GMKtec unveiled its next-generation EVO-T2 Desktop AI Supercomputer Series during Intel's 3rd-Generation Core Ultra processor launch event in Shanghai. Powered by Intel Core Ultra X9 388H and X7 358H processors based on the Panther Lake architecture, the EVO-T2 delivers up to 180 TOPS of AI computing power, positioning it as one of the most powerful desktop AI mini PCs available.

The system integrates Intel's latest 18A (1.8nm-class) manufacturing technology, featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery, marking a major milestone in Intel's semiconductor roadmap.

8BitDo is adding another variant to its Retro R8 mouse lineup, this time drawing inspiration from the Commodore 64. Like the previous R8 models, the C64 Edition keeps the same internals: a PAW 3395 optical sensor with six DPI levels between 50 and 26,000 DPI, and polling rates up to 8,000 Hz over wired and 4,000 Hz over 2.4G (Bluetooth is capped at 125 Hz). The symmetrical design supports both left and right-hand use, and four programmable side buttons can be configured through the 8BitDo Ultimate Software. The switches haven't been specified for this variant. The NES-inspired N Edition uses Kailh Sword GM X micro switches, but 8BitDo hasn't confirmed whether the C64 Edition carries the same.

The mouse ships with a charging dock that doubles as a wireless signal extender, which is a nice touch. Battery life is rated at 100 hours over Bluetooth or between 26 and 105 hours on 2.4G depending on polling rate, with a full charge taking around 2.5 hours. All three connection modes are supported: Bluetooth LE 5.3, 2.4G wireless, and wired USB. The 8BitDo Retro R8 C64 Edition mouse is priced at $49.99, in line with the existing NES-inspired N Edition.

As PC hardware continues to grow more powerful, builders are no longer hiding their systems under desks. The new SAMA V62 is designed for users who want their build on display, combining curved panoramic glass, bold integrated lighting, and strong cooling support in a clean, builder-friendly chassis. With seven pre-installed ARGB fans and support for large radiators, the V62 delivers both visual impact and thermal performance straight out of the box.

A Clear 270° Panoramic View
The V62 features a curved tempered glass panel that creates a sweeping panoramic view of the system's interior. The smooth curve removes harsh edges and visual breaks, offering a clean, uninterrupted look that highlights modern components and lighting setups. It's a design typically found in higher-priced showcase cases, now made more accessible for everyday builders.

Samsung is reportedly planning to bring its 2 nm process to the base die of HBM4E, its 7th-generation high-bandwidth memory. This comes just a month after the company shipped the industry's first commercial HBM4, and alongside a separate effort to redesign the HBM4E power delivery network to handle the increase in power bumps from 13,682 to 14,457 within the same footprint. Until HBM3, the base die had a somewhat passive role, sitting at the bottom of an HBM stack and handling power and signal control. Starting with HBM4, it took on a more active role by handling some compute tasks directly, making the underlying process node increasingly important. For HBM4, Samsung already had an edge here, using 4 nm logic base dies from its own foundry paired with its latest 1c DRAM, well ahead of the 12 nm (N12) process SK hynix sources from TSMC. Moving to 2 nm for HBM4E would extend that lead further, improving power efficiency, thermal management, and area utilization.

The other key players in the industry are also focusing on custom HBM4E as the next battleground, with TSMC stating it plans to use its 3 nm process for custom HBM4E, and SK hynix also working on its own variant. With its latest 2 nm node push, Samsung appears to be making a deliberate move to stay a step ahead on process technology. Standard HBM4E is expected mid-year, with custom product tape-in following in the second half of the year. The Business Korea report also points to the foundry angle. Producing HBM base dies internally helps Samsung Foundry keep fab utilization high, and the 2 nm node is expected to play a major role in ramping production at the Taylor fab in Texas. There, equipment installation is already underway, with the first wafer tape-in targeted before year-end.

Imec, a world-leading research and innovation hub in advanced semiconductor technologies, has launched a first of its kind consortium with 26 European university groups that will jointly work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and chip architecture research for the next generation of chips. The consortium will benefit from the NanoIC pilot line, turning academic insights into industry-focused innovations. In the future, similar consortia will be set up around advanced materials and alternative compute systems.

CMOS 2.0 refers to a new paradigm, introduced by imec, that expands the chip making toolbox beyond traditional transistor scaling and its associated scaling challenges. CMOS 2.0 allows for more design flexibility by exploiting fine-grain wafer stacking technology to improve on-chip connectivity and offer higher technology heterogeneity to the system. It will result in tailored chips comprising multiple 3D-stacked layers that fulfil smartly partitioned functions. In that way, CMOS 2.0 will provide advanced, versatile 3D stacked platforms that push the boundaries of compute performance.

Acer Inc. (TWSE: 2353) announced its financial results for the fourth quarter of 2025 and fiscal 2025 ended December 31. In the fourth quarter, Acer reported consolidated revenues of NT$74.36 billion, up 12.6% YoY; gross profits of NT$8.59 billion, up 23.6% year-on-year (YoY) with 11.6% margin; operating income of NT$1.87 billion, up 82.3% YoY with 2.5% margin; and net income of NT$1.07 billion with earning-per-share (EPS) of NT$0.36.

For the full year of 2025, consolidated revenues reached NT$275.63 billion, up 4.1% YoY; gross profits of NT$29.99 billion, up 7.1% YoY with 10.9% margin; operating income of NT$5.14 billion, up 5.5% YoY with 1.9% margin; and net income of NT$3.78 billion with earning-per-share (EPS) of NT$1.26.

Silicon Motion Technology Corporation (NasdaqGS: SIMO), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced the launch of the SM8008, a PCIe Gen 5 x4 NVMe enterprise SSD controller purpose-built for data center boot drives and power-sensitive enterprise storage applications.

As hyperscale and enterprise data centers expand server deployments, boot SSDs have become a critical infrastructure component across every system node. The SM8008 addresses this growing demand with a controller architecture optimized for power efficiency, predictable performance, and enterprise-grade security at scale, while supporting the OCP Hyperscale NVMe Boot SSD Specification to meet production-ready enterprise deployment requirements.

Avalue Technology Inc. (TPEx: 3479.TWO) has officially launched the new EAX-R680BP ATX industrial motherboard, which is centered around a highly expandable platform architecture. Supporting the next-generation Intel Core Series 2 processor, it offers flexible dual PCIe Gen 5 card configuration capabilities. Designed for AI inference, high-performance computing, and data-intensive storage applications, the EAX-R680BP empowers system integrators and enterprise users to build computing platforms that balance performance, scalability, and long-term stability.

As edge AI, smart manufacturing, and data-driven applications continue to grow, the need for high-bandwidth expansion and computational acceleration in system architectures becomes ever more apparent. The EAX-R680BP industrial-grade motherboard from Avalue features an ATX form factor design that fully leverages the advantages of expansion flexibility and versatility. When combined with the Intel Core Series 2 processors, the EAX-R680BP motherboard provides a stable and scalable hardware foundation for a variety of applications. Thanks to its PCIe Gen 5 high-speed channel design, the motherboard can support the simultaneous operation of multiple GPUs or high-performance expansion cards, meeting the performance density demands of next-generation AI and edge computing.

MSI proudly introduces its latest generation of motherboards, purpose built to pair seamlessly with the new Intel Core Ultra 200S Plus Series processors. MSI 800 Series (Z890/B860/H810) motherboards are engineered to unlock the full potential of the newest desktop architecture, delivering and improved overall performance compared to the existing Intel Core Ultra Series 2 desktop processors. This ensures you can build a powerful, reliable system tailored to your needs.

"MSI bridges the gap between Intel's cutting-edge architecture and the high-speed demands of modern users. By pairing Intel's new Core Ultra 200S Plus Series Processors with its increased core counts and 5.5 GHz clock speeds, MSI's robust 16-phase Duet Rail Power System on the MAG Z890 TOMAHAWK WIFI II, we've created a platform that doesn't just run the latest games; it masters them. This is the definitive foundation for the next generation of high-performance computing", said James Yeh, VP, Computing & Display Group, MSI.

MSI today announces that its AI gaming desktops, the MEG Vision X AI and MPG Infinite X3 AI, are now equipped with the latest Intel Core Ultra 200S Plus Series processors (Arrow Lake-S Refresh). Featuring up to the Intel Core Ultra 7 270K Plus with 24 cores (8P+16E) and a 5.5 GHz max boost clock, these updated systems deliver faster gaming performance and significantly improved multitasking.

Performance Refined with Intel Core Ultra 200S Plus Series
The Intel Core Ultra 200S Plus Series brings targeted but meaningful upgrades over its predecessor—adding 4 more cores on both the Ultra 7 and Ultra 5 CPUs, a +200 MHz bump on P-Core all-core frequencies, and official DDR5-7200 MT/s memory support. The result is approximately 9% faster gaming performance compared to the previous generation, alongside massive leaps in multithreaded workloads—making these systems a compelling choice for gamers and creators who multitask heavily across streaming, editing, and gameplay simultaneously. The processors remain fully compatible with Intel 800 Series chipsets, meaning users get a meaningful performance uplift without any platform overhaul required.

Leading gaming accessories maker Turtle Beach Corporation (Nasdaq: TBCH), today revealed its newest variants in its award-winning line-up of Victrix fighting game gear, the new Victrix Pro KO Leverless Fight Stick - Street Fighter II: Champion Edition. The fully customizable Victrix Pro KO Leverless Fight Stick - Street Fighter II: Champion Edition is officially licensed by Sony Interactive Entertainment and Capcom and emblazoned with a bold new look celebrating the golden era of gaming. The Street Fighter II: Champion Edition design features the legendary Street Fighter Player Select screen as well as its iconic fighters Ryu and Chun-Li on the faceplate. And whether you choose Ryu, Chun-Li, or other favorite characters, you're still equipped to claim more victories in your chosen arena.

The Victrix Pro KO Leverless Fight Stick was named as the "2024 Best Tech" at the EVO Awards ceremony that recognizes excellence within the global fighting game community. Today, it remains the choice of gaming champions because it's designed and crafted to the highest standard with premium features and components. Hot swappable Cherry MX Speed Silver RGB switches, customizable RGB lighting, a removable aluminium top plate, and up to 16 moveable and mappable buttons give players total control over their gaming experience.

Display specialist AOC introduces the AOC 16T20E2, a compact and lightweight portable monitor designed for professionals, digital nomads, and hybrid workers who demand visual clarity and flexible connectivity wherever they work. Featuring a 15.6" (39.6 cm) Full HD IPS panel with wide 178°/178° viewing angles and a 1000:1 contrast ratio, the 16T20E2 delivers sharp, colorful visuals in a sleek, ultraportable form factor.

Ultraslim, ultra-light, ultraportable
At just 9 mm thin and weighing approximately 1 kg without its magnetic cover, the AOC 16T20E2 is one of the slimmest and lightest portable monitors on the market. It fits effortlessly into any backpack, laptop bag, or carry-on, making it the ideal companion for users who need a reliable second screen on business trips, at co-working spaces, in hotel rooms, or during client presentations. The display surface features 3H hardness for scratch resistance, ensuring durability even on the go.

A $2.7 billion (£1.97 billion) lawsuit against Sony has gone to trial in London, on behalf of around 12 million UK PlayStation users. Sony is accused of abusing its dominant market position by forcing digital game and add-on purchases exclusively through the PlayStation Store, keeping prices artificially higher than physical alternatives. The case is being heard at the Competition Appeal Tribunal and is led by Alex Neill, who has stated that "gamers have paid too much and they should get some money back." The claim was previously valued at up to $6.7 billion (£5 billion) before being revised down to its current figure. The case follows a similar pattern to other recent UK tech lawsuits. A comparable class action against Steam on behalf of 14 million users was cleared to proceed last month, and Apple was found in October to have abused its dominant position over App Store commissions, a ruling it is currently appealing.

Sony is fighting back, arguing it has invested years and billions into an integrated gaming platform that operates in a competitive market alongside Nintendo and Xbox, both of which use similar closed storefronts. Its lawyers contend that the margins earned on digital game sales aren't excessive and that the lawsuit fails to account for Sony's costs and the value of its platform. The company also frames the claimants' position as essentially demanding that third parties be allowed to sell on PlayStation while free-riding on the Sony infrastructure. If successful, the roughly 12.2 million eligible users, anyone who bought a digital PlayStation game or in-game download over the past ten years, would receive an estimated $217 (£162) each, on an opt-out basis.

Advantech (2395.TW), a global leader in industrial IoT, today announced an expanded collaboration with Qualcomm Technologies, Inc. to accelerate the deployment of generative AI (GenAI) at the edge. This collaboration centers on Advantech adopting the Qualcomm Dragonwing AI on-prem appliance solution, powered by Qualcomm Cloud AI 100 Ultra accelerator into the Advantech SKY-641E3 4U high-performance edge server. By utilizing a specialized PCIe switch backplane, this solution provides the high-bandwidth connectivity required to unlock the full potential of high-density AI inference for enterprise and industrial verticals.
Unmatched Inference Density for Massive Concurrency

Unlike standard dual-slot GPU servers, the SKY-641E3 is architected specifically for maximum inference throughput. By supporting up to 12 single-slot FH/FL accelerators within a single 4U chassis, it offers a superior density-to-footprint ratio. This configuration is optimized for high-concurrency edge workloads, such as city-wide intelligent video analytics or large-scale retail AI agents, allowing for the simultaneous processing of hundreds of real-time data streams without the thermal overhead of power-hungry training GPUs.

Acer today unveiled a new lineup of TravelMate Copilot+ PCs that empower organizations of all sizes to unleash the full potential of AI. The new TravelMate P4 14 AI, TravelMate P4 Spin 14 AI, TravelMate P2 16 AI, and TravelMate P2 14 AI business laptops are powered by up to the latest Intel Core Ultra Series 3 processors with Intel vPro, delivering real-world performance, long battery life, enterprise-grade security, and simplified manageability.

From SMBs to the public sector, the new lineup delivers a combination of performance, productivity, and security. The devices also represent the first Copilot+ PCs in the TravelMate P4 and P2 series, underscoring Acer's commitment to offering a robust commercial portfolio of AI-ready devices.

NVIDIA has released GeForce driver version 595.79 WHQL, adding Game Ready support for Crimson Desert and Death Stranding 2: On the Beach. On the bug fix side, three game-specific crashes are resolved. Crimson Desert and Star Citizen were both crashing on launch, and Resident Evil Requiem had a white glowing dots issue when Subsurface Scattering was enabled. Two general fixes are also included in this release. First is the one addressing GPU voltage being incorrectly capped when overclocked (previously resolved in GeForce Hotfix Display Driver version 595.76), and another fixing intermittent crashes or driver timeouts when playing multi-key DRM content in a browser on HDCP 1.x monitors.

Known issues still present include missing terrain in some areas of Enshrouded and occasional stutter in Arknights: Endfield. The release also adds G-Sync support for a batch of new monitors from Acer, AOC, ASUS, GIGABYTE, LG, MSI, Philips, and ViewSonic.

DOWNLOAD: NVIDIA GeForce 595.79 WHQL

Applied Materials, Inc. today announced it is working with Micron Technology to develop next-generation DRAM, high-bandwidth memory (HBM) and NAND solutions that increase the energy-efficient performance of AI systems, bringing together advanced R&D capabilities from Applied's EPIC Center in Silicon Valley and Micron's state-of-the-art innovation center in Boise, Idaho to strengthen the semiconductor innovation pipeline in the United States.

"Applied Materials and Micron have a long-standing partnership focused on driving higher performance and more energy-efficient advanced memory chips by pushing the boundaries of materials engineering and manufacturing innovation," said Gary Dickerson, President and CEO of Applied Materials. "We are excited to deepen our collaboration with Micron as a founding partner at the EPIC Center as next-generation memory technologies play an increasingly vital role in the future of AI systems."

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300 mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade.

"As AI workloads continue to increase package size, power density, and integration complexity, we believe new materials foundations will be increasingly important to extend advanced packaging roadmaps," said Elif Balkas, Chief Technology Officer at Wolfspeed. "Our 300 mm silicon carbide platform is designed to align SiC's material advantages with industry‑standard manufacturing infrastructure and expand the solution space for next‑generation AI and HPC packaging architectures."

As OpenClaw gains global traction, AI agents are reshaping productivity. Yet, many users face technical hurdles in deployment, from system setup to driver configuration. Beelink bridges this gap with a full-stack AI solution: ranging from exclusive "Lobster Red" models with preinstalled OpenClaw to dual-OS switching versions and plug-and-play SSD upgrade kits. This comprehensive lineup meets diverse user needs while significantly lowering the barrier to AI deployment.

1. New Hardware: Preinstalled OpenClaw Series—AI-Ready Out of the Box
Featuring a premium all-metal chassis in exclusive Lobster Red, these new models offer a distinctive look built for the AI era.

Razer, the leading global lifestyle brand for gamers, today unveils Dynamic Haptics, a new dual-source haptic system that unifies developer‑authored Razer Sensa HD Haptics effects with Audio‑to‑Haptics (A2H). Dynamic Haptics delivers a richer and more consistent haptic landscape across both handcrafted gameplay moments and the ambient world.

A New Level of Haptic Detail
For decades, immersion in games has been defined by what players see and hear. Higher resolutions, faster refresh rates, and spatial audio have pushed realism forward, but often stop short of one critical element: physical sensation.

At Embedded World, MediaTek unveiled a range of new Genio platforms ideal for powering a wide variety of IoT products and applications: MediaTek Genio Pro, Genio 420 and Genio 360. The Genio Pro series is MediaTek's premium offering for high-performance IoT and embedded offerings, while Genio 420 and Genio 360 bring efficient system-level edge AI performance to smart home, retail, industrial, and commercial IoT devices.

With its impressive AI, multimedia, and display capabilities, along with rich OS support, Genio Pro enables OEMs to develop the next generation of autonomous mobile robotics, commercial drones, edge AI devices, machine vision systems, and transportation and logistics platforms.

IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) today announced a collaboration aimed at developing new processes and materials to support sub-1 nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and High-NA EUV lithography processes to advance IBM's logic scaling roadmap.

IBM and Lam have collaborated for more than a decade to advance logic fabrication, notably enabling early generations of 7 nm, nanosheet, and EUV process technologies. Under this new five-year agreement, the companies intend to extend logic scaling to the sub-1 nm node. The work will focus on developing new materials, advanced etch and deposition capabilities for increasingly complex device architectures, and new High-NA EUV lithography processes to enable next-generation interconnect and device patterning and accelerate industry adoption.

Nightdive Studios—renowned video game remaster developer and subsidiary of Atari—is thrilled to announce that SiN: Reloaded, the long-awaited remaster of the 1998 cult classic FPS, will launch in 2026 for PC and consoles. This faithful new edition of SiN boasts enhanced remastered visuals, modernized control schemes, and includes the Wages of SiN extra mission pack. It's time to pay for your sins, #$!%&!

Set in a near-future dystopian world, SiN: Reloaded puts you in control of security consultant Colonel John R. Blade as you take on the seductively evil Doctor Elexis Sinclaire. When Elexis, CEO of SinTEK Industries, begins injecting the streets with a DNA-altering drug, it's time to reassess the laws of morality by facing off against Elexis' unholy army of genetically-engineered mutants. Known for pushing the Quake II engine to its limits, the original SiN was lauded for introducing a groundbreaking amount of interactivity in every level. Players can hack their way into computer terminals using DOS-style code, use elevators and security cameras to wreak havoc, and traverse levels using a variety of vehicles, including a forklift, a patrol boat, and a helicopter. Your actions have consequences, creating branching paths as the game progresses.

AMD has released Ryzen Chipset Driver version 8.02.18.557, a maintenance update focused on bug fixes and restoring a couple of components that went missing in a previous package. Specifically, support for the AMS Mailbox driver and the S0i3 filter driver are back, both needed for power management and system communication on supported Ryzen platforms. A few known issues are still present. Users on chipset installer version 7 can't directly roll back to version 6 or older. If you need to do that, you'll have to uninstall the newer installer first, delete the Qt_Dependencies folder, and then install the older package.

Other minor fixes include driver names showing up in English on non-English operating systems, occasional failures when installing or upgrading the Ryzen PPKG component, and some compatibility issues with the AMS and S0i3 filter drivers on non-English OS environments.

DOWNLOAD: AMD Chipset Software 8.02.18.557

At Embedded World 2026, Intel launched the Intel Core processor Series 2 with P-cores, an industrial-ready platform engineered for mission-critical edge applications. Intel also announced its latest Edge AI suite for Health & Life Sciences, providing validated reference pipelines and benchmarking tools for AI-powered patient monitoring solutions.

"Intel continues to lead in edge computing, which remains one of our fastest-growing business segments," said Dan Rodriguez, Intel corporate vice president and general manager of the Edge Computing Group. " With the introduction of Core Series 2, our CES launch of Core Ultra Series 3, and our expanding Edge AI Suites, we continue to deliver comprehensive platforms that meet diverse edge customer needs with breakthrough performance, reliability, and integrated AI acceleration."

MONTECH, a global leader in PC cases, power supplies, and cooling solutions, proudly announces the launch of SKY 3, the next evolution of its iconic SKY series PC cases. SKY 3 introduces a reimagined modular internal architecture and integrated horizon lighting, designed to meet the demands of next-generation hardware while delivering a remarkably clean and adaptable build experience. With support for back-connect motherboards and next-gen GPUs, SKY 3 blends future-ready performance with refined, modern aesthetics.

Adaptive Modular Bottom Chamber
At the heart of SKY 3 is an innovative adaptive modular bottom chamber, featuring a fully swappable PSU compartment and bottom fan bracket that allow builders to customize internal layouts based on cooling priorities. In GPU Mode, intake fans are positioned directly beneath the graphics card to maximize static pressure and cooling efficiency. In CPU Mode, airflow is redirected toward the motherboard area, helping dissipate heat from VRMs and surrounding components while supporting stable CPU operation. This flexible design empowers users to tailor airflow behavior to their specific system configuration.

[Editor's note: Our in-depth review of the Montech Sky 3 is now live]

Akasa, a leading provider of thermal solutions, announced the Pascal MX, an IP65-rated dust-tight and water jet resistant aluminium fanless case designed for Mini-ITX and Thin Mini-ITX motherboard systems operating in industrial, outdoor or mission-critical environments. The Pascal MX addresses one of the core challenges in harsh-environment embedded computing: maintaining system reliability where conventional fan-cooled cases fail due to dust ingress and moisture. For engineers and system integrators attending Embedded World 2026 in Nuremberg from 10 to 12 March, the Pascal MX will be on display at Hall 1, Booth 640, alongside Akasa's wider range of fanless cases, CPU coolers, heatsinks, and thermal solutions.

At the heart of the Pascal MX is Akasa's patented spring-loaded CPU mounting system, which maintains consistent, uniform contact pressure across all supported sockets (Intel LGA1851, LGA1700, and LGA1200). This enables the same chassis to support Intel Core processors from 10th-14th Generation and the latest Intel Core Ultra (15th Gen) processors, all at up to 65 W TDP. Heat from the CPU and M.2 2280 SSD is conducted into the aluminium chassis via dedicated thermal modules, dissipating passively through the external fins. With no fans and no moving parts, the Pascal MX eliminates the primary sources of mechanical failure and particulate ingress that limit system uptime in demanding deployments.

Factory automation, physical AI in mobile robotics, and other AI-driven edge applications are rapidly evolving and driving the need for computing platforms that provide real-time AI processing, deterministic performance, and long-term reliability in always-on environments.

To meet these needs, AMD is expanding its AMD Ryzen AI Embedded P100 Series processor portfolio. New processors feature up to 2x higher CPU core counts, up to 8x higher graphics processing unit (GPU) compute, and an estimated 36% higher system tera operations.

ASRock Industrial announces new industrial motherboards supporting AMD EPYC 4005/4004, Ryzen 9000/8000/7000, and Ryzen Embedded 9000/7000 Series processors, expanding its platform portfolio across IMB-A1700, IMB-A1302, IMB-A1003, and IMB-A1002. Powered by AMD EPYC 4005 Series processors with up to 16 cores and 32 threads, delivering high-performance and energy efficiency for edge servers and enterprise workloads, alongside Zen 5-based Ryzen 9000 Series for exceptional computing power and Ryzen Embedded 9000 Series for long-term availability in reliable edge computing. Supporting ATX, microATX, and Mini-ITX form factors, these platforms feature DDR5 memory, PCIe Gen 5 expansion, multi-display capability, and rich industrial I/O to enable flexible system designs for computer vision, video analytics, AI-enhanced workloads, software development, gaming platforms, and professional-grade productivity systems.

IMB-A1700 Series: ATX Motherboard for high-performance
The IMB-A1700 ATX motherboard supports AMD EPYC 4005/4004, Ryzen 9000/8000/7000, and Ryzen Embedded 9000/7000 Series processors, delivering robust computing performance for demanding workloads. The board features four DDR5 5600 MHz ECC/non-ECC U-DIMM slots supporting up to 256 GB of memory, providing a stable foundation for high-throughput and multitasking environments. Expansion capability includes two PCIe x16 (Gen 5) slots, configurable as either one PCIe x16 (Gen 5) or two PCIe x8 (Gen 5), one PCIe x4 (Gen 4), and four PCIe x1 (Gen 4) slots, enabling flexible integration of GPUs, AI accelerators, and add-on cards. Storage support includes one M.2 key M for NVMe SSD and four SATA3 ports with RAID 0/1/10 support, enabling high-speed storage deployment. I/O connectivity is comprehensive, featuring seven USB 3.2 Gen 2 ports, eight USB 2.0 ports, and six COM ports, complemented by three 2.5G LAN and one 1G LAN. Supporting quad-display output via HDMI 2.0b and DisplayPort 1.2++ and built in an ATX form factor (12 x 9.6 inches), the IMB-A1700 is well-suited for AI-driven video analytics platforms, computer vision servers, high-end development systems, and performance-focused computing deployments.

Following the recently launched InfinityBook Max 16 - INTEL with Core Ultra 9 275HX, the AMD-based variant of the thin and light Linux gaming workstation is now ready to hit the market.

Despite its robust high-quality full-metal chassis, the InfinityBook Max 16 weighs just over 2 kg and is powered by up to a Ryzen AI 9 HX 370, an NVIDIA GeForce RTX 5060 or 5070, and a 99 Wh battery, while the 500 nits, 100 % DCI-P3 display qualifies the Linux ultrabook workstation for software development, professional media design, and gaming.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, is excited to introduce the H810MT-E 2.0 motherboard, a smart and future-ready platform engineered to power modern everyday computing. Built around Intel's latest Core Ultra 9, 7, and 5 processors in the LGA1851 package and driven by the Intel H810 single-chip architecture, the H810MT-E 2.0 brings next-generation technologies together with proven stability. Designed for office productivity, home entertainment, and versatile system builds, it delivers consistent performance for daily workloads while providing the flexibility to grow alongside evolving user demands.

The H810MT-E 2.0 fully embraces next-generation DDR5 memory technology, supporting up to 128 GB across dual DIMM slots to ensure smooth and responsive multitasking. Delivering significantly higher bandwidth than previous-generation DDR4 while operating with improved power efficiency, DDR5 accelerates application performance, enhances workflow fluidity, and strengthens overall system responsiveness. From handling office applications and multiple browser sessions to streaming high-resolution media at home, users benefit from a platform built to keep pace with today's computing requirements while maintaining balanced efficiency.

AYANEO Pocket AIR Mini, AYANEO's first entry-level product, carries with it the memories and nostalgia of classic gaming while setting a new benchmark for retro handhelds in its class. With AYANEO's flagship DNA fully integrated, players can experience top-tier handheld design and features at an entry-level price, turning the vision of a "retro handheld that everyone can afford" into reality.

Since its release, AYANEO Pocket AIR Mini has quickly won the hearts of players and truly lived up to its reputation as a high-quality retro handheld that everyone can enjoy. With its exquisite mini form factor, classic retro control layout, and excellent performance, it not only satisfies players' nostalgia for traditional handheld gaming but also makes every gaming session more immersive and enjoyable. Whether you are a longtime retro gaming enthusiast or a newcomer to handheld gaming, this device offers a fun and engaging experience for everyone.

Advantech (TWSE: 2395), a global leader in Edge Computing and IoT automation solutions, today announced the launch of the EKI-6333BE-4GD, its first industrial-grade Wi-Fi 7 Access Point designed to deliver deterministic wireless connectivity for next-generation smart factories, autonomous logistics, and AI-driven industrial environments.

As mobile automation, robotics, and Edge AI applications rapidly expand across industrial environments, reliable wireless infrastructure has become critical for ensuring uninterrupted operations. The EKI-6333BE-4GD addresses these challenges with high-throughput Wi-Fi 7 connectivity, industrial-grade resilience, and advanced network management, enabling enterprises to build secure and scalable wireless infrastructure for mission-critical industrial systems.

Over a decade ago, the BC1 Open Benchtable launched with one clear goal: the ultimate portable platform for traveling overclocking enthusiasts. Its minimalist, toolless, flat pack design proved so effective that it quickly became the benchmark for open air builds, evolving from road warrior to permanent showcase platform for hobbyists and professionals alike.

Portability demanded compromises: slim profile, simple brackets, no native support for complete vertical builds. Today we close those gaps with precision engineered accessories that extend the BC1's legendary versatility without changing its core DNA.

imec, a global leader in nano-electronics and digital innovation, and Atlas Data Storage, a pioneer of production-scale DNA data storage, today announce a new strategic partnership to accelerate the development of digital data storage using synthetic DNA. The collaboration combines Atlas' ASIC design expertise and scalable DNA synthesis technology with imec's deep expertise in advanced chip development, fabrication, and integration. In addition to prototyping and strategic support, imec is investing in Atlas.

As data creation and storage accelerates in the AI age, magnetic media such as tape and hard disk drives face unavoidable limits in density, sustainability, cost, and long-term reliability. DNA data storage compresses vast datasets into tiny volumes while ensuring ultra-long durability with minimal energy and maintenance.

System76 has refreshed its Launch mechanical keyboard lineup with a new Prism Black finish and doubleshot PBT shine-through keycaps, the latter being corrosion-resistant and keeping the RGB backlighting visible without washing it out. For the unfamiliar, System76 is based in Denver, Colorado, US, and is primarily known for its Linux-first laptops, desktops, and servers, plus the in-house Pop!_OS operating system. Both the Launch and Launch Heavy keyboards are milled from solid aluminium blocks and built around a custom open-source PCB. Switch swapping is tool-free thanks to Kailh MX hot-swap sockets, with Jade, Royal, Silent Pink, and Silent Brown variants available at purchase. The keyboards also feature per-key RGB and full N-key rollover. Firmware is QMK-based and fully open source, with layout and lighting customization handled through the System76 Keyboard Configurator app on Linux, Windows, and macOS.

Connectivity on both keyboards is wired, using a detachable USB connection, and System76 includes both USB-C to USB-C and USB-A to USB-C cables in the box. The compact Launch measures 308.3 mm x 135.1 mm x 30.6 mm, with an 84-key layout, and includes a four-port USB hub with two USB-C and two USB-A ports, all running at 10 Gbps. The Launch Heavy offers a 105-key layout, measures 394 mm x 135.1 mm x 30.3 mm, and comes with the same SuperSpeed four-port USB hub to match. The Launch starts at $285 and the Launch Heavy at $299.

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the industry's leading HBM4E Memory Controller IP, extending its market leadership in HBM IP. This new solution delivers breakthrough performance with advanced reliability features enabling designers to address the demanding memory bandwidth requirements of next-generation AI accelerators and graphics processing units (GPUs).

"Given the insatiable bandwidth demands of AI, it's imperative for the memory ecosystem to continue aggressively advancing memory performance," said Simon Blake-Wilson, SVP and general manager of Silicon IP, at Rambus. "As a leading silicon IP provider for AI applications, we are bringing the industry's leading HBM4E Controller IP solution to the market as a key enabler for breakthrough performance in next-generation AI processors and accelerators."

NVIDIA has rolled out GeForce Hotfix Display Driver version 595.76, based on the recently released 595.71 WHQL Game Ready driver. The update specifically targets a GPU voltage cap issue affecting overclocked graphics cards, which prevented them from boosting to expected frequency levels. The voltage limitation surfaced shortly after the March 3 release of the 595.71 WHQL driver, which itself was meant to resolve problems introduced by the earlier 595.59 build. Users with RTX 50-series "Blackwell" GPUs reported reduced boost clocks and performance degradation under load, with observed core voltages sitting lower than on prior drivers. The new 595.76 hotfix restores proper voltage behavior when overclocking is applied.

Beyond the voltage fix, the hotfix addresses several game-related issues. In Resident Evil Requiem, it resolves white glowing artifacts that appeared when Subsurface Scattering was enabled and improves path tracing performance. It also fixes launch crashes in Star Citizen and corrects intermittent application crashes or driver timeouts when playing multi-key DRM content in browsers on HDCP 1.x monitors. As with all NVIDIA hotfix releases, version 595.76 is a beta, optional driver distributed through the company's Customer Care support site. It undergoes a shortened QA cycle and will be pulled once its fixes are rolled into the next official WHQL-certified release. Users seeking maximum stability may prefer to wait for that broader driver update.

DOWNLOAD: NVIDIA GeForce Hotfix Display Driver 595.76

NVIDIA is reportedly planning a second RTX 5050 variant with 9 GB of memory instead of the standard 8 GB, according to leaker MEGAsizeGPU who has a decent track record on NVIDIA leaks. Unlike the existing RTX 5050, which uses 8 GB of 20 Gbps GDDR6 memory on a 128-bit bus for 320 GB/s of bandwidth, the new model is said to adopt 3 GB GDDR7 modules. The updated configuration would total 9 GB across a 96-bit memory bus. While the narrower bus reduces interface width, the move to 28 Gbps GDDR7 would raise total memory bandwidth to 336 GB/s, a roughly 5% increase, alongside a 12.5% boost in VRAM capacity. Core specifications are expected to remain unchanged. The card would continue to use the GB207 GPU, based on the Blackwell architecture, with 2560 CUDA cores and a 130 W TDP. No changes to clock speeds or core counts have been mentioned.

The report also claims NVIDIA is preparing adjustments higher up the stack. A revised GeForce RTX 5060 may transition to the larger GB205 die, currently used in the RTX 5070, in a cut-down configuration. That would reportedly reduce the GPU from 6144 CUDA cores and a 192-bit bus to 3840 cores and a 128-bit interface. Such a move would require board partners to adopt new PCBs compatible with GB205 and standard 8-pin power connectors. According to the leak, these changes are tied to supply constraints affecting lower-tier RTX 50-series GPUs, including the RTX 5050 and RTX 5060. The GeForce RTX 5060 12 GB, which appeared in earlier roadmaps, is now reportedly canceled.

Lamptron has added silver colorways to its HC060 and HM049 hardware monitors, two compact displays built for real-time system monitoring inside or alongside a PC. The bigger of the two is the HC060, a 6-inch LCD running at 1024 x 768 and 60 Hz. It connects over HDMI and Micro USB, draws power via USB, and ties into AIDA64 for live system data, however, it can also handle photos, video, or light gaming if you want to use it that way. The unit measures 148.5 x 8.5 x 70 mm with a visible screen area of 133 x 74.5 mm and an 80° viewing angle. It can sit on a desk or be mounted inside a chassis, and supports custom skins from Lamptron or your own.

The HM049 is the smaller option at 4.9 inches, with a 960 x 320 panel at 60 Hz. Same connectivity and AIDA64 support, same skin customization, just in a more compact 148.5 x 42.5 x 66 mm body with a 111×37.5 mm display area and matching 80° viewing angle. Both models are available through the Lamptron AliExpress store and regional resellers across Europe, North America, and Asia. The HC060 starts at €149.90 and the HM049 at €79.90.

Panmnesia, an AI infrastructure link solution provider, today announced the signing of a strategic Memorandum of Understanding (MOU) with SK Telecom, South Korea's largest telco and a leading AI company. The agreement, signed at MWC26 in Barcelona, aims to jointly develop a CXL-based next-generation AI data center architecture.

As large-scale AI services continue to expand, data centers are investing heavily in massive deployments of high-performance GPUs, resulting in astronomical costs. Recognizing the need for sustainable scalability, SK Telecom and Panmnesia are focusing beyond simple GPU expansion to technologies that enable more efficient utilization of existing computing resources. Through this collaboration, the two companies aim to simultaneously improve cost efficiency and performance by innovating data center interconnect architecture based on Compute Express Link (CXL) technology.

Asustor has rounded out its AS72 rackmount NAS lineup with the AS7224RDX Lockerstor 24R Pro Gen 2, adding a 24-bay option to sit alongside the existing 12-bay AS7212RDX and 16-bay AS7216RDX models that launched back in August 2025. The new model supports drives up to 32 TB, giving it a raw internal capacity of 768 TB. It can be expanded to 36 bays with the AX7012R expansion unit, at which point it can pass the 1 PB internal capacity. The AS72 family runs on an AMD Ryzen 7 Pro 7745 (8 cores, up to 5.3 GHz) and comes with 16 GB of DDR5-4800 ECC memory, upgradeable to 192 GB. Networking covers dual 10 GbE and dual 1 GbE out of the box, with PCIe Gen 5 x8 and x4 slots available for 25/40/50 GbE NICs or SAS cards if you need more. Asustor quotes SMB multichannel speeds of up to 2,309 MB/s read and 1,886 MB/s write over 10 GbE in RAID 5.

The rest of the feature set is what you'd expect at this level: RAID 0/1/5/6/10/50/60, hot-swap bays, a hardware encryption engine, M.2 PCIe Gen 5 SSD support, four USB 3.2 Gen 1 Type-A ports, and dual redundant 550 W 80 Plus Platinum PSUs. No pricing has been announced.

Razer, the leading global lifestyle brand for gamers, today unveiled the Razer BlackShark V3 X HyperSpeed for Xbox - White Edition and Razer BlackShark V3 X HyperSpeed for PlayStation - White Edition.

Bringing a clean new colorway to one of Razer's most lightweight, high-performance wireless console headsets, the White Edition is designed to complement next-generation consoles while delivering the same esports-ready performance that the BlackShark line is known for.

QNAP Systems, Inc., a leading innovator in computing, networking, and storage solutions, today introduced the TS-h1077AFU, a compact 10-bay SATA-based all-flash NAS designed for businesses seeking fast, reliable, and cost-effective flash storage. Built on the ZFS-based QuTS hero operating system, powered by AMD Ryzen PRO 7000 Series processors, and equipped with ECC DDR5 memory, the TS-h1077AFU delivers exceptional performance, data integrity, and deployment value. Engineered with speed, density, and reliability at its core, the TS-h1077AFU is ideal for virtualization, high-speed media workflows, database operations, and multi-site backup consolidation.

"Following the strong market reception of our 30-bay TS-h3077AFU, we developed the TS-h1077AFU to bring the same enterprise flash performance to a more compact and versatile form factor," said Alex Shih, Product Manager at QNAP. "This 10-bay model gives businesses greater flexibility when designing high-performance flash storage architectures, while retaining the reliability and data integrity that QuTS hero is known for."