading Gaming, Phil helped transform what we do and how we do it.

Thanks to a new table specification matrix published by a known leaker Jaykihn on X, we are seeing the final specifications of Intel's long-rumored "Bartlett Lake-S" Core 200E family of CPUs with P-Cores only. This platform is designed to fit inside Intel's LGA-1700 socket, but from a consumer standpoint represents a non-existent product that will not reach their hands, as Intel has abandoned the plan to launch this highly anticipated gamer CPU. Instead, Intel will only offer it for its edge and embedded products. At the top of the stack is the Core 9 273 PQE SKU, which is a 12 P-Core variant with 24 threads and a base frequency of 3.4 GHz. This model can boost all of its 12 cores to 5.3 GHz, while a single thread can go up to 5.9 GHz independently for tasks that require intensive single-threaded performance. It is equipped with 36 MB of L3 cache and an integrated GPU with 32 EUs of Xe-LP graphics.

Interestingly, the entire lineup is separated into three categories. One is a high-TDP PQE with a base power of 125 W, while the middle PE models are 65 W designs with lower clocks. The weakest models are the PTE SKUs that have a TDP of 45 W, which are more ideal for edge deployments where power/efficiency is the most important factor. Across the lineup, there are versions with 8, 10, and 12 cores, all with Hyper-Threading for 16, 20, and 24 threads. Some SKUs from the PE and PTE lineups do not enjoy Intel vPro and ECC memory support, while the PQE high-power SKUs are all equipped with vPro and ECC memory support. You can check out the complete table comparison and product segmentation below for more specific information on different models.

VideoCardz first spotted that AMD set a new GPU overclocking world record with its Radeon RX 9060 XT graphics card running at an amazing 4,769 MHz using liquid nitrogen as the coolant. This record was set in tandem with the world-renowned overclocker "Splave" from the United States, who already held the previous world record with an NVIDIA GeForce RTX 4090 running at 4,020 MHz. This time, using RDNA 4 silicon, "Splave" made the GPU maintain stability at a 4,769 MHz core clock. While no official HWBot submissions have been made, AMD posted a video on its AMD Gaming YouTube channel where the company showcased the amazing achievement. We are left to wonder why AMD didn't promote this record, which is a very impressive achievement for its RDNA 4 silicon. In a brief frame, "Splave" was seen running a custom tool to fine-tune the GPU. AMDships this GPU with a base clock of 1,700 MHz, a game clock of 2,530 MHz, and a maximum boost clock of 3,130 MHz, meaning that the new world record pushed the GPU boost by an additional 50%.

AMD's next-generation desktop Ryzen 10000 series "Olympic Ridge" processor platform will supposedly come in various SKU flavors ranging from 6 to 24 cores, in some very specific configurations based on the CCD structure. The first in the lineup are single-CCD SKUs, which include 6, 8, 10, and 12 "Zen 6" cores. With the "Zen 6" generation, AMD is boosting its CCD core count with up to 12 instances, whereas the previous-generation CCDs maxed out at 8 cores. However, for versions with two CCDs, the core count increases, starting at 12 cores, continuing with 16 and 20-core models, and topping off with the flagship 24-core dual CCD SKU. AMD is able to pack more cores per CCD due to the new manufacturing technology, which is TSMC's N2 2 nm node, providing better transistor density compared to the older nodes used in previous generations.

The upcoming Ryzen 10000 series is expected to land on AMD's AM5 socket, extending the socket life for another processor generation and confirming AMD's long-term socket selection. For other specific information, AMD plans to implement up to 4 MB of L3 cache per core for a total of 48 MB of L3 cache per CCD, and a total of 96 MB of L3 cache for the fully-fledged 24-core SKU. This is, of course, before adding any 3D V-Cache enhancements that AMD is known for when it comes to boosting gaming performance. AMD is able to pack this much punch because TSMC's N2 2 nm technology packs more than 200 million transistors per mm², depending on the configuration and whether AMD chooses the high-density or high-performance variant.

In the latest Linux kernel v7.0, freeing up system memory used for caching large files has received a noticeable performance boost. According to notes on the kernel mailing list, a new set of patches queued for the Linux 7.0 merge window showed reclaim speed improvements of up to 75% in testing. In one benchmark, developers allocated 10 GB of file-backed data in memory and then reclaimed 8 GB of it. On a 32-core Arm64 server, the reclaim process completed about 75% faster compared to the older Linux implementation, while on an x86 machine, the improvement was reported at over 50%.

Imagine your system running a large database or another memory-intensive workload. Instead of constantly reading from storage, the kernel can keep tens or even hundreds of gigabytes of frequently accessed file data in RAM for much faster access. When memory pressure builds and part of that cached data must be freed, the cleanup process now completes significantly faster. This is not going to be noticeable to consumers, but hyperscalers, HPC simulations, AI runs, and other workloads that involve heavy data processing will now see a significant performance boost. The improvement comes from work authored by Baolin Wang of Alibaba, who optimized how the kernel handles large blocks of cached file memory.

AMD's next-generation Ryzen 500 series of APUs, which include the "Medusa Point" and "Medusa Halo" SoCs, are slowly taking shape, and we are learning more about the integrated graphics of "Medusa Point." According to the latest compiler patches, "Medusa Point" will feature a variant of RDNA 4 called RDNA 4m, likely a mobile version designed for laptops and mini PCs. In contrast, the "Medusa Halo" will utilize AMD's next-generation RDNA 5 / UDNA GPU microarchitecture. "Medusa Point" will introduce a desktop-exclusive RDNA 4 with the new RDNA 4m variant. Although we initially lack comparisons between the two, some instruction set extensions, such as WMMA and SWMMAC instructions, indicate support in the new "GFX1170" GPU, which should be associated with the GFX11 generation, also known as RDNA 3. Currently, this is believed to be an upgraded RDNA 3 with many RDNA 4 modules, enabling FSR 4 support even on the less powerful "Medusa Point" APU.

When it comes to the overall system configuration, AMD targets "Zen 6" CPU cores for both "Medusa" variants. Both "Point" and "Halo" versions will likely differentiate with the same factors we have in the current generation APUs, which is a mix of AMD's "Zen 6" and "Zen 6c" CPU cores for the "Medusa Point," while the more powerful "Medusa Halo" will feature a uniform "Zen 6" core cluster for maximum CPU performance on that side as well. Recently, we learned that the platform will adopt LPDDR6 memory, which will increase the memory bandwidth by 50% over the standard LPDDR5X memory we see implemented today.

Microsoft has showcased its latest AI capabilities in the Windows 11 operating system, demonstrating what this planned integration will look like. The new interface, called "Ask Copilot," is an optional feature that users can enable in place of the standard Windows Search. Once activated, it connects to Microsoft 365 services and allows users to summon specific agents in the taskbar by typing the "@" symbol, similar to tagging someone in a message thread. For example, one of these agents, the Researcher, can perform extended research tasks that run for ten minutes or longer in the background, with small taskbar indicators tracking its progress in a manner similar to file downloads.

Although this project contradicts with the company's recent promise to step back from its "AI everywhere" strategy, this AI integration has been part of Microsoft's long-term plan. In addition to the taskbar changes, Microsoft is adding a Copilot button inside File Explorer, which provides summaries and relevant context for synced shared documents without requiring users to open a separate application. Instead of directing users to a dedicated Copilot app, Microsoft aims to integrate AI assistance into the parts of Windows that people use every day. This means that these small AI integrations across the OS can help provide little productivity boosts that compound, delivering users a slightly better experience researching new topics and creating new content. Microsoft states that these changes will be widely available to users within the next few weeks.

Microsoft's Xbox Insider program lets gamers experience the newest Xbox-related technologies, software updates, and overall improvements. Today, Xbox Insiders are getting an update for their Xbox App on Windows 11 that lets users access postgame recaps. This means that after significant gaming sessions, you can see a recap of your achievements where all the session highlights are recorded, including Xbox Game Bar screenshots and clips, which you can later check out. You also get game recommendations when you first enter a game and a quick overview of the best gaming moments/achievements you have made during your session. Microsoft notes that the feature is now only available in the preview phase to Xbox Insiders, but it is gearing up for a wide release in the Xbox App in the coming weeks.

Users can choose what they wish to see through additional customizations, and these features can be turned off completely. If you head to Settings > App > Postgame recaps, you can tailor the entire user experience and how you want the new feature to work within your PC. Interestingly, if you opt out of all postgame recap types and features, the Xbox App will not start in the system tray when you start the game, but only when you turn it on. Microsoft notes that the company has made various optimizations to minimize the memory usage of another system overlay, with little to no performance impact on the system.

Intel's Japan president, Makoto Ohno, made interesting remarks that this year will be a make-or-break year for AI PCs. He also mentioned that by 2026, AI PCs will account for roughly half of the unit shipments for the year. This means that out of the total unit shipments, which IDC estimates at around 260 million, about 130 million are expected to be AI PCs. This loosely defined term means that the PC comes with an NPU or other AI processing unit, allowing the system to perform some local AI processing with enough power to meet basic user needs. However, Makoto Ohno also admits that the primary reason for purchasing an AI PC may not be its AI capabilities, but rather the better battery life due to newer and more optimized silicon.

Intel Makoto OhnoIt is also predicted that by 2026, this will exceed half, with one in two computers being an AI PC. However, given the current situation, reasons for choosing an AI PC include its high performance and the long battery life provided by the use of an NPU. In other words, it is important to reflect on the fact that people are not currently purchasing an AI PC in order to use its AI-related functions.

Once a target of the largest industry acquisition that was halted by market regulators, NVIDIA has officially divested all its holdings in Arm Holdings PLC by selling 1.1 million shares, valued at about $140 million at the time of writing. Importantly, this does not end the NVIDIA-Arm relationship, as NVIDIA continues to be a customer and partner, licensing Arm IP and its instruction set for its older "Grace" and newer "Vera" CPUs. If readers recall, NVIDIA announced in late 2020 that it was acquiring Arm Ltd. in a deal valued at $40 billion. However, regulators from the UK and EU blocked the deal to preserve fair market competition, citing concerns that the NVIDIA-Arm deal would harm competition and stifle innovation. NVIDIA even paid a break-up fee of $1.25 billion as the deal collapsed under regulatory pressure.

As mentioned, NVIDIA's partnership with Arm is not limited to investment or stock ownership, as the company utilizes its IP and instruction set across a range of products. For example, NVIDIA has Arm-based SoCs in various forms in its embedded computing unit with Jetson modules and mini-computers that power everything from robotics to automated driving development in modern vehicles. Additionally, NVIDIA recently began offering its "Vera" CPUs as standalone server CPUs designed to compete with the industry's latest and greatest x86-based designs from AMD and Intel, demonstrating that NVIDIA is serious about being an Arm ISA licensee for the foreseeable future, not just viewing the company as an investment target.

Following Discord's introduction of digital ID and face scanning requirements for some online servers, many users have started exploring alternative communication platforms. As a result, the well-known TeamSpeak software has experienced a significant increase in new users. In the United States, TeamSpeak's current hosting capacity has reportedly been maxed out, with all servers operating at full capacity. Despite this, the company has announced plans to expand by adding additional Frankfurt-3 and Toronto-1 instances to accommodate new users. Currently, only a few regions still have available capacity, including Amsterdam-3, along with the newly announced Frankfurt-3 and Toronto-1.

Discord has revealed that its new age verification requirements will take effect in early March 2026. These settings will automatically place all existing and new Discord accounts into a mode that filters out content unsuitable for minors, creating a "teen-appropriate experience." Users who wish to access age-restricted content will need to complete an age verification process, which involves either uploading a scan of a government-issued ID or using facial recognition to confirm their age. However, not all users will need to undergo this process, as Discord will also implement an age inference model. This model will analyze user accounts by examining the types of games played, the amount of time spent on Discord, and the times users are active to determine if they are adults. Discord states that the new system aims to provide strong protections for teens while allowing verified adults more flexibility. As users seek software that doesn't restrict their online experience, migrations are expected, and TeamSpeak is the "old reliable" alternative that the community leans on.

ComputerBase conducted a massive online blind test, allowing thousands of gamers to vote on their preferred game video output. The options included NVIDIA's latest Deep Learning Super Sampling 4.5, AMD's FSR Upscaling AI with FSR 4 on Radeon RX 9000 series GPUs, and native resolution rendering without AI upscaling. Interestingly, DLSS 4.5 received the highest percentage of votes, winning in every scenario. ComputerBase tested various games like Anno 117, ARC Raiders, Cyberpunk 2077, Horizon Forbidden West, Satisfactory, and The Last of Us Part II. Only in Cyberpunk 2077 did gamers almost equally prefer native resolution rendering, but DLSS 4.5 still came out on top with a slight edge.

Initially, the ComputerBase team conducted the comparison using videos labeled only with options like 1/2/3/4, without revealing which rendering method was used, to ensure a fully blind test. After two weeks of testing and thousands of votes, the results showed a significant preference for NVIDIA's latest DLSS 4.5 technology. This conclusion highlights that NVIDIA's newest technology is now so refined that its video output offers superior visual appeal. DLSS 4.5 uses a second-generation Transformer model trained on a much larger dataset of video games, with five times the computational investment of the first DLSS 4 Transformer upscaler. It utilizes the FP8 data format, allowing for more processing with minimal precision loss. The new algorithm is more context-aware, and NVIDIA confirmed that the input for upscaling is used more intelligently, resulting in much more detailed and precise video output.

AMD has released its latest Ryzen Chipset Software version 8.01.20.513 driver, which includes general bug fixes and performance improvements. These updates should provide Ryzen CPU owners with some quality-of-life enhancements. In the release highlights, AMD mentions that the installer file has been updated with a new installation wrapper called Install Shield. Interestingly, AMD notes that this latest package does not include the AMS Mailbox and S0i3 filter drivers, which now need to be installed independently on systems that require them or may produce errors without them. Finally, AMD acknowledges that some issues persist, such as the regression from branch version 7 to the earlier chipset driver branch version 6, but the company offers a workaround, which is listed below. We have included the entire changelog below, as well as a download option on TechPowerUp's download section page.

DOWNLOAD: AMD Chipset Software 8.01.20.513

According to reports from Chinese local media, Apple is considering partnering with Chinese semiconductor manufacturers CXMT and YMTC for its upcoming iPhone 18 series and potentially other products like MacBooks and Mac computers. With memory and storage suppliers such as Kioxia, Samsung, and SK hynix raising prices due to a significant industry shortage, Apple is experiencing a squeeze on its profit margins while maintaining the same MSRP for its products. To diversify its supply chain, Apple is reportedly exploring the addition of DRAM from CXMT and NAND Flash from YMTC to reduce its dependence on South Korean and Japanese suppliers.

Recently, the U.S. Government's Bureau of Industry and Security reportedly removed CXMT and YMTC from the list of restricted Chinese companies. This move could benefit Apple, which may now utilize products from both firms. CXMT offers LPDDR5X and DDR5 memory, which aligns with Apple's needs for its products. Since Apple's iPhones and M-series SoCs primarily use LPDDR5X memory, CXMT's 12 Gb and 16 Gb LPDDR5X capacities could serve both the smartphone and computer sectors effectively.

ASUS has released an official statement in response to the recent decision by a Munich court to prohibit the sale of its PCs and notebooks in Germany. Although the company is now unable to sell these products in Germany, it will continue to provide after-sales services, including support and warranty claims. This decision stems from a ruling that ASUS infringed on Nokia's HEVC/H.265 patents. As a result, ASUS is prevented from generating additional revenue in Europe's largest economy. The court found that the two OEMs, ASUS and Acer, did not demonstrate behavior consistent with willing licensees under FRAND (Fair, Reasonable, and Non-Discriminatory) terms, leading the court to issue an injunction rather than limit the remedy to financial damages.

ASUSASUS has temporarily suspended its official website and online store in Germany following a Munich I Regional Court ruling (case no. Munich I - 7 O 4102/25) related to a patent dispute with Nokia. The suspension, resulting from a temporary injunction, affects select ASUS PCs and products using High Efficiency Video Coding (HEVC). All after-sales services in Germany remain fully operational, and existing customers will continue to receive uninterrupted support in full compliance with the current court order. ASUS is evaluating and pursuing further legal action to reach a fair resolution as soon as possible. ASUS continues to stand by its position and remains committed to our customers and partners.

According to SemiAnalysis, which recently released its InferenceX benchmark comparing the inference performance of the latest AI accelerators, AMD's next-generation Instinct MI455X accelerators, designed to compete with NVIDIA's "Vera Rubin," are facing serious manufacturing difficulties, causing delays in AMD's roadmap execution. Only low-volume production will occur this year, while customers will be generating AI tokens in Q2 2027. This means that NVIDIA's "Vera Rubin" VR200 rack-scale system will be the most powerful system shipping this summer, without competition. As AMD's first rack-scale system, the "Helios" AI rack with the MI455X UALoE72 configuration packs 72 GPUs and 6th Gen AMD EPYC "Venice" CPUs in a heterogeneous system designed to run as a single homogeneous GPU, delivering massive AI performance with multi-ExaFLOP compute output.

SemiAnalysisEngineering samples and low volume production of AMD's first rack scale MI455X UALoE72 system will be in H2 2026 while due to manufacturing delays, the mass production ramp and first production tokens will only be generated on an MI455X UALoE72 by Q2 2027.

Valve updated its Steam Deck website with a disclaimer, noting that the availability of the Steam Deck OLED version may be affected by the storage and memory shortage across the industry. While Valve has been able to secure a significant inventory of NAND Flash and DRAM modules for its Steam Deck handheld console, demand might be outpacing supply. The component shortage at Valve is not an isolated case, as many are expressing concerns over not being able to secure sufficient capacity. The only ones able to secure massive DRAM and NAND Flash capacities are hyperscalers building out data center infrastructure, who are securing long-term agreements with storage and memory makers.

Last week, we saw customers facing difficulty acquiring new Steam Deck OLED stock. Unfortunately, potential buyers in North America, Japan (through Komodo, Valve's regional distribution partner), Taiwan, South Korea, and Hong Kong were unable to get their hands on new OLED units. Initial reports suggested a "plentiful" supply for customers in the UK and Australia, but several key markets appear to be suddenly experiencing shortages, as the inventory is depleting across the globe. While other components are plentiful, memory and storage are in a dire shortage situation, which might be prolonged. Regarding the 256 GB LCD version, Valve has reiterated that it will only be available while existing stock lasts, as this model was discontinued in December of last year.

TSMC is reportedly planning to announce the addition of four new fabs at its Phoenix, Arizona site, known as TSMC Arizona. According to the Financial Times, TSMC will add four additional fab buildings at its Arizona campus, worth about $100 billion, with an official confirmation expected as early as April, just two months from the time of writing. In January, TSMC reportedly purchased additional 900-acres of land directly across the highway from the existing site north of Phoenix, preparing to expand its campus across. That extra production capacity will be supported by an estimated $100 billion of additional funding that TSMC is willing to spend on U.S. soil, despite making additional simultaneous investments back home in Taiwan.

However, many of the deal's specifics are still uncertain. According to Commerce Secretary Howard Lutnick, about $100 billion of those pledges are firm, which means that the total value of TSMC's investment in Arizona will amount to $265 billion. About $165 billion has already been invested in Arizona, and another $100 billion will make this one of the highest ever external investments on U.S. soil. Interestingly, TSMC is not alone in this investment round, as its supply chain partners are expected to contribute about $30 billion of the $100 billion figure, meaning that many more players are gathering funds to form the new supply chain independence.

Sony is reportedly postponing the launch of its next-generation PlayStation 6 console to 2028 or 2029 due to the massive rise in memory costs. This is reportedly impacting decision-making at the top of the company unit responsible for PlayStation strategic planning. Rising memory costs and a tight semiconductor supply chain are the core reasons behind any changes. Initially, we expected to see the wave of next-generation consoles in 2027, as AMD recently confirmed Microsoft's next-generation Xbox arriving in 2027. However, Sony could be abandoning the 2027 release window and pushing its PlayStation 6 console to a late 2028 or even 2029 launch, indicating that the company is not capable of securing sufficient DRAM allocation from its partners. This could leave Microsoft's new Xbox console as superior for an entire year or even two before Sony could join the next-generation console wars.

BloombergSony Group Corp. is now considering pushing back the debut of its next PlayStation console to 2028 or even 2029, according to people familiar with the company's thinking. That would be a major upset to a carefully orchestrated strategy to sustain user engagement between hardware generations.

According to the latest ruling from the Munich Regional Court, ASUS and Acer are banned from directly selling their PCs in Germany—Europe's largest economy. The judgment, handed down on January 22, 2026, has already led both manufacturers to suspend or remove affected product listings from their German online stores while they assess legal options and the scope of the ruling. The court's order targets the manufacturers' own sales and distribution channels, rather than retailers selling existing stock, effectively leaving the German market to supply only through other OEMs and the remaining inventory from ASUS and Acer.

The core reasoning behind this decision is patent claims asserted by Nokia, including patents related to core HEVC/H.265 encoding and decoding techniques. As both ASUS and Acer use GPUs, processors, and many other digital decoding/encoding engines for video, the use has to be licensed, and the sales can only proceed with approval from Nokia. The judges concluded that the two OEMs had not demonstrated the conduct of willing licensees under FRAND rules, which allowed the court to grant injunctive relief instead of limiting the remedy to damages. We don't have information on the length of the ban, which will likely require a followup with the court and two OEMs.

Intel has released its latest 32.0.101.8509 WHQL driver package, bringing support for XeSS 3 across multiple graphics generations and finally ending the launch exclusivity of "Panther Lake" integrated graphics. Now, Intel supports XeSS 3 multi-frame generation across Arc B-series "Battlemage" and A-series "Alchemist" discrete GPUs. For other integrated GPUs, only the Intel Arc GPU family is receiving official support, with "Meteor Lake," "Lunar Lake," and laptop "Arrow Lake-H" chips now offering full XeSS 3 support for 4x the frame output with AI-based frame generation. As Intel recently launched "Panther Lake," some game issues occurred, but thankfully they have been resolved. This includes color corruption in Ghost of Tsushima using DirectX 12 and game crashes in Mount & Blade II: Bannerlord using DirectX 11. However, some "Panther Lake" issues persist, with certain titles crashing and experiencing in-game corruption, which is expected to receive an official fix in upcoming driver releases.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.8509 WHQL

Intel has once again confirmed its product roadmap for the next generation of graphics IP, despite rumors that there might not be anything new after the launch of the Xe3P. According to a new presentation from Intel's Anil Nanduri, Vice President of GTM & Product Management AI Accelerators, responsible for data center AI accelerators, Intel will have a dedicated graphics portfolio after the recently introduced "Crescent Island." Labeled as "Xe Next," the next generation of GPU IP is still under development and currently without an official name. It is expected to follow the rollout of the Xe3P-based "Crescent Island" inference-focused GPUs. With "Xe Next," the data center lineup is seemingly expanding into two production lines: inference-focused "Crescent Island" GPUs and the long-awaited "Jaguar Shores" GPU for AI training and HPC workloads.

For AI training and HPC workloads, Intel's "Jaguar Shores" design is reportedly being finalized and will be completed by the middle of this year, with production starting shortly after. Assuming a perfect design, we could see Intel's "Jaguar Shores" GPU late this year or early 2027. It will likely involve a mix of Intel's internal production in collaboration with TSMC or Intel's pure 18A design, assuming yields are manageable. We have already seen that Intel confirmed HBM4 memory will be used in these accelerators, and SK hynix appears to be the main partner supplying Intel with this memory. As a rack-scale design, Intel will compete with NVIDIA and AMD in the highest-margin business.