Imagine you're a web hosting vendor leasing out specific number of CPU cores of a large core-count processor. You'd want to specify QoS limits on the shared L3 cache performance for those cores, so they don't hamper performance of other tenants. AMD this week released a technical document detailing the Platform Quality of Service (PQOS) ISA extensions for its next-generation Zen 6 microarchitecture. These ISA enhancements provide sysadmins and cloud providers with greater control over processor and memory subsystem performance. The latest document outlines three primary additions to the Zen 6 PQOS feature set, Global Bandwidth Enforcement (GLBE), Global Slow Bandwidth Enforcement (GLSBE), and Privilege-Level Zero Association (PLZA). These features are designed to scale performance management across complex multicore environments by allowing software to regulate bandwidth and execution privileges more effectively across expansive groups of logical processors. The development shows that AMD is steering toward a more closely collaborative hardware QoS solution for its multicore processors.

A highlight of the Zen 6 PQOS updates is the implementation of Global Bandwidth Enforcement (GLBE), which allows system software to specify L3 external bandwidth limits for groups of cores that span across multiple traditional QoS Domains. By grouping these into a unified "GLBE Control Domain," AMD enables a competitively shared bandwidth ceiling for specific Classes of Service (CoS). This upgrades older architectures that only provided L3 external bandwidth enforcement on a strictly per-domain granularity. Next up, AMD introduced Global Slow Bandwidth Enforcement (GLSBE), a parallel feature that applies the exact same multi-domain bandwidth limiting principles to system memory explicitly designated as "Slow Memory." Both GLBE and GLSBE provide granular controls via specific model-specific registers.

Alphacool International GmbH from Braunschweig is a pioneer in PC water-cooling technology. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool is once again expanding its portfolio with the long-awaited Apex Monoblocks. The monoblocks combine high cooling performance with an elegant design that is perfectly matched to the respective motherboard. In addition to the CPU, they also cool the voltage regulators (VRMs) and the M.2 NVMe SSD located below the CPU socket. This allows the waterblock to cover all key motherboard components.

As with the Apex 1 CPU cooler, the Apex Monoblocks feature an offset cold plate. This directs the coolant flow straight to the thermal hotspot of the AM5 CPU. Combined with the proven Cross-Slot structure and 3D Jetplate 2.0, the design generates high water pressure for particularly efficient heat dissipation. The Apex Monoblocks were developed for demanding systems that require both high cooling performance and seamless integration into the motherboard design. Their combination of technical precision, targeted coolant flow and clear design language makes them ideally suited to modern custom water-cooling setups.

Intel's next-generation mobile processor for gaming notebooks and portable workstations, the Core Ultra Series 4 "Nova Lake-HX," will come in two distinct core configurations, according to a leak by Jaykihn, a reliable source for Intel leaks. "Nova Lake-HX" is segmented from the mainstream "Nova Lake-H" with a wider I/O that supports configurations with discrete GPUs. The top-of-the-line "Nova Lake-HX" processor will come with a CPU core configuration of 8P+16E+4LPE, that's eight "Coyote Cove" P-cores, and 16 "Arctic Wolf" E-cores, both of which are upgrades over the current "Cougar Cove" and "Darkmont" core architectures, respectively. The Compute tile features 8P+16E cores sharing an L3 cache, while the chip's 4 low-power island E-cores, also based on "Arctic Wolf," will be located in the SoC tile.

Intel is also planning a performance-segment "Nova Lake-HX" core configuration, with 6P+8E+4LPE under the hood. This will likely reuse the 6P+8E Compute tile from the mainstream "Nova Lake-H" processor, but with the SoC + I/O tiles Intel plans to use for the "Nova Lake-HX". This would give the chip a maximum core count of 6P+8E+4LPE. Perhaps the most interesting aspect of both these chip types is the iGPU, and its Graphics tile will be the tiniest variant in the series, with just 2 Xe cores. The iGPU of "Nova Lake" family is based on the Xe4 "Druid" graphics architecture. These chips feature a basic iGPU because they are expected to come with a full fat PCI-Express 5.0 PEG interface for discrete GPUs, and ideally you'd want the iGPU to be as small as possible.

EK by LM TEK, is proud to introduce the EK-Quantum Vector³ TUF RTX 5070 Ti/5080 - Plexi, a high-performance full-cover water block compatible with both the ASUS TUF Gaming GeForce RTX 5080 and the ASUS TUF Gaming GeForce RTX 5070 Ti. Designed to deliver exceptional thermal performance across the GPU core, VRAM, and power stages, the EK-Quantum Vector³ TUF RTX 5070 Ti / 5080 features an optimized open split-flow cooling engine, next-gen pre-cut thermal pads,and a full-coverage black anodized aluminium backplate. Now available now at the EK Shop and local resellers.

Engineered for the ASUS TUF Gaming GeForce RTX 5080 and the ASUS TUF Gaming GeForce RTX 5070 Ti, the EK-Quantum Vector³ delivers high performance liquid-cooling for enthusiasts who demand more. Featuring EK's expanded next-gen cooling engine, pre-cut high-performance thermal pads, and an advanced gasket design, this block ensures your GPU stays cool and efficient - even under the heaviest gaming, rendering, or overclocking loads.

Since the announcement of their collaboration at Computex 2025, Noctua, a leading quiet PC cooling brand, and Asetek, a pioneer in all-in-one (AIO) liquid cooling, have continued to advance their flagship AIO liquid coolers. The products have now successfully completed the Production Validation Test (PVT) phase, confirming performance and manufacturing readiness ahead of the planned Q2 2026 launch.

The Asetek Emma (G8) V2 pump operates at a nominal speed of approximately 3,600 RPM (±300 RPM). Through collaboration with Noctua, several key performance aspects have been enhanced. Firstly, a triple-layer noise-reduction pump cover reduces both air-borne noise and structure-borne vibrations. Secondly, a dedicated mode switch allows users to choose between three different pump speed profiles to fine-tune performance-to-noise characteristics.

Intel Core 200 "Bartlett Lake" is probably the most interesting processor gamers can't buy—built on the Intel 7 node and designed for Socket LGA1700, "Bartlett Lake" is a non-Hybrid, pure P-core chip, a monolithic silicon, with 12 "Raptor Cove" P-cores, and no E-core clusters. The 12-core/24-thread chip was launched earlier this month as an exclusive for the commercial and industrial PC OEM markets, as an edge AI PC processor, it is not drop-in compatible with consumer Intel Z790 chipset motherboards, or at least that was the plan.

A motherboard UEFI firmware mod by "kryptonfly" got a consumer ASUS Z790-AYW OC motherboard to POST with an Intel Core 9 273QPE "Bartlett Lake" processor. The modder used Claude AI to mod the UEFI firmware of the board without tripping safeguards that prevent the motherboard from booting with modded firmware. The 273QPE is a 12-core/24-thread pure P-core processor with 2 MB of L2 cache per core, and 36 MB of shared L3 cache. Its uncore components and iGPU are carried over from "Raptor Lake-S." The 273QPE has a base frequency of 3.30 GHz, an all-core boost frequency of 5.30 GHz, and a single-core TVB frequency of 5.90 GHz. The chip has 125 W processor base power, and 250 W maximum turbo power. You can watch kryptonfly's firmware mod video from the source link below.

Intel earlier this month debuted the Core Ultra 7 270K Plus and Core Ultra 5 250K Plus desktop processors at launch prices of $299 and $199, respectively. At the time, the company hadn't launched "KF" variants of the two chips, which lack integrated graphics and are priced around $15 less than their regular "K" variants. It turns out, that Intel is planning to launch the Core Ultra 5 250KF Plus, while there's no sign of a "Core Ultra 7 270KF Plus." The 250KF Plus is almost identical to the 250K Plus, except it comes with the iGPU disabled—something you don't need if you plan on using a graphics card.

As with most "KF" SKUs from the past, the Core Ultra 5 250KF Plus will be priced around $15 less than the regular Core Ultra 5 250K Plus. Intel's own 1,000-unit tray quantity pricing for the chip ranges between $174 and $184. Given how tight memory pricing is, and given that you'll need an aftermarket cooler, the $15 saving might come in handy. Then of course the integrated graphics is nice to have if your graphics card is bricked due to a burnt power connector, and you need something to light your screen up for troubleshooting or during RMA. The Core Ultra 5 250KF Plus is based on the "Arrow Lake" microarchitecture, and packs a 6P+12E core configuration, with 3 MB of L2 cache per P-core, 4 MB of shared L2 cache for each of the three E-core clusters, and 30 MB of L3 cache shared among the six P-cores and three E-core clusters. The Core Ultra 5 250KF Plus should start selling from April 3, 2026.

Acer today introduced the FA300, a mid-range M.2 NVMe Gen 5 SSD. The drive brings PCIe Gen 5 speeds to a wider audience, and is based on a DRAMless controller. The company doesn't specify the controller type. Popular DRAMless Gen 5 controllers include Phison E31T and Silicon Motion SM2504XT. The FA300 comes in 1 TB and 2 TB capacity variants, which differ in performance. Both variants offer up to 11 GB/s of sequential reads, but while the 1 TB variant offers up to 9.7 GB/s sequential writes, the 2 TB variant goes a bit further, posting up to 10 GB/s sequential writes.

In terms of random access performance, the 1 TB Acer FA300 offers up to 1.4 million IOPS 4K random reads, with up to 1.6 million IOPS 4K random writes, while the 2 TB variant offers up to 1.7 million IOPS for both 4K random reads and writes. The company does not specify the 3D NAND flash type used. The 1 TB model is rated for 750 TBW (TB written) write endurance, while the 2 TB model offers 1,500 TBW. Both models are backed by 5-year warranties. Acer did not specify pricing, because it tends to be dynamic in the current market environment, but expect the FA300 to be among the more affordable Gen 5 SSDs.

The rumor mill has started grinding about NVIDIA's next-generation gaming GPU, and it looks like NVIDIA does not want to allow the current market environment to get in the way of implementing its product roadmap, with a roughly 2-year GeForce generation product launch cadence. The next-generation GeForce RTX 60-series will be powered by the "Rubin" graphics architecture. "Rubin" already debuted on NVIDIA's bread-winning AI GPU series, and is making its way to GeForce, reports RedGaming Tech.

The first slice of rumors about GeForce RTX 60-series predicts that NVIDIA will stick to a more conservative approach with foundry nodes, and not go with a sub-2 nm nanosheet-based node. GeForce "Rubin" will be built on some variant of the current TSMC 3 nm FinFET node. They need not be the same N3 node that's in use by Apple, Intel, and others; and NVIDIA might collaborate with TSMC on an exclusive variant just the way it created the NVIDIA 4N node, derived from TSMC N5. Chips in the series will follow the numbering scheme "GR20x," with examples being "GR202" for the biggest part powering the flagship product. The 3 nm node will allow NVIDIA to maintain GPU clock speeds ranging between high 2 GHz and low 3 GHz, which is a minor increase over the current "Blackwell."

Stock prices of DRAM manufacturers dipped by as much as 19% over the past 5 days, over the March 24 announcement of Google TurboQuant, a new technology that Google claims will reduce the memory footprint of AI models by a factor of 6, and improve inference speeds by a factor of 8. As of this writing, Micron Technology (NASDAQ: MU) dipped 19.5% over the last 5 days. Over in Korea, SK Hynix saw its stock price drop by 6%, while Samsung Electronics saw a dip by 5%.

TurboQuant is an advanced quantization algorithm developed by Google that delivers massive data compression for LLMs and vector search engines. It effectively tackles memory bottlenecks in the key-value cache and accelerates similarity lookups without sacrificing model accuracy. TurboQuant achieves this efficiency by combining two novel techniques: PolarQuant, which simplifies data geometry using polar coordinates to eliminate traditional memory overhead, and Quantized Johnson-Lindenstrauss (QJL), a 1-bit mathematical error-checker. Capable of compressing the key-value cache to just 3 bits without requiring fine-tuning, TurboQuant enables up to 8x faster runtimes on GPUs, establishing a new standard for AI efficiency.

Philips today introduced the Envia 32M2N8900X, a high-end planar-format gaming monitor. The 31.5-inch monitor uses a high refresh-rate QD-OLED panel. You get 4K Ultra HD (3840 x 2160 pixels) resolution at 240 Hz refresh-rate, and 0.03 ms response time. The 32M2N8900X offers VESA DisplayHDR TrueBlack 500 certification thanks to its QD-OLED technology and 515 nits maximum brightness at 10% APL, and 1000 nits peak brightness in HDR at 3% APL. Color gamut includes full sRGB, and 99.5% DCI-P3, with delta E <2 in sRGB.

Other features include Philips Ambiglow, or ambient lighting, an integrated KVM switch, USB hub, and gamer-friendly overlay features such as monitor OSD-based crosshairs, shadow boost, and picture-in-picture. The monitor also embeds 5 W (RMS) stereo speakers. Thermal management for the QD-OLED panel is care of a heatspreader that uses a graphene layer. Display inputs include one DisplayPort 2.1, two HDMI 2.1, and one USB-C (DP passthrough). The integrated USB hub connects to a USB 3.2 upstream, putting out two type-A and one type-C with 15 W power delivery. The main USB-C port (which is used for input), can be used as a downstream high-speed charging port. When connected to a laptop or iPad, it provides 65 W of USB-PD 3.0 compliant power delivery while taking in DP input. The company didn't reveal pricing. For now the monitor is only available in China.

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AMD today launched the Ryzen 9 9950X3D2 Dual Edition Socket AM5 desktop processor. This processor is positioned above the Ryzen 9 9950X3D, and is the much awaited implementation of 3D V-Cache memory on both CCDs (CPU complex dies) of the processor. The 16-core/32-thread processor is based on the Zen 5 microarchitecture, and features a total of 192 MB of shared L3 cache—that's 32 MB of on-die L3 cache plus 64 MB of 3D V-Cache that's contiguous with it, across both CCDs. This enables the maximum possible gaming performance, as worker threads of the game can be located on either of the two CCDs and benefit from large last-level cache. The base clock is 4.30 GHz, with a boost clock of 5.60 GHz—100 MHz lower boost than the 9950X3D, and the same clocks as the 9850X3D—no word if these are the same for each CCD.

The AMD Ryzen 9 9950X3D2 Dual Edition is positioned to be a 16-core Zen 5 Flagship part, and to ensure the chip has not just the most cache, but also the highest possible clock speeds in the series, and retain its overclocking capabilities, AMD expanded the TDP of the processor to 200 W—the highest ever for an AMD Ryzen part. AMD is offering gaming performance rivaling its latest Ryzen 7 9850X3D part, but with significantly improved productivity performance in applications with large cached data-sets, such as software development, AI training and inferencing, and video production. The company's first-party productivity benchmarks show the 9950X3D2 post significant single-digit percentage gains over the 9950X3D. AMD did not announce price, but said that the 9950X3D2 Dual Edition will be available from April 22, 2026.Known specifications of the Ryzen 9 9950X3D2 Dual Edition follow.

Corsair, a leading maker of performance gaming peripherals, announced the new MM mousepad family, a complete lineup of precision gaming mouse pads engineered to take professional precision to a whole new level. Leading the family is the MM Glass Large, Corsair's first ever glass gaming mousepad, built with a surface for ultimate speed, yet still keeps players firmly in control. With a soft touch surface, noise reduction treatment, anti-snag rounded edges, and an incredibly grippy polyurethane anti-slip base, it's built to go beyond the expectations of standard mouse mats and the full MM family brings that same commitment to precision to every playstyle and setup.

Cincoze has announced the latest addition to its Rugged Computing - DIAMOND product line: the DX-1300 high-performance compact industrial computer. The DX series, already used for numerous large-scale projects, has garnered a strong reputation for its high performance, compact design, and comprehensive functionality. The newly released DX-1300 builds on this legacy, featuring the latest Intel Core Ultra 200S processor, a compact footprint of 242 × 173 × 75 mm, rich I/O, and versatile expansion options to meet a wide range of application needs. The DX-1300 serves as the ideal edge computing platform for high-end image processing, AI inference, and multitasking data integration applications in space-constrained environments.

The DX-1300 is powered by the Intel Arrow Lake-S platform Core Ultra 200S processor, featuring an integrated CPU, GPU, and NPU hybrid computing architecture that delivers up to 36 TOPS of AI computing power. Compared to the previous generation, AI inference performance has increased by up to 3.5 times, supporting demanding edge AI applications such as real-time video analysis, smart inspection, and data analytics. Furthermore, it supports up to 96 GB of 6400 MT/s DDR5 CSODIMM memory, significantly enhancing data transfer efficiency and reducing latency. This bolstered performance still fits in a chassis measuring only 242 x 173 x 75 mm—a footprint comparable to an 11-inch iPad—making it perfect for integration into equipment control cabinets, production line machinery, and in-vehicle systems where space is at a premium.

With the S60 ARGB, S50 ARGB and S40, Sharkoon expands its portfolio of all-in-one liquid coolers with three powerful solutions for different systems. From the 360 mm variant for maximum performance to the compact 240 mm version, the models offer efficient cooling, modern features and easy integration into current PC builds. The 360 mm radiator of the S60 ARGB ensures maximum cooling performance, even for demanding gaming systems and workstations. Three pre-installed 120 mm ARGB PWM fans provide strong airflow with adjustable noise levels. The square pump head with mirror effect and ARGB lighting adds a modern visual touch.

With its 240 mm radiator, the S50 ARGB is ideal for more compact systems requiring strong cooling performance. Two pre-installed 120 mm ARGB PWM fans deliver efficient airflow with precise control. The large pump head with mirror effect and ARGB lighting ensures a modern appearance. The 360 mm radiator of the S40 ensures reliable cooling performance even under high load and is aimed at users seeking maximum performance in a deliberately functional, streamlined design. Three pre-installed 120 mm PWM fans provide strong airflow with adjustable noise levels. The large square pump head emphasizes its clean, minimalist design.

Team Group Inc., a global leader in memory solutions, today announced the launch of the T-Create Classic H514 M.2 PCIe 5.0 SSD, designed to meet the growing demand for high-performance data storage in the generative AI era. Built on the PCIe Gen 5 x4 interface, the SSD delivers up to 14,200 MB/s read and 13,300 MB/s write. Its ultra-fast data transfer capability significantly enhances the efficiency of accessing large creative assets and supports the performance requirements of video editing, image processing, visual effects, and 3D modeling software. The H514 also enables smooth and stable workflows for local AI model inference and training, empowering professional creative output.

Featuring an advanced 6 nm controller, the T-Create Classic H514 delivers ultra-low read and write latencies of just 0.05 ms and 0.015 ms, respectively. This minimizes data response times and enables seamless coordination with the CPU and GPU, ensuring smooth system performance even when handling complex, high-resolution projects or multi-layered creative tasks. Built with advanced 3D NAND flash, the H514 offers capacities of up to 4 TB, supporting the deployment and storage needs of large AI language models ranging from 7B to 175B parameters. By enabling local data storage, the SSD provides creators with more responsive and stable creative workflows.

Intel launches the new Xeon 600 series "Granite Rapids-WS" processors targeting workstations and HEDTs (high-end desktops). These had been announced in February. These processors mainly target AI development, where you take advantage of Intel AMX (FP16) accelerators, and a fully-fledged AVX-512 instruction set, along with a large PCIe I/O. The key talking point with this processor is its Compute complex. The processor comes with up to 86 "Redwood Cove" P-cores. These are the same P-cores powering Core Ultra "Meteor Lake" processors, and feature Hyper-Threading, besides a full-fat AVX-512 pipeline. The top-speed SKU hence comes with an 86-core/172-thread configuration, with a maximum Turbo Boost frequency of 4.80 GHz. Intel claims that the core-configuration offers a 61% multithreaded performance gain over the previous generation.

The Intel Xeon 600 series is built in the LGA4710 package, and supports Intel W890 chipset. It is configured with an 8-channel DDR5 memory interface (16 sub-channels), supporting up to 4 TB of ECC DDR5 memory, with speeds of up to DDR5-8000 being supported. The processor's PCIe root complex puts out 128 PCI-Express Gen 5 lanes. Intel is also offering CPU overclocking features with these processors. There are as many as 11 processor models, with core-counts ranging from the top 86-core/172-thread down to 12-core/24-thread, all models come with 8-channel ECC DDR5 memory and PCI-Express 5.0 x128. All processor models support Intel vPro remote manageability feature-set.

Intel today announced its ambitious Core Ultra Series 3 vPro "Panther Lake" mobile processors for commercial notebooks. The processors build on the Core Ultra Series 3 processors launched in the consumer segment earlier this year, bolstering them with the entire Intel vPro platform for remote manageability and enhanced enterprise security. The new "Panther Lake" microarchitecture debuts the Intel 18A foundry-node, a must-win foundry note for Intel that offers superior transistor density, energy efficiency, and clock speeds compared to the TSMC N3 foundry node on which Intel built its previous Core Ultra 200V "Lunar Lake" and Core Ultra Series 2 "Arrow Lake" mobile processors.

The new "Panther Lake" architecture introduces the new "Cougar Cove" P-core that's optimized for Intel 18A node with enhancements to its branch predictor, memory disambiguation, and TLB improvements to provide a minor IPC increase over the previous "Lion Cove" P-core. The new "Darkmont" E-core further pushes up IPC over the previous "Skymont." Intel Thread Director sees further improvements for more accurate scheduling. The processors launching today come with the entire constellation of Intel vPro manageability features, including Device Discovery, Innovation Platform Framework, Unique Platform ID, total memory encryption with multi-key, Stable IT Platform, Intel AMT, platform service record, remote erase, one-click recovery, and CET. Security features include Intel TXT, platform trust technology, VT with redirect protection, Boot Guard, BIOS Guard, partner security engine, linear address-space separation, and Intel Threat Detection technology.

Intel today announced the Arc Pro B70 and Arc Pro B65 graphics cards for advanced AI compute workloads on workstations, and professional visualization. The two primarily target local inferencing, software development, and deployments in multi-GPU configurations for rack scale AI GPU compute acceleration. The Arc B70 GPU in particular stands out, because it is the most powerful discrete GPU based on Intel Xe2 "Battlemage" graphics architecture, with 32 Xe cores, and a 256-bit wide GDDR6 interface. If you recall, the Arc B580 gaming GPU only comes with 24 Xe cores and a 192-bit interface, and we for long wondered if Intel would ever max out the silicon for a more powerful SKU. The Arc B70 is that SKU.

The Intel Arc Pro B70 is configured with 32 Xe cores (Xe2-HPG), 256 XMX engines, and 32 Ray Tracing Units. It comes with 32 GB of GDDR6 memory across a 256-bit wide memory interface, with 608 GB/s of bandwidth on tap. The card comes with a PCI-Express 5.0 x16 host interface. The Arc B70 offers a peak throughput of 367 TOPS (INT8). On the graphics side of things, it supports DirectX 12 Ultimate, OpenGL 4.6, Vulkan 1.3. Compute APIs include Intel's own oneAPI, OpenCL 3.0, and OpenVINO. Its media engine supports AV1, HEVC, VP9, and H.265 hardware-accelerated encode and decode. Display outputs include four DisplayPort 2.1 ports. The card comes with power draw ranging between 160 W to 290 W depending on partner implementation (230 W for the Intel reference card). Intel will provide certified drivers for Windows 11, Windows 10, and Linux.

Citrix announced that the Citrix VDI (virtual desktop) platform has been updated with greater awareness of Intel Hybrid core architecture, particularly for processors with low-power island E-cores (LPE cores). The company also announced that Citrix will leverage Intel Video Processing Library to implement a display stream super resolution feature that should improve image-quality in virtual desktop sessions. Since Citrix is essentially "GeForce NOW for work," the client's side of the application has a tiny compute footprint, of decoding the display stream from the server, and conveying user inputs to it. The new LPE-core awareness lets Citrix Desktop confine its workload to the low-power island, allowing the processor to clock-gate, or even power-gate the main CPU complex, significantly improving battery life on commercial notebooks handed out by businesses to their employees.

First-party testing by Citrix shows that LPE-core awareness is found to reduce power consumption by up to 25% on commercial notebooks. For administrators, the update requires no IT policy changes, simply deploy the latest version of Citrix desktop across clients, and the application will automatically detect and work with processors featuring low-power island E-cores. LPE cores were introduced by Core Ultra "Meteor Lake" mobile processors. These got a major update in significance with Core Ultra 200V "Lunar Lake," where all "Skymont" E-cores of the chip are located in the low-power island of the SoC tile, separate from the Compute complex. The latest Core Ultra 300 "Panther Lake" builds on LPE core concept with up to 4 "Darkmont" LPE cores.

GAMDIAS, a global leader in high-performance gaming hardware, announces the ATLAS M5 Series, a new mid-tower case lineup designed for immersive performance and standout aesthetics. Featuring a panoramic showcase and three built-in NOTUS M1 ARGB PWM fans, the case delivers both visual impact and efficient cooling. Aligned with GAMDIAS' 2026 vision, "AUGMENTED IMMERSION," ATLAS M5 Series showcases the brand's dedication to immersive design and high-grade engineering. "ATLAS M5 Series reflects our commitment to gamers who expect both performance and aesthetics, our goal is to deliver a truly immersive gaming experience at an accessible price" said Stimson Wang, CEO of GAMDIAS. The lineup features the ATLAS M5 CG, distinguished by its seamless one-piece curved tempered glass panel. An embodiment of "Immersion" and a clear expression of GAMDIAS' vision for the year.

The ATLAS M5 Series is designed to present your entire build through a refined panoramic showcase. The ATLAS M5 CG elevates the presentation with a striking L-Shaped curved tempered glass panel, meanwhile the ATLAS M5 features seamless tempered glass panels on the front and side. This immersive design removes visual corner obstructions, delivering an uninterrupted view of the internal components.

GAMEMAX, a rising innovator in PC gaming hardware, today announced the MAX PB-Series 80 Plus Bronze Power Supply, a new lineup designed to deliver stable, efficient, and reliable power for modern gaming systems.

Engineered to meet the demands of today's hardware, the GAMEMAX MAX PB-Series is fully compliant with the latest Intel ATX 3.1 specification, supporting high transient power loads from next-generation GPUs while maintaining consistent performance. Built with premium internal components and a robust power design, the MAX PB-Series is positioned as a dependable and cost-effective solution for entry-level and mainstream PC builders.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly introduces the iGame Z890 ULTRA-S W and iGame Z890M ULTRA Z motherboards designed to support the latest Intel Core Ultra 200S Plus Series processors. Designed to meet the needs of modern gamers, creators, and PC enthusiasts, both the new iGame ULTRA Series motherboards feature a white color scheme designed to complement the our popular iGame ULTRA W Series graphics cards.

With high-speed memory support, robust power delivery, and user-centric features such as simplified building mechanisms and cleaner cable management approaches, the new iGame Z890 series aims to deliver a balance of performance, usability, and distinctive visual identity for today's high-performance PC builds.