Tecnoβs Modular Phone Concept is a Super Slim 4.9 mm Device With Magnetic How-Swap Attachments
Just before the Mobile World Congress (MWC) 2026 event in Barcelona, Tecno unveiled a bold new smartphone concept that is built around the new Modular Magnetic Interconnection Technology. This is a system designed to rethink how hardware expansion works, so here are all the details.
Tecno Modular Phone Concept: Ultra-Thin Design Meets Modular Flexibilty
The Tecno Modular Phone concept is built around a sleek metal frame and matte glass back, with the rear panel visually divided into eight modular zones that guide accessory attachment. Another standout aspect is its ultra slim 4.9mm body. Tecno allows users to add modules such as a 4.5mm ultra-slim power bank or action camera. This sleek design helps the Module Phone Concept avoid turning into a bulky slab even with the accessories attached to the back.

The concept will be shown in two design styles, namely ATOM Edition and MODA Edition. Instead of the heavy βbrickβ modules seen in older modular efforts, Tecnoβs approach is more about practical attachments that enhance functionality without compromising portability. Some of these new attachments include:
- Power Bank Module: Adds extra battery capacity while preserving a slim profile.
- Action Camera Module: Gives creators alternative angles and workflows for video/shooting.
- Telephoto Lens Module: Uses the phoneβs display as a live viewfinder for improved long-range photography.
This modular ecosystem is designed to solve a modern problem: how to expand hardware capabilities like AI computing, imaging, battery life, and others. Tecnoβs modular concept uses a hybrid magnetic attachment system with a rectangular magnetic array and pogo-pin connectors for power delivery.
These connectors help keep power transfer efficient and manage heat more effectively than some old modular prototypes. Meanwhile, the modules communicate with the phone using a mix of Wi-Fi, Bluetooth and mmWave. We can expect more details to be revealed during the major tech event, so stick around for more.
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