AMD has announced six new Ryzen PRO 9000 Series processors for commercial desktops and workstations, with two of them bringing 3D V-Cache to the PRO lineup for the first time. All six are AM5 parts targeting managed business deployments rather than the consumer market. The top-tier model is the Ryzen 9 PRO 9965X3D featuring 16 Zen 5 cores, 32 threads, up to 5.5 GHz boost, 128 MB of L3 cache courtesy of 3D V-Cache, and a 170 W TDP. Think of it as the workstation equivalent of the Ryzen 9 9950X3D, just under the PRO branding with the associated manageability and security features. A non-X3D Ryzen 9 PRO 9965 sits alongside it with the same 16 cores and 170 W TDP but 64 MB of L3 cache. The 3D V-Cache also extends down to the Ryzen 7 tier with the Ryzen 7 PRO 9755X3D sporting eight cores, 16 threads, up to 5.2 GHz, 96 MB of L3 cache, and a 120 W TDP. Rounding out the lineup are the Ryzen 9 PRO 9955 (12 cores, 120 W), Ryzen 7 PRO 9755 (8 cores, 120 W), and Ryzen 5 PRO 9655 (six cores, 120 W), all with 64 MB or 32 MB of L3 cache depending on the model.

The new additions sit above the existing 65 W Ryzen PRO 9945, 9745, and 9645 parts, giving AMD a higher-power PRO tier for workstation builds that need more headroom. The latest additions to the AMD Ryzen PRO 9000 Series lineup are scheduled to launch in the second half of 2026, with systems based on the new processors expected to begin shipping during the same period. AMD also noted that Lenovo ThinkStation P4 workstation is currently planned for availability in Q3 2026.

Razer, the leading global lifestyle brand for gamers, today announced the Razer Huntsman V3 Tenkeyless 8KHz, an analog optical esports keyboard built on the same competitive foundation as the Huntsman line.

Streamlined, focused, and purpose‑built, it brings Razer's core performance technologies into a tenkeyless form factor engineered to perform reliably straight out of the box—whether at home, on stage, or on the move.

Branch, the office furniture company on a mission to make a great workspace accessible to everyone, today announced a first-of-its-kind collaboration with SEGA: a collection of three ergonomic gaming chairs inspired by the worlds, consoles, and characters that have defined generations of play. The Branch x SEGA Gaming Chair Collection—featuring the Sonic Chair, the Genesis Chair, and the Dreamcast Chair—launches in May 2026 on branchfurniture.com, with prices starting at $569 USD.

These are the first gaming chairs ever launched under the SEGA brand. Each chair builds on the acclaimed Ergonomic Chair Pro platform by Branch, reimagined with subtle, sophisticated design details drawn from SEGA's most beloved properties. Branch's design team translated the visual language of SEGA's most iconic properties into considered details: custom fabrics, textured armrests, branded casters, checkerboard accents, and console-inspired finishes that reward a closer look without overwhelming a room.

Global semiconductor materials market revenue increased 6.8% year-over-year to $73.2 billion in 2025, SEMI, reported today in its Materials Market Data Subscription (MMDS). Growth was supported by gains in both the wafer fab materials and packaging materials segments, reflecting higher process complexity, advanced-node demand, and continued investment in high-performance computing and high-bandwidth memory manufacturing.

Wafer fabrication materials revenue increased 5.4% to $45.8 billion. Lithography-related materials, including photomask, photoresist and ancillaries, along with wet chemicals, posted strong double-digit growth as higher process intensity and tighter lithography requirements continued to increase materials consumption.

Micron Technology, Inc. (Nasdaq: MU), today announced it has sampled 256 GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers. The module is built on the company's leading-edge 1-gamma technology, which is capable of speeds up to 9,200 megatransfers per second (MT/s), greater than 40% faster than modules in volume production today. Micron's module employs advanced packaging techniques, 3D stacking (3DS) multiple memory dies connected by through-silicon vias (TSVs). Combined with Micron's 1-gamma DRAM, these innovations provide the capacity, speed and power efficiency required to scale next-generation AI systems. A single 256 GB module can reduce operating power by more than 40% versus two 128 GB modules, enabling greater efficiency for modern AI data centers.

Ecosystem partner validation
Micron is collaborating with key ecosystem enablers to validate the 256 GB 1-gamma DDR5 RDIMM across their respective current and next-generation server platforms. This co-validation ensures broad platform compatibility and accelerates the path to production deployment for data center customers building AI and HPC infrastructure at scale.

Desktop monitor shipments reached 133.4 million units in 2025, growing 4.3% year-on-year, signaling a recovery from post-pandemic disruptions. This expansion reflects the evolution of monitors into versatile, high-value tools for laptop-dominated environments, with gaming fueling interest in high-performance displays.

Gaming monitor shipments are projected to expand to 43 million units in 2026, supported by increased cost-effectiveness and added functionality. This trend reflects a shift toward specialized consumer applications and immersive entertainment experiences.

SiFive, Inc., the gold standard for RISC-V computing, today announced the launch of the SiFive Performance P570 Gen 3, the most powerful and efficient out-of-order processor core in its class. Purpose-built for demanding edge AI, high-end consumer, and commercial IoT applications, the P570 Gen 3 delivers a large leap in performance compared to the popular P550 Gen 1, and also provides the most modern RVA23 ISA profile support.

This versatile IP can be used as the control processor in embedded IoT devices, running a full networking stack, or can be used as the main applications processor in consumer devices, running rich OSs, such as Android or enterprise-grade Linux. The high-performance vector unit supports running AI models and inference on edge devices.

Origin Code, a performance-driven brand pushing the boundaries of hardware, today announces the latest expansion of its Vortex DDR5 family: a newly optimized 48 GB (24 GB × 2) kit running at 6200 MT/s CL28, in the striking Meteorite Black finish, will be launched at Computex 2026.

Complementing this launch, Origin Code also introduces a purpose-built independent watercooling block, designed to further enhance thermal efficiency and unlock sustained performance for high-end systems

As generative AI moves from cloud-based training to specialized local fine-tuning, the demand for stable, high-wattage on-premise power has never been greater. FSP Group, a global leader in power supply technology, today officially unveiled the FSP2000-57APB, a 2000 W ATX 3.1 flagship power supply specifically engineered for high-performance local AI computing and dual-GPU workstations.

Uncompromising Stability for On-Premise AI Fine-Tuning
Under the annual theme "Powering AI Together," FSP addresses the critical need for data privacy and low-latency processing in AI development. The FSP2000-57APB is purpose-built for secure, in-house compute workloads, such as large-scale model fine-tuning. It effortlessly manages massive power excursions, ensuring that hardware remains protected and systems remain stable during the most intensive deep learning cycles.

With the CHERRY XTRFY K33 Compact Wireless, CHERRY XTRFY presents a flexible gaming keyboard that combines the key features of modern gaming peripherals in a compact and accessible package. Designed for an easy start, the K33 Compact Wireless is aimed at those looking for an affordable entry point without compromising strong connectivity, reliable performance and a comfortable mechanical-like typing experience.

Maximum flexibility and reliable performance
The CHERRY XTRFY K33 Compact Wireless offers maximum flexibility thanks to its tri-mode connectivity: It can be connected via 2.4 GHz wireless, Bluetooth or USB. This not only allows it to be used with a variety of devices but also enables you to switch quickly between your gaming setup, laptop or mobile devices without having to change connections or interrupt your session.

MaxSun has launched two MoDT (Mobile on Desktop) motherboards with soldered Intel processors, the MS-MoDT 230H D4 WIFI and MS-MoDT 205H D4 WIFI. Both use the microATX form factor at 190 x 180 mm, suitable for a wide range of compact cases for SFF builds, workstations, and edge computing. Despite the naming, the Core 7 230H and Core 5 205H are Raptor Lake parts, not Arrow Lake. The MS-MoDT 230H board includes the Intel Core 7 230H processor with 10 cores (6P + 4E), 16 threads, up to 5.2 GHz boost, 24 MB cache, and 45 W base TDP with turbo scaling up to 115 W. It also gets a dedicated VRM heatsink and four USB 3.2 Gen 2 rear ports. The MS-MoDT 205H board steps down to the Intel Core 5 205H CPU that brings 8-core (4P+4E), 12 threads, up to 4.8 GHz, 12 MB cache, and the same 45 W / 115 W power envelope. Worth noting that neither chip has integrated graphics enabled.

Both motherboards share the same base specifications: two DDR4 DIMM slots for up to 64 GB at DDR4-3200, two PCIe 4.0 M.2 slots supporting 2242 and 2280 drives, two SATA 3.0 ports, Realtek Gigabit Ethernet, Wi-Fi 6, and Bluetooth 5.3. The MoDT form factor is not new, with several brands releasing similar products recently, including the Minisforum BD895i SE ITX powered by the AMD Ryzen 9 8945HX and Erying's microATX motherboard series based on Intel Core Ultra 200H processors. The MoDT format that integrates a mobile CPU directly onto a desktop board has the pricing advantage over similar CPU and board combos. The MaxSun Intel based MoDT motherboards' exact pricing and availability are yet unknown however, the pricing is estimated to be around $110-200.

Building on more than 30 years of collaboration, Applied Materials, Inc. today announced a new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI. Working together at Applied's EPIC Center in Silicon Valley, the companies will co-innovate to advance materials engineering, equipment innovation, and process integration technologies designed to deliver energy-efficient performance from the data center to the edge.

"Applied and TSMC share a long history of deep collaboration built on trust and a shared commitment to advancing innovation at the leading edge of semiconductor technology," said Gary Dickerson, President and CEO of Applied Materials. "By bringing our teams together at the EPIC Center, we are strengthening that partnership and accelerating the development of technologies to address the unprecedented complexity driving the chip making roadmap."

Blaze Entertainment and Retro Games Ltd are delighted to announce two new portable retro game consoles that answer the question - What if your favorite home computers of the 1980s were portable? Introducing THEC64 Handheld and The Spectrum Handheld - two new handheld retro gaming consoles licensed by Retro Games Ltd and created by the makers of the critically acclaimed Super Pocket consoles. These two new handhelds are designed around the imagination of what a portable version of these classic home computers would look like in the 1980s.

Each handheld follows the color scheme of the home computers and is inspired by the design choices of each original release. The clamshell case design takes inspiration from some of the most successful gaming handhelds of the past, while also evoking the style of portable computers, palmtops and organizers of the 1980s. Answering the question of what these classic home computers would be like if they were designed and made in the 1980s.

HPE (NYSE: HPE) today announced the availability of HPE Compute Scale-up Server 3250, a purpose-built server for in-memory databases, engineered to deliver scalability, resilience, performance, and security for critical business transactional and analytics workloads. Powered by Intel Xeon 6 processors, HPE Compute Scale-up Server 3250 delivers the highest memory available as the first scale-up server validated by the SAP BW Edition HANA benchmark with at least 48 terabytes (TB) of memory.

"HPE Compute Scale-up Server 3250 raises the bar for business-critical infrastructure," said Krista Satterthwaite, senior vice president and general manager, Compute at HPE. "Designed for complex business applications like enterprise resource planning and customer relationship management systems, this system helps customers in ways competitive offerings cannot - allowing them to run faster transactions, gain insights in real time, and support analytics without slowing down business. With simpler operations, always-on reliability, and chip-to-cloud security - we're redefining what scale looks like for workloads with zero-tolerance downtime."

Minisforum and Intel held a joint launch event in Xiamen, introducing two new all-flash NAS systems built around Intel Series 3 processors, the compact S5 and the seven-bay S7. The S5 is the more distinctive of the two. It runs Intel Core Series 3 (Wildcat Lake), Intel's 18A-based platform for edge, laptops and commercial devices and adopts a no-HDDs approach featuring five M.2 2280 PCIe 4.0 x1 SSD slots. The fanless design combined with the all-SSD layout means it runs completely silent. Minisforum is even pitching it at home theater setups and anywhere noise is a concern. Memory goes up to 16 GB of LPDDR5X-7200, and connectivity includes a 10 GbE RJ45, a 2.5 GbE RJ45, two USB4 40 Gbps ports, two USB 3.2 Type-A ports, and HDMI 2.1. Wi-Fi 7 is also on board, and combined SSD throughput is rated at up to 10.8 GB/s.

The S7 is built on the MS-03 workstation platform and steps up to seven NVMe slots for heavier storage workloads. Networking is more enterprise-oriented, with dual 10G SFP+ fiber ports, a 10G RJ45, a 2.5G RJ45, and two USB4 40 Gbps ports. An LED status display lets users check system and storage activity making it more suited to home-lab and power user setups. Both systems support Minisforum MinisOpenClaw AI agent, which includes features like AI semantic photo search and installs in one click. No pricing or release date has been announced.

GMKtec officially announces the launch of its latest high-performance Mini PC, powered by the 13th Gen Intel Core i5-13500H processor. Designed for users seeking a compact yet powerful desktop solution, the new Mini PC combines strong productivity performance, triple-display 4K output, advanced connectivity, and flexible storage expansion in an elegant ultra-small form factor. The new GMKtec Mini PC is now available globally with special launch pricing and limited-time discounts.

Compact Size, Powerful Performance
At the heart of the system is the Intel Core i5-13500H processor, featuring 12 cores and 16 threads with a turbo frequency up to 4.7 GHz. Built on Intel 7 process technology, the processor delivers strong multitasking capabilities and excellent energy efficiency for both professional and entertainment workloads.

Sony Semiconductor Solutions and TSMC have signed a non-binding memorandum of understanding to form a joint venture focused on next-generation image sensor development and manufacturing. Sony will be the majority and controlling shareholder in the joint venture, which plans to set up development and production lines at Sony's newly built fab in Koshi City, Kumamoto Prefecture. The partnership brings together Sony's image sensor design expertise and TSMC's process technology and manufacturing scale. Beyond conventional imaging, the two companies are also looking at opportunities in physical AI applications, automotive and robotics specifically, where high-performance sensing is becoming increasingly important. Investment plans for the joint venture are still being worked out, and Sony is also considering additional capital investment in its existing Nagasaki plant. Both are being planned in phases based on market demand and are contingent on Japanese government support. Earlier reporting from Reuters indicated Japan's Ministry of Economy, Trade and Industry (METI) has confirmed subsidies of up to ¥60 billion (around $380 million) for Sony's Kumamoto image sensor facility.

The timing makes sense for both sides. TSMC is already involved in Kumamoto through its first fab there, which entered mass production in late 2024 supplying Sony Semiconductor Solutions and DENSO on 22/28 nm and 12/16 nm nodes. The new joint venture would push that relationship into more advanced territory. For Sony, the move comes as competitive pressure in the image sensor market is building as Samsung has been gaining ground in supplying sensors for Apple, squeezing Sony's position in a segment it has long dominated. However, the joint venture still needs a definitive legally binding agreement before it's official.

Avalue Technology Inc. (TPEx: 3479.TWO), a provider specializing in industrial computer solutions, announces the launch of its next-generation value Technology Inc. (TPEx: 3479.TWO), a provider specializing in industrial computer solutions, announces the launch of its next-generation ECM-PTL 3.5" Micro Module, powered by the latest Intel Core Ultra Series 3 processors. Purpose-built for AI-driven edge computing and industrial automation, ECM-PTL brings AI PC architecture to the edge, delivering powerful AI acceleration, enhanced energy efficiency, and advanced heterogeneous computing capabilities.

Extending AI PC Architecture to the Edge
Designed in line with the evolution of AI PCs, ECM-PTL integrates CPU, GPU, and a dedicated NPU to enable efficient workload distribution. The built-in NPU is optimized for sustained AI workloads, allowing real-time AI inference while reducing CPU and GPU utilization. This architecture makes ECM-PTL ideal for edge scenarios requiring continuous AI processing, including machine vision, smart surveillance, and intelligent automation, where performance, efficiency, and responsiveness are critical.

Corsair Gaming, Inc. (Nasdaq: CRSR) ("Corsair" or the "Company"), a leading global provider and innovator of high-performance products for gamers, streamers, content-creators, gaming PC builders, and sim racing enthusiasts, today announced financial results for the first quarter 2026, and guidance for the second quarter 2026.

First Quarter 2026 Select Financial Highlights (compared to first quarter 2025 unless otherwise stated)

• Gross profit increased 13% YoY to $116.0 million, with growth driven by both segments, despite tariff-related headwinds in Gamer and Creator Peripherals.
• Gross margin expanded 500 basis points YoY to 32.7%, reflecting continued shift toward higher-margin products and disciplined cost management.
• Net income increased $23.4 million YoY.
• Adjusted EBITDA increased 58% YoY to $35.8 million, above the high end of guidance, representing our second consecutive quarter of double-digit adjusted EBITDA margin.
• GAAP diluted earnings per share increased 210% YoY to $0.11, while non-GAAP diluted earnings per share increased 145% YoY to $0.27.
• Revenue of $354.5 million, above the midpoint of our guided range, reflecting strong growth in Gamer and Creator Peripherals, partially offset by softer demand in Gaming Components and Systems driven by ongoing semiconductor supply constraints and elevated pricing.
• Cash and restricted cash increased sequentially by $20.9 million to $119.7 million, providing flexibility for continued investment and capital returns.
• Approximately $5 million repurchased under our $50 million share repurchase program.

Synology today announced the launch of the RS6426xs+, RS4826xs+, and RS3626xs. These next-generation models deliver the performance and reliability required for enterprise backup, data management, and virtualization storage at scale.

"As IT environments continue to grow more complex, organizations' needs for reliable and versatile infrastructure that can be purposed dynamically continue to grow." said Peggy Weng, Product Manager at Synology. "These systems are designed to help businesses facilitate team collaboration and multi-site synchronization, protect production environment, or deploy virtualization storage for high performance workloads."

As organizations adopt AI, many discover that their infrastructure struggles to keep up. Running AI in the cloud is an option, but the cloud can introduce privacy concerns and unpredictable costs. Upgrading on-prem infrastructure is another option, but supporting large GPU-accelerator platforms can require expensive redesigns in data center power and cooling. Our new AMD Instinct MI350 PCIe cards give your enterprise a third option: Leadership AI performance designed to fit the data center infrastructure you already own.

Performance That Drops into Your Existing Racks
Designed to help you prepare for the agentic AI era, AMD Instinct MI350P PCIe cards are dual-slot drop-in cards for standard air-cooled servers. They are built to deploy inference on premises within your current data center's power, cooling and rack infrastructure. AMD Instinct GPUs in cost-effective PCIe cards round out the AMD AI compute portfolio, providing a range of options for your enterprise as it navigates its unique AI adoption curve.

ARCTIC expands its powerful P12 Pro series with the LN models. The new P12 Pro LN fans offer an adjusted speed range of 450-2000 rpm for quiet operation and high airflow. The P12 Pro LN fans are available in three different versions. The speed range allows flexible adaptation to different requirements, including whisper-quiet operation; at a PWM value below 5%, 0 dB mode is automatically activated.

The new P12 Pro LN fans also feature a functional, redesigned frame design. Reduced manufacturing tolerances increase static pressure and efficiency - ideal for applications with high air resistance, such as radiators, mesh, or fan grills.

Satechi has launched the DotDisk, a compact M.2 NVMe enclosure with a USB4 V2 interface running at up to 80 Gbps. Satechi isn't new to the SSD enclosure space, having previously launched products like the compact Mini NVMe SSD in 2024, the USB4 Slim NVMe SSD enclosure last year, and the versatile Thunderbolt 5 CubeDock docking station shown at CES in January. This new addition can accommodate a single M.2 2280 PCIe 4.0 drive and supports capacities up to 8 TB, with the slot being user-accessible for later upgrades. The enclosure is made from milled aluminium with an integrated cooling fan. Active cooling in something this small is worth noting, as most compact enclosures rely on passive heat dissipation and can throttle under sustained load. A thermal pad is included to help seat the drive properly against the heatsink.

The USB-C port covers Thunderbolt 5, Thunderbolt 4, USB4 V2, and USB4, so it'll work with most modern Macs and PCs without adapter hassle. A Thunderbolt 5 cable ships in the box alongside a magnetic screwdriver for installation. OS compatibility covers macOS Sonoma 14.6 and later, Windows 11, and Linux. Worth mentioning that the enclosure is not compatible with SSDs equipped with heatsinks, double-sided and 2230/2242/2260 sizes. The Satechi DotDisk comes in silver and Space Black and is available now at satechi.com for $199.99. No SSD is included.

Qualcomm Technologies, Inc. today announced the Snapdragon 6 Gen 5 Mobile Platform and Snapdragon 4 Gen 5 Mobile Platform, expanding its portfolio with next-generation capabilities designed for real-world experiences. By focusing on the technologies users rely on most, these platforms strengthen Snapdragon's mobile offerings with stronger performance and extended battery life.

Introducing Snapdragon Smooth Motion UI
Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 introduce Snapdragon Smooth Motion UI to enhance device interactions with seamless, lag-free navigation. Snapdragon 6 Gen 5 delivers 20% faster app launches and 18% less screen stutter for more immersive and reliable performance. Focused on the essentials, Snapdragon 4 Gen 5 enables smooth, all‑day responsiveness with 43% faster app launches and 25% less screen stutter.

Golden Emperor International Ltd. - one of the world's leading PC components and peripheral manufacturers, is proud to announce its latest breakthrough in high-performance computing at Computex 2026. Leading the charge is the industry-first DDR5 8000 MT/s JEDEC Standard memory, alongside the global debut of the AQUARIUS Diamond RGB product line.

Witness 8000 MT/s: Simply Truly Plug & Play
GeIL is redefining the boundaries of high-speed DRAM by introducing the DDR5-8000 MT/s specification that fully adheres to JEDEC standards. Unlike traditional high-frequency modules that require manual BIOS adjustments or overclocking profiles, GeIL's JEDEC 8000 MT/s modules offer a "True Plug & Play" experience.

Today (May 6, 2026) Arm (NASDAQ: ARM) published a letter to its shareholders containing the company's results for its fourth quarter and fiscal year 2026 ended March 31, 2026. The infographic below provides the key highlights for the quarter:

• Arm delivered record-breaking quarterly and full-year results, with Q4 FYE26 revenue reaching $1.49 billion and full-year revenue at $4.92 billion. FYE26 was Arm's third consecutive financial year since going public of more than 20% revenue growth.
• Arm delivered record full-year royalty revenue of $2.61 billion alongside Q4 FYE26 revenue at $671 million, with this driven by growth across smartphones, Edge AI, Physical AI and Cloud AI, where data center royalties more than doubled year-over-year. Meanwhile, Arm's Q4 FYE26 revenue for licensing reached a record $819 million, with yearly revenue at $2.31 billion.

Omarchy 3.7 is out, and gaming is the headline feature. The Arch-based distro led by David Heinemeier Hansson has rolled out what it's calling a Gaming Edition update, overhauling Linux gaming support across the board. Steam now installs automatically without any user input and drops the problematic SDL_VIDEODRIVER environment variable that was causing compatibility issues with many games. RetroArch got a bigger overhaul, the AUR dependency is gone, making installation much faster, and the emulator comes pre-configured out of the box. Users can now drop their BIOS and ROM files into ~/Games, scan the directory, and they're ready to go with the CRT Royale shader enabled by default. Beyond emulation, Omarchy 3.7 adds launchers for Lutris (Battle.net games like Diablo, StarCraft, and WoW), Heroic (Epic Games titles without anti-cheat, so no Fortnite or Rocket League), and Moonlight for streaming games from a Windows PC running Sunshine. An Xbox Cloud Gaming web app rounds out the gaming additions, covering Game Pass titles including ones that won't run natively on Linux.

Outside of gaming, the update introduces a new unified omarchy command that replaces the previous scattered omarchy-* commands, with tab completion and a cleaner interface for installing software, taking screenshots, and analyzing issues. Built-in screen text extraction is also new, powered by the Tesseract OCR engine. The cliamp text-based music player now ships by default, and there's improved support for ASUS ExpertBook Panther Lake laptops alongside Intel FRED enabled by default on Panther Lake systems. The full release notes covering additional features, improvements, and bug fixes are available on GitHub, where Omarchy 3.7 can also be downloaded.

According to Economic Daily News, TSMC is overhauling Fab 15A in Central Taiwan Science Park, transitioning it from 28/22 nm to 4 nm production. Old equipment is being cleared out and replaced with new tooling, and the total bill (cleanrooms and machinery included) is expected to top NT$100 billion (US$3.16 billion). The displaced 28/22 nm tools aren't going to waste either, heading to TSMC facility in Dresden, Germany, which is ramping toward mass production in 2027 on mature nodes aimed at the automotive and industrial market. Fab 15B stays on 7 nm for now. Further up the process roadmap, TSMC's 1.4 nm fab at the Phase 2 Central Taiwan site in Taichung is coming together faster than planned. Groundwork is mostly completed and construction bidding is expected to start shortly. If things keep moving at this pace, trial production could start as early as Q3 2027, with full mass production following in the second half of 2028.

There are also talks of 1 nm arriving at the Central Taiwan site earlier than previously expected. Worth noting that 1.4 nm isn't part of TSMC's US fab plans at all. Once all four Phase 2 fabs are running at capacity, the Taichung complex is expected to be the single largest production base for AI and HPC chips anywhere in the world. In April, TSMC introduced its A13 (1.3 nm) process at the 2026 North America Technology Symposium as a direct shrink of the previously announced A14 (1.4 nm) node. The new node offers around 6% area reduction, along with improved performance and power efficiency through design-technology co-optimization. The A13 node remains fully backward compatible with A14 design rules to allow easier migration. TSMC A13 node is expected to enter mass production in 2029, one year after A14.

Logitech International (SIX: LOGN) (Nasdaq: LOGI) today announced financial results for the fourth quarter and full Fiscal Year 2026.

For Fiscal Year 2026:

• Sales were $4.84 billion, up 6 percent in US dollars and 4 percent in constant currency compared to the prior year.
• GAAP operating income was $775 million, up 18 percent compared to the prior year. Non-GAAP operating income was $911 million, up 18 percent compared to the prior year.
• GAAP earnings per share was $4.80, up 16 percent compared to the prior year. Non-GAAP EPS was $5.78, up 19 percent compared to the prior year.
• Cash flow from operations was $1.04 billion. The year-ending cash balance was $1.7 billion. The Company returned $768 million of cash to shareholders through its annual dividend payment and share repurchases.

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the Rambus PCIe 7.0 Switch IP with Time Division Multiplexing (TDM), a new addition to its advanced interconnect IP portfolio designed to address the rapidly escalating bandwidth, latency, and scalability requirements of AI, cloud, and high-performance computing (HPC) systems.

As AI infrastructure grows in scale and architectural complexity, system designers are increasingly challenged to move massive volumes of data efficiently across CPUs, GPUs, accelerators, and NVMe storage. The Rambus PCIe 7.0 Switch IP with TDM is architected to help meet these demands by enabling more flexible and efficient utilization of PCIe links, supporting emerging disaggregated and pooled compute architectures while maintaining low latency and deterministic performance.

Each week, new games and apps integrating NVIDIA DLSS, NVIDIA Reflex, and advanced ray-traced effects are released or announced, delivering the definitive PC experience for GeForce RTX players. This week, Dead As Disco enters Early Access, and there are new looks at two highly anticipated, upcoming games: Star Wars: Galactic Racer, and 007 First Light.

STAR WARS: Galactic Racer Launches Worldwide On October 6th, Featuring DLSS 4.5 On GeForce RTX PCs & Laptops
Star Wars: Galactic Racer is a high-stakes reinvention of racing born in the lawless Outer Rim of the Star Wars galaxy. The Empire's grip on the galaxy has finally broken, and with its fall comes a new obsession: speed. As the New Republic struggles to rebuild, gambling, entertainment, and glory fuel a booming underground. Out of this chaos, the Galactic League is born: an unsanctioned racing circuit where syndicates sponsor pilots, fortunes are won and lost in seconds, and only the bold survive.

Combining cutting-edge ergonomic design with convenient productivity features, the latest mouse in the Trust Home & Office range - the Vyran Ergonomic Multi-Wireless Hyperscroll Mouse - is the perfect choice for professionals looking for a comfortable mouse that works as hard as they do.

Designed with user wellness in mind, the Vyran features a vertical form with an optimal 50° angle and comfortable thumb rest that naturally reduces arm and wrist strain during extended use. Ideal for those working through lengthy documents, spreadsheets, and web pages, its premium metal hyperscroll wheel with tilt function enables effortless vertical and horizontal navigation, making marathon work sessions that bit more comfortable.

Samsung Display announced today that it will participate in Display Week 2026, hosted by the Society for Information Display (SID), and showcase its latest display innovations.

The exhibition will take place from May 5 to 7 at the Los Angeles Convention Center in California. Display Week is one of the world's largest display industry exhibitions, where global companies and experts gather to share advanced technologies and research achievements. Under the theme "The Spectrum of Display Innovation with AI" Samsung Display will present its latest technologies as a leading OLED company.

Kensington, a worldwide leader of desktop computing and mobility solutions for IT, business, and home office professionals, today announced an expansion of its USB-C GaN charging portfolio with the addition of new multi-port power adapters and a 240 W USB-C fast-charging cable, designed to support fast, efficient charging across multiple devices.

The expanded lineup adds 70 W and 140 W USB-C GaN chargers that allow users to power laptops, tablets, smartphones, and accessories from a single compact adapter, reducing the need for multiple chargers and outlets.

Intel Corporation today announced two key leadership appointments to strengthen its core product business and advance the company's innovation agenda.

Alex Katouzian Appointed to Lead Client Computing & Physical AI Group
Alex Katouzian will join Intel as executive vice president and general manager of the Client Computing and Physical AI Group. In this role, Katouzian will align Intel's client computing business with emerging physical AI systems that span robotics, autonomous machines, and other AI devices.