Alphacool International GmbH from Braunschweig is a pioneer in PC water cooling technology. With one of the most comprehensive product portfolios in the industry and more than 20 years of experience, Alphacool is expanding its lineup with the new ES RTX 6000 Pro Workstation / RTX 5090 Founders Edition and ES RTX 6000 Pro Server Edition - 1-Slot Design GPU coolers.

The Alphacool ES GPU water cooler for the RTX Pro 6000 Blackwell Workstation Edition is designed for performance-optimized server and workstation systems. Its compact 1.5-slot design and rear-mounted ports allow easy integration even in systems with limited space. The top cover is made of lightweight and durable carbon, reducing weight while providing a clean and premium appearance. The cooling block features an optimized cooling channel structure and is made entirely of chrome-plated copper. This particularly robust surface reliably protects against corrosion, scratches, and mechanical stress during continuous 24/7 operation.

The OfficePal KB70W takes your typing experience to a new level: With its gasket-mount design, polycarbonate positioning plate, PU damping and durable PBT keycaps, the keyboard offers smooth, quiet typing with keys that are pleasantly cushioned, yet highly responsive - just what you need for everyday use in the office. Thanks to the dual-mode operation, hot-swap switches and support for the VIA open-source software, it also adapts to the way you work—and not the other way around.

The gasket-mount design of the OfficePal KB70W significantly reduces noise and provides a typing feeling that is particularly smooth and comfortable. The OfficePal KB70W supports wired or wireless operation for maximum flexibility. Its long battery life ensures uninterrupted work for many hours. The abrasion-resistant PBT keycaps of the OfficePal KB70W are manufactured using the double-shot process and are therefore especially durable. In addition, the south-facing ARGB illumination ensures a uniform illumination of the keys.

GIGABYTE over the weekend introduced the Z890 AORUS Elite WiFi7 Plus and Z890 Eagle WiFi7 Plus motherboards. The two boards are timed to launch alongside Intel's new Core Ultra 5 250K Plus and Core Ultra 7 270K Plus "Arrow Lake-S" processors later this month, and come with out-of-the-box support for the new chips. Both boards come with GIGABYTE's Ultra Turbo Mode automated boost frequency and voltage offsets that are applied on top of Intel 200S Boost, on Core Ultra Series 2 "K" and "KF" unlocked processors. An interesting cost-cutting measure with both these boards is that they lack a pair of Thunderbolt 4 ports normally expected of Z890 motherboards, and instead wire out just a single 40 Gbps USB4 port.

The Z890 AORUS Elite WiFi7 Plus is the more premium model among the two, offering a 16+1+2 phase CPU VRM with 60 A DrMOS; while the Z890 Eagle WiFi7 Plus offers a 14+1+2 phase VRM. The AORUS Elite WiFi7 Plus offers 5 GbE wired LAN using a Realtek-sourced controller, while the Eagle WiFi7 offers a 2.5 GbE from a Realtek controller. Both boards offer Wi-Fi 7 and Bluetooth 5.4 using Intel WLAN modules, with the AORUS Elite WiFi7 Plus offering a 320 MHz Intel BE200NGW, while the Eagle WiFi 7 Plus offers a 160 MHz Intel BE202 (BE200NGW-M). Both boards offer a fairly decent onboard audio solution using a Realtek ALC1220 HDA codec and WIMA capacitors. Also, common to both boards are convenient SMD buttons on the rear I/O shields for power, reset, clear CMOS, and USB BIOS flashback. Both boards are expected to be priced around the $250-mark.

Intel's recently announced Core Ultra Series 3 "Panther Lake-H" mobile processor die-shot has been annotated by Kurnal Insights. "Panther Lake-H" is a disaggregated processor, just like its predecessor, "Arrow Lake-H," and "Meteor Lake," but Intel has followed a disaggregation plan resembling that of "Lunar Lake," where an SoC tile contains the CPU cores across both the main compute complex and low-power island; the NPU, and the processor's main integrated memory controllers; the Graphics tile contains the iGPU's number-crunching machinery, the Xe cores; while the I/O tile contains the chip's various platform I/O components.

The SoC tile is built on the Intel 18A foundry node. On the mainstream notebook "Panther Lake-H" processor variants, such as the one annotated below, the Graphics tile contains 4 Xe cores, and is built on the Intel 3 foundry node. On the ultraportable "Panther Lake-U" processor with powerful integrated graphics meant for devices lacking discrete GPUs, the Graphics tile has 12 Xe cores, and is built on the TSMC N3E node. The I/O tile continues to be built on the same TSMC N6 node as the ones on previous-generation "Arrow Lake" processors.

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ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, power supply units, and AIO liquid coolers, today introduced that its Z890I Nova WiFi R2.0, paired with two Kingston 4-rank DDR5 128 GB memory modules, has successfully enabled CQDIMM support through optimized circuit design and hardware and software tuning. The platform achieves DDR5-7400 MT/s operation with a total capacity of 256 GB, surpassing the DDR5-7200 MT/s limit commonly seen on most platforms today. This milestone represents a major breakthrough for high-capacity, high-bandwidth DDR5 memory applications.

CQDIMM is based on a 4-rank CUDIMM (Clocked Unbuffered DIMM) design, with a maximum capacity of 128 GB per module and a native speed of DDR5-7200 MT/s, addressing the long-standing challenge of balancing large memory capacity with high bandwidth. With CQDIMM support, the Z890I Nova WiFi R2.0 further pushes memory performance to DDR5-7400 MT/s, delivering a memory configuration that combines both high capacity and high performance to meet the demanding requirements of AI computing, content creation, and professional workloads.

Other World Computing (OWC), a trusted leader in high-performance storage, memory, connectivity, software, and accessories that empower creative and business professionals to maximize performance, enhance reliability, and streamline workflows, today announced storage and connectivity solutions for Apple's all new MacBook Neo.

It is always an exciting moment when Apple introduces a new Mac for the people who depend on these machines to get real work done," said Larry O'Connor, Founder and CEO of Other World Computing (OWC). "The MacBook Neo brings powerful capabilities into an incredibly portable form factor and much lower price, and that means professionals, students, and creators will want tools that travel just as easily and affordably while expanding what the system can do. With solutions like the OWC Travel Dock and our USB-C storage solutions, OWC makes it simple and affordable to connect more to the Neo and easily expand your storage so users can work anywhere without compromise."

CP156 is a ToughArmor series removable NVMe enclosure that fits into a standard external 3.5" drive bay. It allows two 7 mm U.2/U.3 NVMe SSDs to be mounted together on a single removable tray. Unlike traditional 2-bay designs where each SSD is removed separately, CP156 keeps both drives physically secured on the same tray. This ensures that:

• Drive order remains fixed
• Paired SSDs are never separated
• No accidental swapping during handling or transport

For RAID configurations, mirrored datasets, or application-specific SSD pairs, maintaining correct drive sequence is critical. CP156 eliminates the risk of mix-ups during physical movement.

Antec Inc., a global leader in high-performance computer components and accessories, proudly announces the launch of the Antec 900, a next-generation full-tower chassis engineered for Edge AI workloads, professional workstations, and high-end gaming systems. Designed for demanding computing environments, the Antec 900 provides a scalable platform for AI development, engineering, content creation, and 8K-capable gaming.

The Antec 900 supports ATX, E-ATX, SSI-CEB, and SSI-EEB motherboards, including AMD Threadripper systems, and is also compatible with back-connect motherboards for cleaner cable management and improved airflow. The spacious interior accommodates multi-GPU and accelerator configurations such as NVIDIA RTX 6000 Ada series GPUs. With support for graphics cards up to 495 mm in length and 160 mm in thickness, the chassis is built for the latest generation of high-performance hardware.

Other World Computing (OWC), a trusted leader in high-performance storage, memory, connectivity, software, and accessories that empower creative and business professionals to maximize performance, enhance reliability, and streamline workflows, today announced its unmatched roster of storage, connectivity, and expansion solutions for the newly announced Apple MacBook Pro with all new M5 Pro and M5 Max and MacBook Air with M5, as well as the Apple iPad Air, powered by M4 and Studio Display and all-new Studio Display XDR.

Chieftec is pleased to present our new high-performance ATX workstation chassis, BW-01B-OP. Designed with a timelessly elegant front panel and a modern door concept, it combines professional aesthetics with practical functionality. Its essential front I/O, including a USB Type-C port, ensures convenient connectivity for today's workflows.

Key Features

• Modern ATX workstation with a pre-installed 120 mm PWM HDB fan
• Supports radiators up to 360 mm
• Two tool-less 5.25" drive bays
• Features 3.5" and 2.5" tool-less trays for up to 10 SSD/HDD drives
• Easy-to-remove storage cage system

AAEON's UP brand has announced the release of the Intelli TWL01 Edge, an Industrial Multimedia PC with dual 4K displays, multiple mounting options, and a range of Intel Core Processor N-series CPUs (formerly Twin Lake). Built to provide a cost-effective platform for multimedia solution building, the Intelli TWL01 Edge hosts two HDMI 2.0b ports capable of dual simultaneous 4K displays. In addition to this, AAEON notes that the system's Intel Processor N-series platform grants users access to both Intel UHD Graphics and DirectX 12.1 graphics API support, for the purpose of leveraging interactive dashboard functionality, reduced frame latency, and more efficient video rendering for both smaller kiosk and video conferencing suite setups as well as commercial large-scale video walls and interactive billboards.

The Intelli TWL01 Edge is both compact at 152 mm x 124.5 mm x 39 mm and fanless, a design choice driven by market user requests for a system that can be discreetly installed and operate with minimal noise. Moreover, the system offers versatile mounting options, with DIN Rail, VESA, and wall mounting available, allowing the device to be securely mounted in high-vibration settings, clutter-free integration with monitors or kiosks, and even secure media control room cabinets. In the same vein, its environmental specifications make it a relatively safe option for industrial deployment, with a broad 9 V to 36 V power input range, as well as 8 GB of soldered LPDDR5 system memory.

ASUS Republic of Gamers (ROG) today announced a global campaign to kick off its 20th anniversary celebrations. From March 2 to April 13, ROG invites fans worldwide to celebrate by sharing content on social media and submitting their Dare-to-ROG stories via short-form videos. Entrants will complete actions and submit content types aligned with multiple fan levels (Level 1, 2, 3 and mega fans) to earn Gleam points and unlock different prize pools. ROG fans can submit their content to be eligible for a prize pool of over US $20,000.

In 2006, a group of passionate ASUS engineers joined forces to build incredible products for gamers like themselves. Out of their work, the Republic of Gamers was born. The shared love for gaming is—and always will be—the core spirit of ROG. Since then, ROG has armed gamers with high-tech PC gear crafted with vanguard spirit, dominant performance, and unmistakable attitude. The mission has never changed: to make the most powerful weapons on the battlefield for every gamer around the world.For more information, and to participate, visit this page.

Club 3D, a Dutch technology innovator specializing in advanced computer connectivity solutions since 1997, announced its newest connectivity solutions for March. These include 2 new adapters, a USB-C to RJ45 10G Ethernet Adapter and a USB-C to HDMI 2.1 Adapter. The Club 3D CAC-2505 is a premium USB-C to HDMI 2.1 adapter that delivers next-generation visual performance in a compact form factor. It is designed to future-proof your setup by enabling stunning 8K60Hz video output from any USB-C device supporting DP Alt Mode.

The Club 3D CAC-2531 is a professional-grade USB-C to RJ45 10G Ethernet Adapter that delivers blazing-fast 10 Gbps speeds to any mobile or desktop setup. It is designed to bridge the gap between ultraportable hardware and high-speed network environments while providing a compact, plug-and-play solution for data-heavy workflows.

MSI, a world-leading provider of high-performance gaming hardware, proudly announces its latest collaboration with Blizzard Entertainment to celebrate the launch of World of Warcraft: Midnight. Together, MSI and Blizzard introduce the limited edition MSI × World of Warcraft: Midnight GeForce RTX 5070 graphics cards, available in two distinct designs—Light Edition and Void Edition—bringing the legendary forces of Azeroth to life through cutting-edge performance and immersive visual storytelling.

Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio.

Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the FCE870Q Wi-Fi 7 and Bluetooth 6.0 module. The module's higher peak data rate of 5.8 Gbps, coupled with lower latency and strong network connection reliability, makes it ideal for over-the-top (OTT) services, high-definition video and augmented and virtual reality use cases.

Featuring 4K 4096 quadrature amplitude modulation (QAM), an advanced modulation technique in Wi-Fi 7 that increases data throughput by 20% compared to Wi-Fi6, the FCE870Q enables faster 4K and 8K streaming. Performance is also aided by the module's support for 320 MHz enhanced multi-link single radio (eMSLR) technology which enables the faster data rate alongside ultra-low latency. A highlight of this module is the integration of Bluetooth 6.0 featuring built-in Channel Sounding to enable enhanced ranging accuracy and advanced proximity-based applications.

Pulsar Gaming Gears, a leading developer of high-performance esports peripherals, in collaboration with Prodigy SEG, today announced the official launch of the Pulsar ZywOo The Chosen Mouse Gen 2 Limited Edition Pink. This new product launch aligns with a historic peak in the career of Mathieu "ZywOo" Herbaut. Recently crowned the World #1 Player for a record-breaking fourth time, ZywOo has officially become the most decorated individual in the history of the game. Coming off back-to-back championship wins at IEM Kraków 2026 and PGL Cluj-Napoca 2026, he has reached a career milestone of 30 HLTV MVP medals-shattering all previous records.

This new generation is the product of Pulsar's uncompromising eS standard, utilizing Pulsar's advanced in-house R&D and meticulous refinement to meet the exact competitive needs identified from the first generation. Designed for palm grip users, the mouse features a unique, refined shape co-created with ZyWOo, and two sizes, Mini 59 g, Medium 62 g to ensure the absolute control and consistency required for elite-tier competitive play. Speaking on the new iteration of the mouse, ZywOo emphasized the continuous drive for competitive perfection.

In February, TechPowerUp partnered with Fosi Audio to bring our readers from around the world a chance to grab one of 10 Fosi Audio C3 gaming-grade external sound cards with AI-powered DSPs. The Fosi Audio C3 is an external USB sound card (DAC + headphones amp) with a selection of parts purpose built for PC gaming. The C3 uses AI models to recognize key in-game sounds, such as footsteps, gunfire, reloads, and directional cues, and dynamically enhance what matters while reducing irrelevant or distracting noise. Rather than simply making certain frequencies louder, the system is designed to identify and prioritize important sounds depending on the gameplay context. The Giveaway is now close, and the results are in! Without further ado, here are the 10 winners!

• ShurikN from Serbia
• Bryan from Singapore
• Khusanbek from the United Kingdom
• Russel from Australia
• ushirlo from Croatia
• Yu-Jie from the United States
• Markus from Germany
• FatherOBlivion from the United States
• Xin Qi from the Netherlands
• azarel from Denmark

Huge congratulations to all 10 of you! TechPowerUp and Fosi Audio will return with more such interesting Giveaways!

AMD earlier today announced the Ryzen AI 400 series desktop APUs in the Socket AM5 package. These are the company's second desktop APU generation on Socket AM5 following the Ryzen 8000G series "Phoenix Point." While "Phoenix Point" is based on "Zen 4," the newer Ryzen AI 400 series is built on the "Gorgon Point" silicon powered by the "Zen 5" microarchitecture. A key difference between the two APU generations is the emphasis on AI performance. "Gorgon Point" packs an XDNA 2 NPU with 50 TOPS of throughput on tap, making Ryzen AI 400 series the first socketed desktop processor that meets Microsoft Copilot+ requirements.

While "Phoenix Point" featured a single CCX design with up to eight full-sized "Zen 4" cores, "Gorgon Point" reverts to a dual-CCX design for its CPU complex. The first CCX features four full-sized "Zen 5" cores that can boost up to the maximum rated speed of the APU model, along with 8 MB of L3 cache that's shared among the four "Zen 5" cores. The second CCX features four compacted "Zen 5c" cores, with an 8 MB L3 cache shared among them. "Zen 5c" is a physically compacted version of "Zen 5," it has an identical IPC and ISA, but it caps out at roughly two-thirds the maximum boost frequency of the full-sized "Zen 5" cores. For threads to migrate between the two CCX, their instructions and data make a trip through the chip's Infinity Fabric interconnect, just like it was during the old "Zen 2" architecture days.

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Montech today unveiled the Beta 2 line of mainstream ATX 3.1 power supplies. These PSUs are designed to meet ATX 3.1 and PCIe 5.1 CEM specifications, providing mainstream-thru-performance segment gaming PC builds with a modern PSU architecture. These come in four variants based on output, 550 W, 650 W, 750 W, and 850 W. All four offer 80 Plus Bronze-rated switching efficiency. All four models come with fixed cabling, which comprises individually-sleeved wires for each cable.

The PSUs feature single +12 V rail design, DC-to-DC switching, and most common electrical protections. All four use 120 mm hydro-dynamic bearing fans, and a Japanese-made main capacitor. All four models come with 24-pin ATX and two 4+4 pin EPS connectors. The 550 W, 650 W, and 750 W models come with two 6+2 pin PCIe power connectors (which meet ATX 3.1 excursion specs); while the 850 W model offers a 450 W-rated 12V-2x6 connector besides two 6+2 pin PCIe power. Montech is backing all four models with 5-year warranties. The 550 W model is priced at $49.90, the 650 W model at $59.90, the 750 W model at $63.90, while the 850 W model goes for $69.90.

MSI, a leading global provider of high-performance server solutions, is showcasing its latest AI-vRAN solutions at MWC 2026 (Booth #5A61) to address the evolving requirements of next-generation telecom networks. MSI's AI-vRAN stack, integrated with GPU server solutions, is designed to bring AI capabilities into the core of network operations, supporting growing telecommunications workloads and accelerating the transition toward AI-powered mobile networks.

"AI is rapidly reshaping the telecommunications landscape, and MSI is focused on helping operators build scalable network architectures that support diverse applications, including voice, data, video streaming, and AI workloads, through a unified infrastructure," said Danny Hsu, General Manager of Enterprise Platform Solutions at MSI. "This AI-powered vRAN architecture delivers greater flexibility for 5G and future 6G deployments while accelerating time-to-market for new services."

We've known for a while now, that Intel's early-2026 refresh of its Core Ultra series-2 "Arrow Lake" desktop processor lineup could see a refresh with the Core Ultra 5 250K Plus and Core Ultra 7 270K Plus, with reviews tentatively going live on March 23. VideoCardz reports that the company could unveil these chips close to two weeks earlier than that, on March 11. This would probably be when the company announces the two chips and reveals some of their specs. Reviews could remain on track for March 23, with retail availability of the chips shortly after. There's no confirmation yet on whether the two chips have "KF" variants lacking integrated graphics, but that's fairly likely.

Both SKUs see increases in CPU core counts and L3 cache sizes compared to current SKUs leading the Core Ultra 5 and Core Ultra 7 brand extensions. The Core Ultra 5 250K Plus is a 6P+12E chip, with a generous 30 MB of shared L3 cache; while the Core Ultra 7 270K Plus maxes out the "Arrow Lake-S" silicon, enabling all 8 P-cores, and all 16 E-cores, with all 36 MB of shared L3 cache available; albeit with slightly lower clock-speeds than the flagship Core Ultra 9 285K. Intel reportedly dropped plans to launch the fabled "Core Ultra 9 290K Plus," which would have been a supercharged variant of the 285K with even higher clock speeds.

Micron Technology, Inc. celebrated the grand opening of its semiconductor assembly and test facility in Sanand, Gujarat, India. The state-of-the-art facility converts advanced DRAM and NAND wafers from Micron's global manufacturing network into finished memory and storage products. Once fully ramped, the first phase of Micron's Sanand operation will feature more than 500,000 square feet of cleanroom space, making it one of the world's largest single-floor assembly and test cleanrooms. The site serves customers worldwide to meet the growing global demand for memory and storage fueled by AI.

The facility represents a combined investment of approximately $2.75 billion by Micron and its government partners, advancing semiconductor manufacturing capabilities in India. Micron Chairman, President and CEO Sanjay Mehrotra and other executives witnessed the opening ceremony with Prime Minister Narendra Modi, Chief Minister of Gujarat Bhupendra Patel, Union Minister for Railways, Communications, Electronics & IT Ashwini Vaishnaw, U.S. Ambassador to India Sergio Gor and other distinguished government officials and guests.

GIGABYTE Technology, a global leader known for its engineering excellence in high-performance computing and AI servers, extends its comprehensive end-to-end AI infrastructure portfolio designed specifically for the telecommunications industry at MWC 2026. GIGABYTE's end-to-end product solutions enable operators to convert massive volumes of network data into intelligence, automation, and new revenue streams, as telecommunications networks evolve from data carriers into AI-powered digital platforms.

At the core of the telco-to-AI transformation is the AI Factory, where network and subscriber data are converted into operational intelligence and commercialized AI services. GIGABYTE addresses this need with GB300 NVL72, a liquid-cooled rack-scale platform integrating 72 NVIDIA Blackwell Ultra GPUs and 36 NVIDIA Grace CPUs in a single system. Connected via NVIDIA Quantum-X800 InfiniBand or NVIDIA Spectrum-X Ethernet and NVIDIA ConnectX -8 SuperNIC s, GB300 NVL72 is optimized for large-scale AI training and inference workloads, enabling operators to automate operations, optimize network planning, and deploy AI-driven services at telecom scale.

At MWC 2026, Lenovo introduces a new generation of adaptive AI devices and forward-looking concepts designed for business professionals, creators, students, and gamers. Headlined by new modular PC architecture, a glasses-free 3D laptop concept, a foldable gaming handheld device, and the initial rollout of Lenovo Qira, Lenovo's showcase reflects a broader shift in personal computing toward systems that adapt intelligently to people and their environments. Across its portfolio, Lenovo continues to focus on delivering technology that is more personalized, proactive, and protected, while building a unified AI ecosystem that works naturally across devices.

"The AI era will not be defined by a single device or application, but by intelligent systems that work seamlessly across everything we use," said Luca Rossi, President, Intelligent Devices Group, Lenovo. "We are demonstrating how Lenovo and Motorola are bringing that vision to life, combining adaptive hardware innovation with a single, unified system-level AI integration that works naturally across PCs, smartphones, tablets, wearables, and beyond. From premium mobile devices and transformative form factors, to the rollout of Lenovo Qira, we are building the widest AI portfolio that delivers more connected, more intuitive personal computing experiences designed around people."

ACEMAGIC's K1 Mini PC, powered by Intel's 12th Gen Core i5-12600H, is currently available at a substantial discount on Amazon US. Originally priced at $579.99, the system is now listed at $399.99, with an additional 10% off promo code bringing the final price down to $359.99. The promotion runs from February 4, 2026 (04:00 PST) through March 31, 2026 (23:59 PST).

Alder Lake-H Performance in a Compact Form Factor
The ACEMAGIC K1 is built around the Intel Core i5-12600H, a 12-core (4P + 8E) / 16-thread processor based on Intel's Alder Lake architecture. With boost clocks up to 4.5 GHz, the chip offers significantly higher multithreaded performance compared to typical low-power U-series mini PC CPUs, and even outpaces processors such as the i5-12450H in many workloads.

To purchase from the United States, visit this page (Amazon link).

To purchase from Canada, visit this page (Amazon Canada link).