Samsung has reportedly decided not to use a signature chip tech in the Exynos 2700 of the Galaxy S27 series. A new supply chain report signals the shift to a new cooling solution and the exclusion of a legendary one.

According to SisaJournal, Samsung’s Exynos 2700 for the Galaxy S27 series may not feature FOWLP chip packaging technology. This move would help the company as a cost-cutting measure, amid mounting pressure.

Samsung debuted HPB thermal tech with the Exynos 2600 this year. This new chip packaging solution helps the chip stay cooler. Exynos 2700 is said to be retaining the HPB solution, while adding SbS heat dissipation.

That said, the removal of the FOWLP chip packaging tech may require architectural design tweaks on the Exynos 2700 chipset. Additionally, the utilization of Samsung Foundry’s second-generation 2nm process tech is certain.

Samsung’s upcoming Exynos 2700 could come with a deca-core CPU and an upgraded Xclipse 970 GPU, based on AMD RDNA 5. The company may also bring faster LPDDR6 RAM and UFS 5.0 NAND flash memory chips.

Exynos 2600 share in the Galaxy S26 series is near 30 percent. Early reports suggest the Exynos share would hit about 50 percent in the Galaxy S27 series. Meanwhile, Qualcomm is almost sure that Ultra will prefer Snapdragon.

Related article:

• Samsung Galaxy S27 Ultra could become more expensive

On the software side, the Galaxy S27 series is rumored to launch with One UI 9.5. The company has recently started the Beta Program of One UI 9, which would go official with the Galaxy Z Fold 8 and Z Flip 8 in the summer of 2026.

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