PCI-SIG has released a small update on its upcoming PCIe 8.0 standard, with the draft milestone reaching version 0.5. Perhaps the most intriguing aspect of this draft update is not the performance itself, but the exploration of a new connector technology to support this high-bandwidth protocol. Last year, we learned that PCI-SIG plans to implement a 256.0 GT/s raw bit rate and 1 TB/s of bidirectional bandwidth in the x16 lane configuration. We had assumed that the protocol would continue using the familiar connector technology seen in previous PCIe updates. However, it turns out that the current connector might be a limiting factor, prompting the search for a replacement for the traditional PCIe electrical connection.

The traditional PCIe connector is a copper-based link with up to 16 lanes connecting graphics cards to a slot. In a full x16 lane configuration, the PCIe generation supported by the motherboard provides the best performance, offering the maximum bandwidth the platform can deliver. However, with a 256 GT/s raw bit rate, the connector provides about 1 TB/s of bidirectional bandwidth, which is five times faster than the current PCIe 5.0 platform used with modern GPUs and CPUs. This indicates that the current physical layer facilitating communication between a GPU and a motherboard is nearing saturation with the advent of PCIe 8.0, necessitating the consideration of an alternative connection method.

Google Chrome is reportedly downloading a 4 GB AI model onto user PCs without consent, prior information, or any way for less technical users to discover it independently. According to Alexander Hanff, who publishes a blog called "That Privacy Guy," Google Chrome is installing a 4 GB Gemini Nano model locally without user consent. The researcher discovered that Google Chrome downloads and installs the local AI model automatically, without any user input. Google Chrome initiates this process by creating an "OptGuideOnDeviceModel" folder, which contains a "weights.bin" file that is exactly 4 GB. This file is used for Google's Gemini Nano model, which handles on-device scam detection, AI-assisted writing, and other tasks. The entire process takes about 15 minutes to complete, all without the user's knowledge.

Why does this happen? Google Chrome automatically scans your device to assess whether it can run local AI models and only triggers the download when AI features are active. There is no specific checkbox in the browser settings indicating a 4 GB local AI model download. Interestingly, users who deleted this 4 GB model found that Google Chrome redownloaded it repeatedly, continuing the cycle. The only way to prevent or disable the download is by disabling Chrome's AI features through the "chrome://flags" settings, using enterprise policy settings in your organization, or simply uninstalling Chrome to stop the automatic downloads.

AMD's CPU offerings will soon expand into more categories, specializing in different tasks and use cases. During the latest Q1 earnings call, AMD CEO Dr. Lisa Su confirmed that customers are increasingly interested in specialized EPYC solutions and that future CPU generations will cater to different customer needs. This means that agentic AI will receive a dedicated EPYC CPU SKU, HPC workloads will have their own EPYC CPU SKU, AI training and inference will get a separate EPYC SKU, and cloud workloads will have a distinct SKU. This expansion of task-specialized CPU designs will go beyond the "Venice" CPU platform, which is expected to be released this year. At CES 2026, AMD confirmed that EPYC "Venice" will be a highly dense CPU package with up to 256 cores and 512 threads of "Zen 6c" cores, while the regular "Zen 6" configuration will have a maximum of 96 cores and 192 threads.

With this generation of EPYC CPUs based on the "Zen 6" core IP, AMD will promote "Venice" CPUs broadly, while the "Venice" CPU generation will be complemented by the "Verano" CPUs. These appear to use the same "Zen 6" microarchitecture but have optimizations specifically designed for AI infrastructure. Contrary to previous assumptions that "Verano" would be a "Zen 7" IP, it is now confirmed to be part of the 6th-generation EPYC CPU family. This indicates that AMD is starting its CPU customization for different workloads as early as this year. As the server CPU market is projected to reach $120 billion by the end of this decade, less than 3.5 years away in 2030, it makes sense to have different CPU SKUs for each task and capture a significant portion of that revenue. Server CPUs are also expected to grow at a 35% compound annual growth rate, which is impressive for a relatively mature market.

Elon Musk recently announced an ambitious project called Terafab, which he plans to build on Tesla's campus in eastern Travis County, Austin, Texas. Thanks to recent court hearings in Grimes County, Texas, we have learned that the first phase of the Terafab project is expected to cost $55 billion. However, if additional phases are constructed, this figure could rise to $119 billion. While this is an astonishingly high amount, it seems justified given Terafab's ambitious goals. Semiconductor manufacturing is one of the greatest marvels of the modern world, with only a few companies competing for the top spot. The engineering and scientific expertise required for building modern semiconductor manufacturing facilities is so rare that it is concentrated in just a few places around the globe.

The goal of Terafab is to consolidate the entire chip manufacturing process under one roof. The plant is expected to integrate several stages of semiconductor production at a single site, including logic fabrication, memory, packaging, testing, and mask production. This setup is unusual, as these steps are typically spread across multiple specialized facilities and companies. The idea behind Terafab is that consolidating these processes could accelerate development by allowing engineers to design, test, and revise chips with fewer delays, essentially enabling rapid prototyping. This contrasts with the traditional, lengthy process of manufacturing chips at one site, packaging them at another, and testing them in-house. A typical semiconductor fab for nodes below 3 nm costs over $20 billion, but that only covers silicon manufacturing. Terafab's goal to handle everything will push that cost astronomically high.

Valve's recent launch of the Steam Controller was successful from day one, and the company is now releasing something for the modding community to begin their adventures. Today, Valve has released 3D CAD files, providing modders with a 3D model for their needs. This means anyone can now access Steam Controller and Puck drawings in STP and STL formats, along with engineering drawings that highlight critical features and areas to avoid when modding. This allows anyone to design accessories with known clearances. The community's efforts should soon bear fruit, as Valve recognizes that its community is full of enthusiasts with a wealth of expertise who create new accessories daily. This will include 3D prints from creative individuals, as well as potential accessories to enhance the Steam Controller experience for some users.

Yesterday, Valve reassured customers that a restock of the Steam Controller is happening soon, as the initial release was so successful that the entire stock sold out in just 30 minutes. The demand has been exceptional, even for a controller priced at $99. The site experienced such a high volume of traffic that the payment processing system froze, causing many customers to encounter errors before both the website and payment processor resumed functioning. To prepare, some customers loaded their Steam Wallets with funds days in advance, but the high demand still prevented them from securing a unit immediately. For those who managed to purchase one, congratulations. However, those who didn't are turning to resellers, who are charging about $300 for the controller. Valve is reassuring customers not to worry, as another stock drop is coming soon. With the 3D files now in the hands of the modding community, we should start seeing some interesting designs on social media.

AMD reported impressive first-quarter 2026 earnings, and during the earnings call, CEO Dr. Lisa Su shared some intriguing insights about the agentic AI era. This era is driving CPU usage to unprecedented levels, to the extent that the number of CPUs in a single compute node is becoming almost equal to the number of GPUs. In response to a question from an analyst, Dr. Lisa Su explained that the traditional setup of one CPU paired with four or even eight GPUs is shifting towards a one-to-one ratio of CPUs to GPUs. This change indicates a surge in CPU demand due to the agentic features, which require large language models to utilize the host CPU for continuous updates and orchestration of these agents. Previously, CPUs primarily served as hosts to initiate GPU operations for training and inferencing AI models. However, as AI becomes more agentic, the CPU's role is becoming significantly more important.

AMD's Lisa Su...We certainly see the movement towards where in the past, the CPU to GPU ratio was primarily just as a host node in like a 1:4 or 1:8 configuration node, now changing and getting closer to a 1:1 configuration or even -- you can even imagine if you get lots and lots of agents that you could have more CPUs and GPUs...

AMD today announced financial results for the first quarter of 2026. First quarter revenue was $10.3 billion, gross margin was 53%, operating income was $1.5 billion, net income was $1.4 billion and diluted earnings per share was $0.84. On a non-GAAP(*) basis, gross margin was 55%, operating income was $2.5 billion, net income was $2.3 billion and diluted earnings per share was $1.37.

"We delivered an outstanding first quarter, driven by accelerating demand for AI infrastructure, with Data Center now the primary driver of our revenue and earnings growth," said Dr. Lisa Su, AMD chair and CEO. "We are seeing strong momentum as inferencing and agentic AI drive increasing demand for high-performance CPUs and accelerators. Looking ahead, we expect server growth to accelerate meaningfully as we scale supply to meet demand. Customer engagement around MI450 Series and Helios is strengthening, with leading customer forecasts exceeding our initial expectations and a growing pipeline of large-scale deployments providing us with increasing visibility into our growth trajectory."

PassMark's MemTest86 update version 11.7 (Build 1000) has added preliminary testing for the LPCAMM2 memory type, primarily for Intel's "Meteor Lake" and "Arrow Lake" chips. This means that the latest memory form factor can now be tested using a standardized testing methodology. With the rise of LPCAMM2 appearances, it is only logical that MemTest86 adds support for this form factor, which we have started seeing on Lenovo ThinkBook 14+ and 16+ and Framework Laptop 13 Pro models, especially from major DRAM manufacturers such as CXMT and Samsung. CXMT's LPCAMM2 memory uses LPDDR5X-8533 modules, while Samsung's modules are running LPDDR5X-9600 memory stacks. Interestingly, with further support from SK hynix, Samsung, Micron, and now CXMT, LPCAMM2 is aiming to become a universal standard for memory. Since the upcoming DDR6 memory is scheduled to be the main driver behind (LP)CAMM2, having a memory testing tool is essential.Below is the list of fixes and enhancements.

Valve's highly anticipated release of the Steam Controller was so successful that the entire stock sold out in just 30 minutes. The demand has been nothing short of exceptional, even for a controller priced at $99 in the United States, €99 in European Union countries, £85 in the UK, $149 CAD in Canada, and $149 AUD in Australia. At around 17:00 UTC on May 4, the Steam Controller officially went on sale through Valve's website. The site experienced such a high volume of customers that the payment processing system froze, causing many to encounter errors before both the website and payment processor resumed functioning. To prepare, some customers loaded their Steam Wallets with funds days in advance, but the high demand still prevented them from securing a unit immediately. For those who managed to purchase one, congratulations. However, those who didn't are turning to resellers, who are charging about $300 for the controller. Valve is reassuring customers not to worry, as another stock drop is coming soon.

ValveSteam Controller ran out faster than we anticipated, and we hate that not everyone who wanted one was able to get it. We're working on getting more in stock and will have an update on expected timeline soon.

Companies like Apple are always seeking top-tier manufacturing for their Apple Silicon products, which range from the A-Series chips in iPhones and low-power MacBooks to the more powerful M-Series SoCs that power iPads and higher-end Macs. Manufacturing these custom processors has traditionally been handled by TSMC, but Bloomberg now reports that Apple has been in talks with both Intel Foundry and Samsung Foundry to manufacture some of its chips in the coming months. It has been known for some time that Apple is exploring Intel's 18A-P process design kits (PDKs). Apple has used version 0.9.1 of the PDK designed for Intel's 18A-P node. With performance, density, power, and other metrics meeting expectations, Intel could become Apple's source for advanced node production by 2027.

Additionally, Apple is reportedly waiting for Intel to release the 18A-P PDK version 1.0, which is on track to launch in the first half of 2026 or may have already been released to partners. Once available, Apple plans to start with the lowest-end M-series chip, used in MacBook Air and iPad Pro devices, as previously mentioned. This node is particularly interesting due to its performance characteristics, as the 18A-P can deliver a 9% performance increase at the same power level or achieve 18% power savings at the same performance level compared to the standard 18A. This is exactly what Apple is looking for. Coupled with better thermal conductivity, these designs should offer improved heat dissipation and performance compared to what Apple currently achieves with TSMC's 3 nm process in the M5 SoC.

Microsoft recently published a note stating that gaming PCs running Windows 11 should be equipped with 32 GB of RAM as a "no worries" update for systems handling demanding tasks like Discord alongside AAA titles running in the background. However, after our post reached millions of readers online, gamers reacted negatively to Microsoft's seemingly excessive requirement amid the worst DRAM shortage ever recorded. In response, Microsoft deleted the entire blog post. Now, clicking on the old link redirects to the Windows Learning Center, which features general blog posts with tips and tricks on enhancing your Windows 11 experience, with no trace of the original post.

As readers may recall, Microsoft promised to make Windows 11 a much-improved operating system with better performance, more UI uniformity, and reduced RAM consumption. The company is reportedly using feedback from its Insiders group, user telemetry analytics, and customer focus groups to ensure that Windows 11 is efficient, thoughtfully designed, and stable. Earlier this year, Microsoft pledged to address many user complaints, such as poor memory optimization within its flagship operating system, but these fixes have yet to be implemented. In the meantime, having more RAM is the only solution to keep operations running smoothly. However, when the company began recommending 32 GB as a "no worries" upgrade, these plans seemed like empty promises, causing enthusiasts to stick around without considering alternatives. Now, Microsoft appears to have recognized the mistake and has deleted its previous blog post, indicating that the company is actively listening to user feedback online.

Hard Disk Drives (HDDs) and Solid State Drives (SSDs) are among the most sought-after commodities in computing today, as the expansion of AI data centers consumes everything in its path. According to Seagate, Sandisk, and Western Digital, demand is so high that customers are signing long-term supply agreements lasting up to five years. This duration is significant because customers are now planning their contracts around demand expansion, which is not only substantial but will also bring better balance to the supply chain. With customers driving steady demand, HDD and SSD manufacturers know exactly how much spinning rust or NAND Flash to produce to meet this demand. Over time, this is a positive development for a supply chain that will adapt with expanding production capacity. However, it poses a short-term challenge for PC gamers.

For example, at the start of this year, we reported that HDD prices have soared by an average of 46% since mid-September. These changes have made spinning rust an expensive commodity, but this is minor compared to NAND Flash prices, which have increased 500% in just a few months. The expansion of AI data centers has depleted any remaining inventory of HDDs and SSDs, leaving the consumer PC market to compete for the few remaining units available for gaming PCs. Interestingly, HDDs contain almost no silicon for storage purposes, so their significant price increases are a supply chain issue unrelated to the semiconductor industry. Apart from the controllers that use silicon, HDD platters are made from materials that are not currently in short supply. However, high demand keeps their prices elevated.

It seems we are not too far from the next-generation Double Data Rate 6 (DDR6) memory for desktops and servers, as memory manufacturers are working with JEDEC to establish a new standard. According to South Korean media outlet The Elec, major memory makers such as SK hynix, Samsung, and Micron have reportedly begun designing DDR6 in their labs and are gradually coordinating module development with substrate manufacturers. This collaborative effort is taking place under the supervision of JEDEC, the industry authority that oversees standard development and ensures a common foundation for design. Manufacturers could have accessed JEDEC's first DDR6 draft since 2024, but the draft still lacks concrete specifications such as finalized voltage ranges, signal usage, power envelopes, and pinout design. However, this is expected to change as manufacturers are now accelerating standard development.

Last year, we reported that the major players mentioned above had already moved past the prototype stages and embarked on rigorous validation cycles. Perhaps the most interesting aspect is the designated throughput of 8,800 MT/s, with plans to scale up to a staggering 17,600 MT/s, nearly doubling the ceiling of today's DDR5. This increase is driven by DDR6's 4×24-bit sub-channel architecture, which requires entirely new approaches to signal integrity. It also differs from DDR5's current 2x32-bit sub-channel structure. To overcome the physical limits faced by DIMM form factors at higher speeds, the industry is betting on CAMM2 technology. Early indications suggest that server platforms will lead the change, with high-end notebooks following once manufacturing ramps up.

Intel today released its latest Arc GPU graphics drivers with the version 101.8737 Beta brining new game-ready support for two new releases, including an RPG game Heros of Might & Magic Olden Era, as well as Neverness to Everness open world title. What is perhaps the most interesting thing with this beta driver release is the series of fixed issues in the Pragmata game with DirectX 12 API, which resulted in application crashes when loading into game menu on Intel Arc GPUs. This used to occur on everything from "Panther Lake," "Lunar Lake," and "Meteor Lake" integrated graphics, all the way to discrete Arc "Alchemist" and "Battlemage" solutions. Now the problem is resolved, but some issues remain. For example, Fortnite might crash on "Wildcat Lake" systems during launch, and discrete GPUs might experience some graphics corruption in games like Call of Duty Black Ops 6 and Dune: Awakening. For a full list of known issues, check out the changelog below.DOWNLOAD: Intel Arc Graphics Driver 101.8737 Beta.

The Windows 11 install base seems to be expanding, contradicting the overall sentiment surrounding Microsoft's highly controversial operating system. According to the latest Steam Hardware and Software Survey results from April, Windows 11 now accounts for 67.74% of the Steam gamer base, marking an increase of 0.89% from March. This growth comes at the expense of the remaining two operating systems noted in the Steam survey, primarily Linux and macOS. Interestingly, the April data suggests that Linux-based operating systems now stand at 4.52%, a significant 0.81% decrease from March. Most Linux distributions saw a decline in user share, with only Debian Linux, Ubuntu 24.04 LTS, and Fedora Linux 43 recording a meaningful uptick. The rest experienced a decline in April, indicating some market-wide corrections among gamers worldwide.

For Windows, both Windows 11 and Windows 10, which reached end of life back in October 2025, recorded increases, and the overall share of Windows-based gaming PCs grew by 1.14% in April. Now, Windows accounts for 93.47% of all gaming PCs, meaning that Linux and macOS remain relatively small compared to the dominance of Microsoft's OS. Especially among gamers, switching to a different OS seems problematic, despite recent growth rates. Even as Windows 11 has its own issues, the majority of gamers remain on the platform because it offers the best game compatibility and the lowest learning curve of all the mentioned platforms.

AMD's upcoming APU refresh with the Ryzen AI Max 400 series is divided into "Gorgon Point" and "Gorgon Halo." Today, we see one of the first "Gorgon Halo" APUs appearing in online benchmark databases. The AMD Ryzen AI Max+ PRO 495 "Gorgon Halo" APU, featuring 16 cores and 32 threads based on the current "Zen 5" CPU architecture, has landed in the PassMark testing database. These cores can reach a boost frequency of up to 5.2 GHz, which is about a 100 MHz improvement over the current "Strix Halo" APU generation. Complementing the CPU setup is the RDNA 3.5 GPU architecture, now in the form of a Radeon 8065S, which appears to be an overclocked version of the current Radeon 8060S. This new Radeon 8065S iGPU runs at 3.0 GHz, while the current Radeon 8060S runs at about 2.9 GHz. No increase in cores is expected here, and the "Gorgon Halo's" integrated graphics should continue with the 40 RDNA 3.5 CUs.

In terms of performance, AMD has managed to achieve better efficiency thanks to the higher boost frequency. PassMark's comparisons now list the new Ryzen AI Max+ PRO 495 "Gorgon Halo" APU as about 4% ahead in multicore and about 3% in single-core benchmarks compared to the AMD Ryzen AI Max+ PRO 395 "Strix Halo" APU. Another significant aspect is the integrated memory configuration. With the previous "Strix Halo," the maximum memory configuration was 128 GB, while the latest "Gorgon Point" shows 192 GB of LPDDR5X memory, suggesting that AMD has updated its integrated memory controller to increase the maximum memory capacity.

If readers recall, AMD has been trying to get the HDMI Forum, the governing body behind the development of the HDMI standard, to approve open-source HDMI 2.1 support on Linux but faced strong rejection. However, today the situation appears to be different. An AMD Linux developer hinted that the company is preparing full HDMI 2.1 support for the AMDGPU driver, bringing a complete open-source implementation after years of work. Helping this effort is Valve, whose Steam Machine runs on the SteamOS Linux operating system and uses AMD graphics. Late last year, we reported that Valve was reportedly attempting to persuade the HDMI Forum to approve AMD's efforts to bring this implementation to the open-source Linux stack, but we haven't received an update since.

Today, the situation looks a bit different as AMD has submitted the first set of Linux kernel patches, focusing on the Fixed Rate Link (FRL) feature, exclusive to the HDMI 2.1 standard. This feature enables higher bandwidth over the port, effectively supporting 4K at 120 Hz and 5K at 240 Hz resolutions on AMD GPUs running Linux-based operating systems. As these resolutions require higher data bandwidth, it is necessary to use the newer HDMI 2.1 standard over the currently supported HDMI 2.0 in AMDGPU open-source graphics drivers.

Microsoft has published an updated support document outlining what the company believes the best Windows 11 gaming PC systems have in common. Among the listed specifications, Microsoft makes an interesting note about the system's RAM capacity configuration. The document suggests that 16 GB is a baseline for a modern PC, describing it as a good "starting point." However, the company recommends that gamers aim to surpass this baseline, as it now suggests 32 GB as a "no worries" upgrade for gaming PCs. This higher RAM capacity makes running multiple workloads much easier, which is naturally true, but raises question about the feasibility of Microsoft's future plans to bring more optimizations to the operating system.

Most TechPowerUp readers are PC enthusiasts who understand how a RAM-limited system performs and know that more RAM is almost always better. However, in an era where the DRAM shortage is making it difficult for enthusiasts to easily buy more RAM, many are turning to more optimized operating systems like Linux-based distributions or even macOS, which is an entirely different platform. Microsoft now recommends a 32 GB capacity, stating it "helps if you run Discord, browsers, or streaming tools alongside your games." The extra memory also provides newer titles with more breathing room as memory demands continue to rise. This might also indicate that Microsoft's operating system is more RAM-hungry these days than it used to be, during a challenging time for RAM upgrades.

AMD previewed its Ryzen AI Halo mini-PC during the CES 2026 showcase, and the machine is set to be released as soon as June arrives. According to a Reddit user, AMD presented a Ryzen AI Halo box during AMD AI Dev Day, showcasing the system in its full glory. This machine is powered by a Ryzen AI Max 395+ APU, featuring a 16-core/32-thread "Zen 5" CPU, a large integrated GPU based on the RDNA 3.5 graphics architecture with 40 compute units, and a Microsoft Copilot+ ready NPU with 50 TOPS. It supports up to 128 GB of unified LPDDR5X memory, is compatible with Windows 11 and Linux, and comes with pre-loaded AI models optimized for the hardware. At the AI Dev Day, AMD demonstrated the device running on the Ubuntu operating system, which is likely to be the preferred OS for many AI developers targeted by this system.

AMD has developed an innovative cooling solution for the "Strix Halo" SoC, which includes a baseplate, a network of direct-touch flat heatpipes, an aluminium channel heatsink, and two lateral airflow blowers. AMD stated that the Ryzen AI Halo AI developer platform will be available from Q2 2026 which matches this supposed June launch. Interestingly, the price of this 128 GB model remains unknown, which is the biggest mystery, but don't expect it to come cheap. Below are some of the first real-life pictures, showcasing the design illuminated by a programmable RGB strip surrounding the box.

Chinese Board Channels now confirm that NVIDIA's upcoming resurrection of the GeForce RTX 3060 12 GB edition will take place in June, with many of NVIDIA's existing add-in-card (AIC) partners assisting in relaunching this five-year-old GPU. Interestingly, there are rumors that the recently integrated GALAX within the Palit group will be among these partners. Other AIC partners include NVIDIA's usual launch partners like ASUS, Colorful, and MSI. It will be interesting to see whether these AIC partners design new PCBs for the GeForce RTX 3060 12 GB relaunch or use their older designs, which they probably stopped producing years ago. We have already reported that NVIDIA is reintroducing the GeForce RTX 3060 12 GB SKU with a 192-bit wide memory bus.

For this, NVIDIA will once again use Samsung's 8 nm DUV node, as it has in the past. The entire NVIDIA "Ampere" architecture lineup was produced on the 8 nm DUV node, and its return after several years was unexpected. We also reported that the rumored RTX 5050 9 GB edition is reportedly on hold, as NVIDIA is pausing the transition from its 8 GB RTX 5050 "Blackwell" version to a 9 GB model due to the reintroduction of the GeForce RTX 3060 12 GB "Ampere" GPU. Since both of these GPUs compete in the budget segment, the company will reportedly only release the older GeForce RTX 3060 12 GB SKU as its primary entry-level design.

Austrian fan maker Noctua has published a technical blog explaining why it sometimes takes a long time for the company to release the dark-edition chromax.black fans after the initial beige and brown design is out. The company compares the level of engineering required for a new color code to painting a Formula 1 car, rather than a simple color change like you would typically do with a wooden fence. Noctua is known for its scientific testing, rigorous performance evaluations, highly detailed lab experiments, and more, which make its fans worthwhile. This has created a massive fan base within the enthusiast community over the years, who now eagerly await each new product release. When it comes to manufacturing, the company applies that same rigor everywhere, and a simple color change is not taken lightly. For example, Noctua produces its fans using injection molding, where plastic is melted and forced into a steel mold. However, when a new pigment is used, the entire calculation can be disrupted.

Noctua designs its fans with high precision to maximize airflow performance. This means that blade impellers have a tip clearance before hitting the fan frame of only a few tenths of a millimeter, about 0.5 mm for 120 mm fans and about 0.7 mm for 140 mm fans. Introducing any third-party pigment into this process could disrupt the structure of this fan tip clearance and potentially interfere with Noctua's Sterrox liquid-crystal polymer (LCP) material used in its fans. Specifically, color pigments have particles that directly affect how the injection mold behaves, as they carry their own particle imperfections. This negatively impacts the hundreds of thousands of performance tests that Noctua conducts in the lab and significantly delays the chromax.black product launch.

According to sources close to MacRumors, Apple is abandoning the development of the next-generation Vision Pro headset after the product failed to capture significant market share. With sales of "only" 600,000 units, Apple has not seen this product line take off as its other products have. Launched in February 2024, the Vision Pro headset debuted with a steep $3,499 price tag. In October 2025, about a year and a half later, Apple updated the Vision Pro with its latest 3 nm M5 SoC, typically used in MacBooks, but even this refresh failed to generate significant interest and orders from users. Although the system offers a technically impressive solution, the market has reacted poorly, particularly due to the high price point Apple set.

Technically, the headset features a micro-OLED 3D display system with 23 million pixels and weighs between 750-800 grams, depending on the headband choice. However, users have complained about the device's weight and distribution, especially around the nose area, which often feels heavy on a single pressure point. No headband choice has been able to completely alleviate this issue. Additionally, the price point is too high for consumers, especially for a technology that is relatively new to the Apple ecosystem. As a result, MacRumors tipsters suggest that Apple is close to completely abandoning the project.

Intel and SoftBank, through their subsidiary Saimemory, have been developing an alternative technology to the popular high-bandwidth memory (HBM) to provide more bandwidth and capacity for memory modules used with powerful AI accelerators. At VLSI 2026 in June, Saimemory is scheduled to present a paper on the newly developed HB3DM memory, which is based on Z-Angle Memory (ZAM) technology. This name refers to the vertical (Z-axis) stacking of dies, similar to traditional HBM. However, Intel aims to achieve impressive results using state-of-the-art manufacturing technology. The first generation of HB3DM will feature a total of nine layers, stacked using a hybrid bonding technique for 3D chip placement. At the base will be a logic layer that manages data movement within the chip, with eight DRAM layers on top for data storage. Each layer will include about 13,700 TSVs for hybrid bonding.

In terms of capacity, HB3DM will offer about 1.125 GB per layer, translating to 10 GB per memory module. Intel can achieve approximately 0.25 Tb/s of memory bandwidth per mm², and for a 10 GB module with a 171 mm² die area, we can expect around 5.3 TB/s per module. These impressive figures could quickly overshadow competing HBM4 memory, as HB3DM offers much higher bandwidth. HBM4 provides speeds of around 2 TB/s per stack, less than half of what HB3DM will deliver. However, HB3DM is limited by capacity, with only 10 GB available, whereas HBM4 can reach up to 48 GB per stack. Intel may increase the number of layers in production as HB3DM progresses, but for now, it is emerging as a bandwidth leader.

Intel's next-generation 18A node is ready, and the company has tested it, showcasing some impressive results. At the VLSI 2026 Symposium in Honolulu, Hawaii, Intel will present its new research on the capabilities of the upcoming 18A-P node. According to the paper, the 18A-P node can deliver a 9% performance increase at the same power level or achieve 18% power savings at the same performance level compared to the standard 18A. However, there is more to this than meets the eye. Typically, node generations show similar performance and power improvements across generations. What would be expected in terms of power and performance improvements when transitioning from 18A to 14A is now already available with the 18A-P node, but without any density improvements. This makes the 18A-P node a very attractive option for external customers who expect the transistor density of the 18A node found in "Panther Lake," but with significantly better characteristics.

For reference designs, Intel uses an Arm core sub-block to test frequency and power scaling. The new 18A-P node can yield much better results on paper, but one of the most interesting improvements is in manufacturing, specifically in something called skew corners. When a node is manufactured, no two transistors are identical due to the inherent physics of the manufacturing process, especially at today's scale. These variations are measured between fast and slow "corners," meaning faster and slower transistors. The skew refers to how wide the performance and power gap is between these transistors. Intel has managed to improve the skew corners on the 18A-P node by 30% compared to the standard 18A, meaning that power and performance characteristics are now more predictable, especially for parametric yields. This means that chip functions are now more predictable, and Intel has to deal with far fewer variations with the new node.Below is Intel's paper abstract about the 18A-P node.

Intel's stock is one of the best-performing semiconductor-related names in 2026, with the company's share price reaching a new all-time high of $94.10 per share at the time of writing. This is remarkable news, considering that about a year ago, Intel's stock hit a decade-low of $17.67 per share. This marks a growth of more than 400% in a single year for a company that is one of the most strategically important in the United States' sovereign semiconductor manufacturing. Intel's rise began with investment from the United States government, aimed at supporting the only company left in the U.S. conducting R&D and advanced silicon manufacturing. Since then, Intel has been on an upward trajectory, and the share price shows no signs of slowing down.

Contributing to this success is the revival of Intel's Foundry business, which is on track to attract many external customers. Intel Foundry recently achieved a significant milestone by improving yields across all major foundry nodes currently in high-volume manufacturing. This includes the Intel 4, Intel 3, and 18A nodes, which power the majority of Intel's product portfolio. In the latest Q1 2026 earnings call, Intel CFO David Zinsner noted that the company continues to improve yields on its older nodes, such as Intel 4 and Intel 3, while refining the yield of the current top-performing 18A node to reduce waste and increase the number of functional chips, even in larger dies. Additionally, Tesla signed on as Intel's first major 14A customer for Elon Musk's Terafab AI chip complex in Austin, indicating that the foundry's success in attracting external clients is just beginning.

Back in February, ComputerBase conducted a large blind test comparing in-game screenshots generated using the latest upscaling technologies: AMD's FSR 4.0 and NVIDIA's Deep Learning Super Sampling 4.5. The testing has since been updated, and community votes have been processed, revealing that AMD's updated upscaling technology, FSR 4.1, shows significant improvement over FSR 4.0. However, it still trails behind NVIDIA's DLSS 4.5 in visual quality. In the latest ComputerBase testing, the following games were upscaled using FSR 4.0, FSR 4.1, and DLSS 4.5: Year 117 - Pax Romana, ARC Raiders, Assassin's Creed Shadows, Call of Duty: Black Ops 7, Kingdom Come 2: Deliverance, Resident Evil Requiem, and The Last of Us Part I. In all of these games, the ComputerBase review concluded that DLSS 4.5 was the top performer, a view confirmed by the community in a separate blind test vote.

Similar to the previous test, the ComputerBase team conducted the comparison using videos labeled with three options, without revealing which rendering method was used, to ensure a fully blind test. This resulted in a community verdict with two notable outcomes. First, NVIDIA's DLSS 4.5 remains the leader in image quality, with 6 out of 7 games showing the best results using DLSS 4.5. The only game where AMD's FSR upscaling came out on top was Resident Evil Requiem, where DLSS 4.5 placed second behind FSR 4.1. Overall, DLSS 4.5 is seen as providing sharper visual details and more consistent frame generation compared to AMD's FSR upscaling.

Today, we reported that GALAX is ending its operations as an independent company and integrating into its parent company, Palit. However, users were left wondering whether Palit would stop offering GALAX-branded products, which have significant recognition among gamers. The official company response is that the branding will continue to be active. This means that GALAX-branded Hall-of-Fame (HOF) GPUs for extreme overclocking, the KFA2 brand for Europe, and other GALAX-branded products will remain available on the market. In simple terms, this is just a corporate structure change, with Palit consolidating its ventures under one roof as the parent company. Ongoing customer commitments, including RMA, warranty claims, and general support, will now be handled by Palit, while the design and development of new GPUs under the GALAX brand will continue.Below is a complete statement from Palit, followed by a statement from GALAX.

The legendary maker of Hall of Fame (HOF) GeForce GPUs, known for their exceptional overclocking capabilities, GALAX, is officially closing its operations after 30 years in business. GALAX, along with its KFA2 brand for the European market, will now be closed, with existing product inquiries managed by Palit—one of the largest GPU add-in card (AIC) manufacturers and a significant NVIDIA partner. Founded in Hong Kong in 1994, GALAX distinguished itself by creating high-performance designs with NVIDIA GeForce GPUs, particularly known for its HOF series. These iconic white-themed designs feature massive VRM circuitry for overclocking and higher-binned dies suitable for LN2 extreme overclocking scenarios. Over the past few generations, multiple world overclocking GPU records were achieved with GALAX HOF cards, and the brand has maintained that design language throughout the years.

After more than 30 years in business, GALAX is closing its operations, and these will be transferred to Palit, which will take full responsibility for "all activities and commitments related to the brand." This includes RMA services, warranty claims, product launches, and more. Interestingly, the announcement does not mention that the GALAX branding will be phased out. Only the actual company operations will be integrated into Palit. It's possible that Palit will retain the GALAX branding and its HOF name, which is well-known for high-performance overclocking among enthusiasts. It's worth noting that GALAX and its sister brand KFA2 have been operating for years with Palit's support as the parent company, so it's uncertain if the brand will continue its market presence under different management. GALAX and KFA2 have been sub-companies of Palit, and management claims that now is the time to unite all of Palit's brands under one roof.

Update 11:05 UTC: Palit confirmed that the current GALAX branding will continue to be present on the market.

Valve has officially confirmed that its highly-anticipated Steam Controller will go on sale globally on May 4. It will be priced at $99 in the United States, €99 in European Union countries, £85 in the UK, $149 CAD in Canada, and $149 AUD in Australia, marking a truly global launch. Designed as a universal control device, the Steam Controller aims to be a versatile gamepad for the broader Steam ecosystem, supporting PCs, laptops, Steam Deck, Steam Machine, and even the Steam Frame VR headset. While maintaining familiar core controls, Valve is clearly focusing on additional inputs, including dual trackpads, a gyro, Grip Sense, and four rear grip buttons, all of which can be customized through Steam Input.

Interestingly, Valve has revealed more details about some of the core technology behind the Steam Controller, with perhaps the most intriguing being magnetic thumbsticks built around TMR technology. Valve claims they offer a better feel, improved responsiveness, and much greater durability. They also add capacitive touch support for motion-based controls, meaning your commands can now be expressed in multiple ways. There is also a new puck accessory that handles both wireless connectivity and charging, snapping onto the controller magnetically to serve as a dock and transmitter in one.

Update 17:00 UTC, May 4: Steam Controller is now officially available!