Dell Technologies (NYSE: DELL) announces financial results for its fiscal 2026 fourth quarter and full year ended January 30, 2026. The company also provides guidance for its fiscal 2027 first quarter and full year.

Full-Year Summary

• Record full-year revenue of $113.5 billion, up 19% year-over-year
• Record full-year diluted earnings per share (EPS) of $8.68, up 36% year over year, and record full-year non-GAAP diluted EPS of $10.30, up 27%
• Record full-year cash flow from operations of $11.2 billion
• Announcing a cash dividend increase of 20% and $10 billion increase in share repurchase authorization
• FY27 guidance: Full-year revenue growth of 23% at the midpoint, diluted EPS growth of 33% at the midpoint, and non-GAAP diluted EPS growth of 25% at the midpoint

The head of Intel Foundry, Kevin O'Buckley, is leaving the company to join Qualcomm. He will take on the role of Executive Vice President of Global Operations and Supply Chain at Qualcomm, effective March 2, 2026. At Qualcomm, O'Buckley will oversee global semiconductor operations, including manufacturing engineering, foundry and supplier partnerships, supply chain, and procurement. He joins after less than two years leading Intel Foundry, where he served as Senior Vice President and General Manager of Intel Foundry Services. Previous to joining Intel, O'Buckley was working at IBM, GlobalFoundries, and Marvell. At Qualcomm, he will be responsible for scaling manufacturing partnerships and overseeing how the chip designs transition into volume production.

Intel Foundry will now be led by Naga Chandrasekaran, who steps into an expanded role overseeing both technology development and manufacturing operations. As Chief Technology and Operations Officer and head of Intel Foundry, Chandrasekaran will supervise next-generation process node development, advanced packaging, test technologies, and day-to-day execution across Intel's global fabrication and assembly network. Chandrasekaran previously led front-end process technology development and manufacturing, already overseeing both the Technology Development (TD) organization and the Foundry Manufacturing and Supply Chain (FMSC) group since mid-2024. Navid Shahriari will continue to manage packaging development and operations within Intel Foundry.

Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced it has begun shipping the industry's first 2 nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform. A proven modular, multi-dimensional stacked die platform, 3.5D XDSiP combines 2.5D techniques and 3D-IC integration using Face-to-Face (F2F) technology.

3.5D XDSiP is foundational to next-generation XPUs. With 3.5D XDSiP, consumer AI customers can deliver the most advanced XPU with unparalleled signal density, superior power efficiency and low latency to meet the massive computational demands of gigawatt-scale AI clusters. Broadcom's XDSiP platform allows compute, memory and network I/O to scale independently in a compact form factor, enabling high-efficiency, low-power computing at scale.

NVIDIA today released its latest GeForce 595.59 WHQL Game Ready driver, adding day-one support for Resident Evil Requiem and Marathon. The update also addresses several gaming-related issues, particularly affecting GeForce RTX 50 series GPUs. Fixes include intermittent black bar flickering in The Ascent, green artifacts in Total War: Three Kingdoms, and crash issues in Final Fantasy XII: The Zodiac Age following recent driver updates. NVIDIA also resolved image corruption problems in Call of Duty: Modern Warfare and a significant performance drop in Act 4 Part 1 of Quantum Break.

On the general fixes side, the 595.59 driver resolves an AV1 decode crash affecting certain workflows in Blackmagic Design applications when handling multiple OBUs (Open Bitstream Unit) within a single packet.

Update 20:38 UTC: NVIDIA has pulled its GeForce 595.59 WHQL driver after users reported stability problems, including faulty fan detection leaving GPU coolers running on a single fan and clock speed issues. The company is pointing affected users back to the previous 591.86 WHQL release for now.

DOWNLOAD: NVIDIA GeForce 595.59 WHQL

TCL CSOT, a global leader in advanced display technologies and a subsidiary of TCL Technology (000100.SZ), is setting the tone for the industry ahead of Mobile World Congress (MWC) 2026. Under the theme "Super Pixel Beyond Limits", TCL CSOT will debut its groundbreaking Super Pixel technology on the global stage, alongside a spectrum of future-shaping products including advanced FMM OLED, inkjet-printed OLED (IJP OLED) and MLED applications. Guided by its core APEX philosophy, the company is delivering immersive, sustainable, next‑generation experiences across smartphones, tablets, notebooks, monitors, and beyond.

Introducing Super Pixel: Seeing Beyond Limits
At the forefront of TCL CSOT's showcase is Super Pixel technology, an innovation poised to redefine next-generation display performance. It delivers a powerful trifecta of benefits:

• High Clarity: Achieves sharpness comparable to WQHD SPR. By increasing sub‑pixel quantity by approximately 1.8%, it renders images that are more accurate, clear, and finely detailed.
• Smart Power Use: Optimized data processing reduces power consumption by up to 25% while maintaining image quality.
• Rapid Refresh: Leveraging a Real RGB pixel layout, Super Pixel requires less bandwidth than SPR, enabling refresh rates up to 40% higher.

TrendForce's latest findings reveal that the expansion of AI applications from LLM training to inference has prompted CSPs to broaden data center build-outs beyond AI servers to include general-purpose servers. This shift has extended memory procurement beyond HBM3e, LPDDR5X, and high-capacity RDIMMs to RDIMMs across multiple densities. Aggressive additional orders have driven a sharp increase in conventional DRAM contract prices, lifting total DRAM industry revenue to $53.58 billion in 4Q25, up 29.4% QoQ.

Across segments, buyers have struggled to secure sufficient supply amid a widening supply-demand gap. This has significantly strengthened suppliers' pricing power. Conventional DRAM contract prices rose 45-50% QoQ, while blended contract prices for conventional DRAM and HBM increased 50-55%, marking an accelerated upswing across all product categories.

HighPoint Technologies, Inc., the leading provider of high-performance PCI Express (PCIe ) switching and storage expansion solutions, is proud to announce the launch of HighPoint's External CopprLink PCIe Architecture. Anchored by the PCI-SIG CopprLink standard, this groundbreaking architecture establishes a new benchmark for disaggregated AI, HPC, and professional media workflows, delivering a massive 64 GB/s of native throughput with unprecedented interoperability.

A Vendor-Neutral Foundation for PCIe 5.0 and PCIe 6.0 Technology Interoperability
As AI and data-intensive workloads continue to outpace the thermal and power thresholds of conventional server chassis, the need for a standardized external expansion framework has become mission-critical. HighPoint's new connectivity fabric is built upon the PCI-SIG CopprLink (CDFP) specification (SFF-TA-1032) to facilitate a truly vendor-neutral hardware environment. By adhering to this open industry standard, HighPoint ensures that today's PCIe 5.0 technology investments are fully forward-compatible with the emerging PCIe 6.0 specification, providing a sustainable, long-term ROI for data centers and enterprise IT architects.

NVIDIA (NASDAQ: NVDA) today reported record revenue for the fourth quarter ended January 25, 2026, of $68.1 billion, up 20% from the previous quarter and up 73% from a year ago. For fiscal 2026, revenue was $215.9 billion, up 65% from a year ago.

For the quarter, GAAP and non-GAAP gross margins were 75.0% and 75.2%, respectively. For fiscal 2026, GAAP and non-GAAP gross margins were 71.1% and 71.3%, respectively.

Samsung Electronics today announced the Galaxy S26 series, powered by the most intuitive, proactive and adaptive Galaxy AI experiences yet and designed to simplify the tasks people do on their phones every day. From managing plans and finding information to capturing and refining content, Galaxy S26 reduces the effort and number of steps required to get things done. As Samsung's third-generation AI phones, Galaxy S26, S26+ and S26 Ultra handle complex tasks in the background, allowing users to focus on results rather than how the technology works.

The Galaxy S26 series was engineered with Samsung's most advanced capabilities working together as one: incredible performance, an industry-leading camera system and Galaxy AI. This provides a strong foundation that gives Galaxy S26 users the confidence to depend on their phone throughout the day without compromising security or privacy.

Dell Technologies (NYSE: DELL) introduces the Dell PowerEdge XR9700 server, a first of its kind closed-loop liquid-cooled, fully-enclosed, ruggedized server engineered to run Cloud RAN and edge AI workloads in unprotected outdoor environments. Designed to mount on utility poles, rooftops and building exteriors, the PowerEdge XR9700 brings high performance computing into dense urban areas, remote locations and space-constrained facilities where traditional data center infrastructure cannot reach.

Why it matters
Telecommunications operators and those working at the edge often struggle to deploy compute due to lack of power and space. The PowerEdge XR9700 solves this, delivering high performance compute directly at the point of need in an ultra-compact, zero-footprint IP66-rated enclosure that's sealed from the elements. For telecommunications operators, it provides a flexible, software-defined alternative to traditional RAN solutions, supporting Cloud RAN and Open RAN processing at the cell site. At the same time, the platform can run edge and AI applications directly where data is created and consumed.

The CP152-1 is a concept PCIe storage adapter card designed to explore market demand for a compact, rear-swappable 2.5" SATA SSD/HDD solution with built-in RAID 1 functionality. By utilizing a dual-slot PCIe form factor, the CP152-1 enables the installation of two 9.5 mm 2.5" SATA drives with RAID 1 or JBOD support, delivering a simplified approach to data protection and storage expansion without the need for traditional drive cages or backplanes.

The CP152-1 adopts a rear-accessible removable tray architecture, allowing system integrators to evaluate alternative service workflows and chassis layouts while maintaining a clean, cable-free PCIe installation.

AMD has announced its EPYC 8005 series server processors, codenamed "Sorano". These new CPUs are filling the gap between the EPYC 9005 high-end Zen 5 lineup and the lower-tier EPYC 4005 parts. The new 8005 series succeeds the EPYC 8004 "Siena" family and targets single-socket (1P) platforms with an emphasis on telecom, edge, and vRAN (Virtual Radio Access Network) workloads. Built on the Zen 5 architecture, EPYC 8005 is designed around performance-per-watt and performance-per-dollar rather than peak multi-socket scalability. With these new server CPUs, AMD is targeting the telco sector where power and space-constrained environments are key factors in cell sites and distributed edge locations. AMD has not yet published a full SKU list or detailed specifications about the EPYC 8004 CPUs. However, the company says the lineup will scale up to 84 cores in a single-socket configuration, with SKUs operating in power envelopes up to 225 W.

AMD is also highlighting wide thermal operating ranges and support for NEBS (Network Equipment-Building System) compliant platforms. For vRAN specifically, EPYC 8005 adds targeted LDPC (Low-Density Parity Check) decoding optimizations to improve Layer 1 acceleration for 5G workloads. AMD claims improved uplink throughput and more efficient forward-error-correction processing, while maintaining the deterministic behavior required in RAN environments, thanks to the updated Zen 5 execution pipeline and vector capabilities. The EPYC 8005 "Sorano" CPUs should become available in the following months, with more details about the platform and performance likely closer to launch.

In Yongin, South Korea, the towering frame of a semiconductor fab has emerged, reaching the height of a 50-story apartment building to form the massive Yongin Semiconductor Cluster. With construction gaining momentum, SK hynix announced Feb. 25 that it has decided to invest approximately 21.6 trillion KRW (15 billion USD) in the new facility for the first fab by the end of December 2030. This brings the total investment for the construction of the first fab to approximately 31 trillion KRW (approx. 21.5 billion USD), which includes the approximately 9.4 trillion KRW (approx. 6.5 billion USD) facility investment previously announced in July 2024.

This investment comes from a strategic decision to proactively address rapidly growing global customer demand and further strengthen supply system stability. With the expansion of advanced industries such as AI, data centers, and high-performance computing (HPC), the demand for high-performance and high-density semiconductors is also experiencing structural growth. To keep pace with these changes, SK hynix aims to expand production capacity ahead of schedule and establish a foundation to ensure a stable supply of products for customers when they require it.

The all-white SAPPHIRE PURE X870A WIFI 7 returns with Wi-Fi 7, PCIe 5.0, SAPPHIRE CORE BIOS, and TriXX-M software, delivering high performance and striking design for gamers and PC builders.

Next-Gen Performance Meets Sleek Design
SAPPHIRE Technology today launches the SAPPHIRE PURE X870A WIFI 7, a fully white AM5 motherboard designed for gamers, system builders, and modders who want exceptional performance and standout aesthetics. Powered by the AMD X870 chipset and supporting Ryzen 7000, 8000, and 9000 Series processors, the SAPPHIRE PURE X870A WIFI 7 delivers speed, stability, and reliable gaming performance in a crisp, unified white design. SAPPHIRE PURE has always embodied a coordinated, minimalist aesthetic, and the X870A continues this legacy. Every detail, from heatsinks to layout, has been designed to create a bright, cohesive look that complements modern white-themed builds, appealing to users who value both style and substance.

Razer, the leading global lifestyle brand for gamers, today announced two new colorways for its next‑generation creator webcams, the Razer Kiyo V2 and Razer Kiyo V2 X. Now available in Quartz and White, the stunning new finishes join classic Black to give creators more ways to build a setup that reflects their personal style.

Razer Kiyo V2 gets smarter with AI Face Retouching
Alongside the new color options, the Kiyo V2 introduces AI Face Retouching via Camo Studio for instant, studio-ready polish. Designed to look natural on camera, the adjustable feature subtly smooths imperfections, while adapting to lighting and environmental changes in real time. Users can enable this new AI tool by updating to the latest version of Camo Studio.

Endorfy is expanding portfolio with its first-ever microATX computer cases. Inspired by the popular Signum 300 series, the Signum M30 line is designed for users who want the full functionality of a modern PC in a compact mini-tower form factor.

The lineup includes two models - Signum M30 ARGB and Signum M30 Air - striking an ideal balance between compact dimensions and extensive configuration options. Both cases support graphics cards up to 345 mm in length, radiators up to 240 mm, and up to seven fans. As a result, they provide a versatile foundation for powerful gaming rigs, modern workstations, or office PCs built around microATX, Mini-ITX, or Flex ATX motherboards.

Each week, new games and apps integrating NVIDIA DLSS, NVIDIA Reflex, and advanced ray-traced effects are released or announced, delivering the definitive PC experience for GeForce RTX players.

DLSS 4.5 is our latest upgrade to the ever-improving DLSS Super Resolution, adding a second generation transformer model that further enhances image quality. Via the NVIDIA app, you can apply DLSS 4.5 Super Resolution to your game library on all GeForce RTX PCs and laptops, instantly upgrading clarity and quality.

The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, today announced major updates to two of its foundational specifications. MIPI UniPro v3.0 and MIPI M-PHY v6.0 offer significant performance, latency and power-efficiency improvements for next-generation JEDEC Universal Flash Storage (UFS 5.0) solutions to support greater edge AI workloads in smartphones, tablets, PCs, gaming consoles, automotive and industrial applications.

"For more than a decade, M-PHY and UniPro have served as the interconnect layer for JEDEC UFS, enabling high‑performance, low‑power flash storage across a broad range of devices," said Hezi Saar, chair of MIPI Alliance. "These latest releases build on that foundation with advances in speed and efficiency to enable emerging edge AI workloads where low‑latency, high‑bandwidth and power‑efficient data access, processing and storage are increasingly essential."

Apple today announced a significant expansion of factory operations in Houston, bringing the future production of Mac mini to the U.S. for the first time. The company will also expand advanced AI server manufacturing at the factory and provide hands-on training at its new Advanced Manufacturing Center beginning later this year. Altogether, Apple's Houston operations will create thousands of jobs.

"Apple is deeply committed to the future of American manufacturing, and we're proud to significantly expand our footprint in Houston with the production of Mac mini starting later this year," said Tim Cook, Apple's CEO. "We began shipping advanced AI servers from Houston ahead of schedule, and we're excited to accelerate that work even further."

SambaNova today introduced their SN50 AI chip, which boasts a max speed that's 5X faster than competitive chips. The company also announced a planned collaboration with Intel to deliver high‑performance, cost‑efficient AI inference solutions, and more than $350M in investment from new and existing investors.

Positioned as the most efficient chip for agentic AI, the SN50 chip offers enterprises a 3X lower total cost of ownership - a powerful foundation to scale fast inference and bring autonomous AI agents into full production. The SN50 will be shipping to customers later this year.

NVIDIA is reportedly preparing its long-awaited new consumer laptop processor for launch in the first half of 2026, according to a report from The Wall Street Journal. The chip uses a system-on-chip approach integrating CPU, GPU, and NPU into a single package. Systems based on those chips could first ship from OEMs such as Dell and Lenovo within months of launch, though no products have been confirmed. These systems are expected to focus on thin-and-light designs with an emphasis on efficiency and battery life. The report says NVIDIA is working with MediaTek on the processor, which will use the Arm architecture rather than x86. Internal names mentioned include N1 and N1X. The report also references a separate project involving Intel. That design would combine an Intel x86 CPU with NVIDIA graphics and neural processing technology, targeting improved graphics in slimmer laptops without a discrete GPU.

NVIDIA has not formally announced either chip, meaning specifications, pricing, and final configurations remain undisclosed. However, we reported in January that NVIDIA's Arm-based N1 and N1X laptop chips were getting closer to launch, with Lenovo accidentally confirming several upcoming models, including Yoga and Legion designs, through a since-deleted support page listing. Dell was also spotted testing the N1X, with a November 2025 shipping manifest surfacing a "Dell 16 Premium" powered by an N1X engineering sample. According to initial leaks, both chips are based on the same GB10 Superchip found in NVIDIA's DGX Spark AI mini PC, with the N1X reportedly packing 20 Arm CPU cores and a 48-unit iGPU. Despite expectations, NVIDIA skipped CES without any official announcement, and earlier rumors of delays pushing the launch to late 2026 hadn't been fully ruled out at the time. With NVIDIA GTC 2026 just a few weeks ahead (March 16-19), that's likely the event where those new mobile processors could be announced.

GXTrust puts high-quality sound at the forefront with the Emita II microphones, featuring a premium 16 mm condenser capsule, delivering studio-quality sound that brings every word to life. With a cardioid recording pattern, they're perfectly tuned to pick up the user's voice while minimizing background noise, making these microphones ideal for any kind of streaming setup.

The Emita II includes pop and wind filters reduce plosives and distortion, ensuring clean vocals and a smooth, polished result every time. A robust metal alloy casing offers improved acoustics, while its external shock mounts block unwanted vibrations to enhance sound quality even further.

Innodisk, a leading provider of industrial-grade memory solutions, announced the CXL Add-in Card (AIC), a major addition to its CXL product portfolio. Innodisk developed this CXL-based expansion card in response to rising memory demands in next-generation computing and the limited scalability of current motherboard designs. Connecting via the widespread and mature PCIe interface, the CXL AIC delivers fast memory access without occupying system DIMM slots. It also provides greater flexibility in memory usage and allocation. Its HHHL form factor, paired with Innodisk's compact DDR5 RDIMM/RDIMM VLP, unlocks new possibilities for microdata centers and edge systems, especially in latency-critical scenarios such as 5G networking, high-frequency trading, and smart medical imaging.

Flexible Memory Expansion Up to 256 GB
The Innodisk CXL AIC features two onboard RDIMM sockets that provide flexible memory expansion up to 256 GB (128 GB x2), allowing easy capacity adjustment by swapping RDIMM modules based on system needs. By connecting through PCIe slots, it not only preserves the system's native DIMM slots but also delivers an additional 32 GB/s of bandwidth via its PCIe Gen 5 x8 interface. This minimizes latency when the CPU accesses shared memory, enabling faster data flow for bandwidth-intensive applications such as AI inference and edge processing.

ASML says it has boosted the light source power in its EUV lithography systems to 1,000 watts, up from roughly 600 W today. According to a Reuters report, the company claims the increase could enable up to 50% more chip output by the end of the decade. More source power translates directly into higher throughput. ASML says customers could process around 330 wafers per hour by 2030, compared to about 220 wafers per hour today, lowering the cost per chip. EUV light at a 13.5 nm wavelength is generated by firing a CO₂ laser at microscopic droplets of molten tin, creating plasma that emits EUV radiation. The light is then collected and directed through precision optics supplied by Carl Zeiss AG. To reach 1,000 W, ASML doubled the droplet rate to roughly 100,000 per second and shifted to a two-pulse laser shaping approach instead of a single pulse. The company says there is a path toward 1,500 W and potentially even 2,000 W over time.

ASML is the only supplier of commercial EUV scanners, used by major chipmakers including TSMC, SK Hynix, and Intel. The tools are considered critical to advanced node production and have been subject to export restrictions to China. The move is aimed at maintaining ASML's lead as U.S. companies, such as Pat Gelsinger's xLight EUV startup and Chinese efforts to develop competing lithography systems continue to ramp. Chinese companies have reportedly been sourcing parts from older ASML machines through secondary markets. Huawei is leading the charge, working to build a homegrown AI supply chain as a way around foreign tech restrictions. The company set up a large semiconductor manufacturing facility in Guanlan focused on 7 nm chips for its own processors. The Chinese government had initially aimed to have a working prototype from this effort by 2028.

The AMD VEK385 Evaluation Kit provides a fast, feature-rich, and scalable path to evaluating AMD Versal AI Edge Series Gen 2 XC2VE3858 devices. With heterogeneous compute, high-performance I/O, comprehensive memory bandwidth, ready-to-run workloads, and robust bring-up tools, engineers can quickly assess system performance and accelerate the path from prototype to production.

Designed for Embedded AI, Control, and Vision Workloads
The VEK385 Evaluation Kit enables engineers to evaluate embedded AI, vision, and control systems through multiple, industry-standard interfaces:

• HDMI RX/TX and USB3/DP for 4K/8K vision pipelines
• PCIe x8 edge connector for Gen 5 x4 and Gen 3/4 x8 support
• QSFP28 and SFP28 connectors for 25-100 Gb/s high-speed Ethernet applications
• FMC+ for I/O expansion
• CAN-FD with PL/PS Ethernet for deterministic robotics and industrial control

Akasa, a leading provider of thermal solutions, introduced the Euler CMX, a compact, aluminium, fanless case designed for Mini-ITX motherboards. The Euler CMX supports Intel Core (8th-14th Gen) and Core Ultra (15th Gen) processors up to 35 W TDP and integrates a 220 W DC-to-DC power converter, delivering reliable performance in space-constrained environments while ensuring long-term durability for industrial automation, point-of-sale (POS), kiosk, digital signage, surveillance or other commercial systems.

This case is compatible with Mini-ITX motherboards with Intel LGA1851, LGA1700, LGA1200 or LGA115X sockets, supporting Intel Core (8th-14th Gen) and Core Ultra (15th Gen) processors up to 35 W TDP.

Luckfox, a small Chinese company mostly known for its development boards and kits, expanded its portfolio with two new 16-inch 4K (3840 × 2400) and 2K (2560 × 1600) portable touch monitors. The 4K model uses an IPS panel with a pixel pitch of 0.0897 mm, 120 Hz refresh rate, and HDR support. Brightness is rated at 350 cd/m² while the 178° viewing angles are typical for a standard IPS panel. The display uses optical bonding and supports 10-point capacitive touch through a toughened glass surface. Connectivity includes Mini HDMI and USB Type-C for display input, plus a USB touch interface. A 3.5 mm audio jack and built-in Hi-fi speakers are also present. The enclosure is CNC-machined, and the monitor supports VESA 75 mm mounting. It ships with a detachable magnetic protective case that doubles as a stand with two viewing angles. The 4K model is priced at $319.99.

Luckfox also offers a more affordable 2K variant that keeps the IPS panel, HDR support, optical bonding, and 10-point touch, but increases the refresh rate to 165 Hz. It comes with the same magnetic case and multi-device compatibility, including support for full-featured USB-C PCs and smartphones, as well as boards such as Raspberry Pi and Jetson. Worth mentioning that both monitors are powered via USB-C with support for 20 W PD. The 2K version is listed at $189.99.

JAPANNEXT has expanded its portfolio with a new 31.5-inch monitor, named the JN-IPS326K-HSPC9 featuring 6K (6016 × 3384) resolution. The IPS panel with its 60 Hz, 8 ms response time, and E-LED backlighting is certainly suited towards home and office work rather than gaming. Pixel pitch is listed at 0.1159 mm, delivering a noticeably sharper image than standard 4K displays at this size. Brightness is rated at 500 nits, with a 1500:1 contrast ratio. The monitor covers 100% of the sRGB color space, 96% DCI-P3, and includes HDR 10 support. Viewing angles are specified at 178° horizontally and vertically, typical for an IPS panel.

The monitor comes with Picture-in-Picture and Picture-by-Picture options. These features can be useful for people who need to work with content from different sources at the same time. It also has Flicker-Free and Low Blue Light settings, HDCP support for DisplayPort, HDMI, and USB-C, and a built-in KVM switch. For connections, you'll find two HDMI 2.1 ports, one DisplayPort 1.4, and a USB-C 3.1 port that can deliver up to 90 W of power. There is also an audio output and built-in 2 W speakers, and compatibility with AMD FreeSync and NVIDIA G-Sync. The stand supports tilt, swivel, height, and pivot adjustments. VESA mounting (75 × 75 mm) is also available. The JAPANNEXT JN-IPS326K-HSPC9 monitor is currently listed at €1,399 on the company's official website.

Razer, the leading global lifestyle brand for gamers, today announced the Razer Huntsman Signature Edition, a flagship keyboard created for users who want both peak performance and a refined desktop centerpiece. Positioned at the very top of Razer's keyboard portfolio, the Huntsman Signature Edition distills years of research in switch technology, acoustics, and materials into a single, meticulously crafted form.

Every unit is the result of a demanding multi-stage process including CNC (Computer Numerical Control) machining, anodizing, hand-polishing, PVD (Physical Vapor Deposition) finishing, and rigorous unit-level inspection, reflecting Razer's commitment to crafting top-tier products without compromise.

EIZO is preparing its first OLED monitor under the ColorEdge series, targeting professional 4K HDR and SDR workflows. The 31.5-inch panel features a 3840 × 2160 resolution, HDR support, a claimed 1,500,000:1 contrast ratio, and an anti-glare, low-reflection (AGLR) surface. To address the usual OLED ABL (Auto Brightness Limiter) behavior, which can dim the entire image during bright scenes, EIZO says it uses higher luminance thresholds to reduce unnecessary dimming and better preserve mid-tones. Two modes are available: Highlight Dimming, which mainly tones down bright areas, and Uniform Dimming, which lowers brightness evenly across the screen. A blue status LED indicator shows when luminance control is active.

The display also integrates EIZO's built-in calibration sensor for automated color maintenance and includes a dedicated circuit to reduce color fringing on high-contrast edges. This is particularly useful when displaying text as this will appear cleaner and clearer. The monitor will be shown at the NAB Show 2026 (April 19-22, Las Vegas) and MPTS 2026 (May 13-14, London), two of the world's premier events for media, production, and broadcast. Pricing and availability have not been announced.

WD (Nasdaq: WDC) today announced the re-launch of its G-DRIVE brand as the unified identity for its content creator and creative professional external storage product portfolio. The brand consolidation brings together high-capacity, high-performance storage solutions under a single name brand - G-DRIVE - known for its quality, performance, and reliability.

The G-DRIVE brand, also represented by the iconic "G" logo, will replace Sandisk Professional branding across WD's creator storage lineup, including desktop drives, portable drives and multi-bay RAID systems purpose-built for the creative community's most demanding workflows: high-resolution photography, video production, graphic design, and audio engineering. Supporting individuals, businesses and production studios, G-DRIVE solutions support the full creative lifecycle, from on-set capture and real-time editing to backup and post-production. Products currently branded as Sandisk Professional will transition to the G-DRIVE brand by the end of this month.

Corsair (Nasdaq: CRSR) is delighted to announce two new limited-edition cases joining the award-winning FRAME 4000D lineup. The FRAME 4000D Vault Series Nova and Galaxy models introduce color-shift paint finishes that change tone as light moves across the surface, creating a refined and subtle look that shifts with viewing angle and ambient lighting. Nova shifts from blue through teal to purple highlights, while Galaxy transitions from pink through green to gray, giving each case a distinct visual identity. Built on the FRAME 4000D foundation, both Vault Series models add a curated set of upgrades, including a compact PSU shroud that leaves space for a 120 mm fan on the case floor, a full tempered-glass side panel to showcase the build, and an upgraded front-panel I/O.

The front I/O has also been updated, now offering three USB Type-C connectors to make charging and connecting your devices easier, with the single yellow port supporting up to 20 Gbps and the two others at 5 Gbps. This front panel features a standard 3.5 mm audio jack and an ARGB power button, allowing users to match the lighting in their builds for an all-over aesthetic. This power button uses an MX-Style green mechanical switch for a satisfying feel, and can be swapped for another mechanical switch offering a different tactile feel. These limited-edition cases feature individually numbered aluminium badges riveted onto the top of the case next to the InfiniRail section.

NZXT, a leading brand in PC gaming components and prebuilt systems, today introduced the H2 Flow Mini-ITX Case and the C850 SFX Power Supply, two compact solutions designed to bring high-performance PC builds into smaller spaces without compromise. With a focus on airflow, compatibility, and ease of installation, these products make small form factor (SFF) systems more powerful and accessible than ever.

For players who want the performance and design of the H2 Flow without building it themselves, NZXT is also launching the H2 Mini PC, available for a limited time, exclusively in the United States. This prebuilt option delivers the same compact footprint and performance-focused design in a fully assembled, ready-to-play system, making small form factor PC gaming more accessible to a wider audience.

[Editor's note: You can read ourin-depth review of the NZXT H2 Flow Mini-ITX case here]

GXTrust expands its extensive gaming line-up with the launch of two new high-performance mice. Designed to bring precision, speed, and style to every session, the Felox+ Wired Gaming Mouse and the Felox+ Dual Wireless Illuminated Gaming Mouse give gamers the control and accuracy they need to master each and every game.

Get ready for freedom without compromise with Felox+ Dual Wireless Illuminated Gaming Mouse. Equipped with a PixArt PAW3311 12,000 DPI sensor and 1000 Hz polling rate, it guarantees precision and speed, whether playing wired or wirelessly. Gamers can choose their preferred connection via the ultra-low latency 2.4 GHz USB-A receiver or Bluetooth, and enjoy up to 40 hours of playtime thanks to the built-in rechargeable battery. There's even the option to keep on playing whilst charging with the included 1.5 m cable.

NVIDIA today announced a multiyear, multigenerational strategic partnership with Meta spanning on-premises, cloud and AI infrastructure. Meta will build hyperscale data centers optimized for both training and inference in support of the company's long-term AI infrastructure roadmap. This partnership will enable the large-scale deployment of NVIDIA CPUs and millions of NVIDIA Blackwell and Rubin GPUs, as well as the integration of NVIDIA Spectrum-X Ethernet switches for Meta's Facebook Open Switching System platform.

"No one deploys AI at Meta's scale—integrating frontier research with industrial-scale infrastructure to power the world's largest personalization and recommendation systems for billions of users," said Jensen Huang, founder and CEO of NVIDIA. "Through deep codesign across CPUs, GPUs, networking and software, we are bringing the full NVIDIA platform to Meta's researchers and engineers as they build the foundation for the next AI frontier."

Each week, new games and apps integrating NVIDIA DLSS, NVIDIA Reflex, and advanced ray-traced effects are released or announced, delivering the definitive PC experience for GeForce RTX players. This week, Styx: Blades of Greed and Star Trek: Voyager - Across the Unknown are launching with native support for DLSS 4 with Multi Frame Generation, while NORSE: Oath of Blood can be upgraded to DLSS 4 with Multi Frame Generation via the NVIDIA app.

And Battlefield 6: Season 2 begins today, featuring support for DLSS 4 with Multi Frame Generation. Read on for all the details.

SoftBank and AMD have started joint validation of AMD Instinct GPUs for next-generation AI infrastructure by focusing on a GPU partitioning mechanism that lets a single GPU handle multiple AI workloads simultaneously. SoftBank developed an Orchestrator system that divides AMD Instinct GPU resources based on workload requirements: model size, number of concurrent executions, and memory needs. The system splits compute workloads across multiple GPU instances running on individual Accelerator Complex Dies (XCDs). These can range from single instance mode (SPX mode) up to eight instances (CPX mode). The HBM memory pools are also divided into individual regions for each GPU instance to prevent latency spikes. The goal is to avoid the inefficiency of uniform GPU resource allocation, which can lead to GPU resource shortages or waste depending on workload demands.

SoftBank says the enhanced Orchestrator runs multiple AI applications on a single GPU with minimal resource strain. No performance figures have been shared yet, though SoftBank mentions improved resource allocation for small and mid-size language model workloads. The company also plans to explore similar orchestration for other AI accelerators beyond AMD. A live demonstration is planned at the AMD booth during MWC Barcelona 2026 in March 2-5. SoftBank also published technical details on architecture and Orchestrator management methods on its Research Institute of Advanced Technology blog. In a recent report, we noted that AMD's next-gen Instinct MI455X accelerators, set to compete with NVIDIA's Vera Rubin, are running into serious manufacturing problems that are pushing back AMD's roadmap. Only limited production is expected this year, with mass production pushed to Q2 2027.

KDE released Plasma 6.6 today, the latest version of the popular Linux desktop environment, also used in Steam Deck desktop mode. The biggest addition is the new Plasma Login Manager, a potential replacement for Simple Desktop Display Manager (SDDM) in distributions like Fedora Linux 44, CachyOS, and EndeavourOS. Note that it requires systemd, so it won't work on systemd-free distros. The Spectacle screenshot tool gains OCR capabilities, and a new USB portal lets sandboxed apps request access to USB devices. Users running Linux kernel 6.19 can now adjust the visual sharpness of all on-screen content. You can also turn your current Plasma setup into a global theme. KDE Plasma 6.6 adds XRandr emulation in KWin for better XWayland app compatibility, per-DRM-plane color pipeline support, and custom screen mode support in Wayland sessions. Screen mirroring is improved, and a new "Slow Keys" accessibility feature has been added.

Windows games with HDR running through Wine or Proton also get a color accuracy workaround. Wi-Fi passwords can now be stored in a root-owned location for better security, and a QR code in the Networks widget makes connecting easier. Battery handling on laptops is improved, ambient light sensor support enables automatic brightness adjustment, and colorblind user support has been enhanced. Windows can now be selectively excluded from screen recordings.

ASUS today announced ASUS ExpertBook B3 G2, a configurable Copilot+ PC designed for business, available in 14-inch and 16-inch models and featuring a durable, lightweight design starting from just 1.45 kg, a 180° lay-flat design, advanced AI capabilities, enterprise-grade security, and seamless collaboration.

Powered by up to the latest Intel Core Ultra 7 Series 3 processors with integrated GPU and NPU acceleration power, ExpertBook B3 G2's advanced AI features—including ASUS MyExpert, Microsoft Copilot+, and noise-canceling technology—enhance business productivity. The lightweight, easily-maintained design offers extensive I/O options and support for high-speed Wi-Fi 7 connectivity. Security is strengthened by ASUS ExpertGuardian, delivering NIST SP 800-193 compliance, dual-ROM recovery, and TPM 2.0 protection for robust data resilience.

Upgrade the standard 9.5 mm Ultra-Slim ODD bay into a removable U.2/U.3 NVMe SSD bay that delivers enterprise-class speed and reliability in limited space. Ideal for Dell, HP, and Lenovo business desktops, compact workstations, and industrial or government systems, the MB411V4PO-2B enables quick drive maintenance, secure data access, and flexible storage expansion for environments where uptime and serviceability matter. This conversion adapter enables quick drive maintenance, secure data access, and flexible storage expansion where uptime and serviceability are essential.

OCuLink 4i PCIe Gen 4 x4 - Native U.2/U.3 NVMe Performance
Equipped with a native OCuLink 4i (SFF-8612) interface, the MB411V4PO-2B connects directly to NVMe hosts for PCIe Gen 4 x4 performance, delivering up to 64 Gbps transfer bandwidth - over 10× faster than traditional SATA ODD interfaces (6 Gbps). This dramatic increase in throughput enables faster data migration, real-time backups, and improved workflow efficiency for business and industrial applications.

Razer, the world's leading lifestyle brand for gamers, proudly announces the launch of the Razer NiKo Collection, an exclusive line created in partnership with Counter-Strike (CS) icon Nikola "NiKo" Kovač. Built for competitive dominance and inspired by NiKo's relentless pursuit of victory, this collection brings pro-level performance and bold design to gamers worldwide.

A year into his tenure with Team Razer, this collection marks a long-awaited milestone for NiKo and his community. Crafted through an extensive development process, this collaboration was guided by authenticity and intention - built to meet the standards of one of the greatest players in CS history.

UK-based seating specialist, Boulies, a leader in high-performance ergonomic seating, today announces the launch of the EP500 ergonomic chair, designed to provide all-day comfort for work, rest or gaming with adjustable features and a wide 51 cm seat to suit users of all different heights and body shapes.

Designed for larger body types and personalized comfort, the Boulies EP500 has a wide 51 cm seat and is built for people from 165 cm to 190 cm, ensuring that it can support people of all body types and a wide range of users. Combined with the adjustable backrest height and seat depth adjustment, it allows users to personalize their seating position, ensuring ergonomic support for people of different heights and body shapes.