The Exynos 2600 has been a big hype for the Samsung Galaxy S26 series, as it’s the world’s first 2nm chip used in a smartphone. Now, a new leak from well-known Samsung tipster Ice Universe gives us what could be the final look at its CPU and GPU configuration.

We’ve already seen early performance hints from Geekbench listings, but this new information suggests Samsung may be squeezing out a bit more power. According to Ice Universe, the Exynos 2600 will stick with a 10-core CPU layout, which aligns with previous leaks.

The change could be on the prime core, which is now said to clock at 3.9GHz. That’s slightly higher than the 3.8GHz speed seen in earlier benchmarks, and while the difference sounds small, it could help Samsung push higher peak performance in demanding tasks.

The rest of the CPU setup looks familiar. The three high-performance cores are expected to run at 3.2GHz, while the six efficiency cores are clocked at 2.75GHz. 

On the graphics side, the Exynos 2600 reportedly uses a GPU called AMD JUNO, running at 985MHz. As the name suggests, Samsung continues its partnership with AMD for graphics, which has been a major talking point for recent Exynos chips. 

The GPU is said to support OpenGL ES 3.2, OpenCL 3.0, and Vulkan 1.3, covering all the modern graphics APIs needed for high-end gaming and advanced visuals.

Samsung will gatekeep Exynos 2600

If you’re curious about its performance, the chip scored 3,455 points in the single-core test and 11,621 points in the multi-core test in its latest Geekbench sighting. For comparison, our Xiaomi 17 unit powered by Qualcomm’s Snapdragon 8 Elite Gen 5 reached 3,078 points in single-core and 9,162 points in multi-core.

Even with on-par performance—if not better—Samsung is reportedly planning to use the Exynos 2600 exclusively in the Galaxy S26 and Galaxy S26 Plus for the Korean market. The rest of the world is expected to get models powered by the Snapdragon 8 Elite Gen 5.

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MSI has unveiled a new and gorgeous MEG X870E GODLIKE X EDITION motherboard on the occasion of the 10th anniversary of the company’s GODLIKE series. And as the name suggests, this is not a mass-market product.

MSI says it will produce just 1,000 units worldwide, and each motherboard will feature a unique serial number along with a numbered gold nameplate.

The X imprint and gold accents on the board make it clear that this is a limited-edition release. The motherboard also features a 3.99-inch Dynamic Dashboard III display that plays a dedicated 10th-anniversary animation when powered on.

MSI is bundling the motherboard with several limited-edition accessories, such as a numbered M.2 Frost Armor matching the motherboard’s serial number, a custom display stand, and even a limited-edition black dragon plush toy.

MSI MEG X780E GODLIKE X EDITION Specifications

Under the hood, the MEG X870E GODLIKE X EDITION sticks closely to what you would expect from a no-compromise AM5 motherboard. The power delivery system uses a 24 (110A SPS) + 2 + 1 phase design, paired with dual 8-pin CPU power connectors and third-generation titanium inductors. 

MSI says this setup is designed to provide stable power for AMD’s Ryzen 9000 series processors, including scenarios involving extreme overclocking.

Memory support includes four DDR5 slots in a dual-channel layout, with MSI claiming support for memory speeds of up to 9000+ MT/s. And for storage, the motherboard includes five onboard M.2 slots, and MSI bundles an M.2 XPANDER-Z SLIDER GEN5 expansion card. 

Moreover, expansion options include two PCIe 5.0 x16 slots and one PCIe 4.0 x4 slot, enough for multi-GPU setups or specialized add-in cards. 

To keep everything running reliably, MSI has designed an extensive cooling solution. This includes a second-generation magnetic M.2 Frost Armor system, dense finned heatsinks, cross-shaped heat pipes, and thermal coverage across the VRM, chipset, and storage areas.

MSI has also added several EZ DIY features, such as a graphics card quick-release button, tool-free M.2 clips, and an EZ Bridge interface. 

As for connectivity, you get 10G and 5G Ethernet, Wi-Fi 7, and Bluetooth 5.4. Audio is handled by a fifth-generation esports audio module with 7.1-channel output, and you can tweak all the software settings through MSI Center. 

The MEG X870E GODLIKE X EDITION is now available in China for 8,888 yuan. Whereas, MSI’s US store lists it at $1300.

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Apple’s product roadmap for 2026 and beyond may have just leaked in unusually broad detail, and yes, it includes Apple’s long-rumored first foldable iPhone. The information, unearthed by MacRumors, reportedly comes from an Apple prototype device running an early build of what we now know as iOS 26.

According to the report, the prototype device was sold, after which the buyer shared access to the beta software. The build carries the version number 23A5234w and is internally labeled as iOS 19, not iOS 26. This discrepancy actually helps confirm its age. It is an early beta of the operating system that eventually shipped as iOS 26.

What makes this discovery notable is the sheer scope of unreleased hardware referenced inside the software.

MacRumors was able to extract a lengthy list of unannounced Apple devices — spanning iPhones, iPads, Macs, wearables, home products, and even future silicon. Several of the codenames and model identifiers align with existing rumors, adding weight to the rumor. 

Below is the full list of products referenced in the beta.

---

AirTags and Home Devices

• AirTag 2 — B589
• Apple Studio Display 2 — J427, J527
• Apple TV — J355
• HomePas (base variant) — J490
• HomePad (mounted variant) — J491
• Possible smart home camera — J229
• Tabletop robot — J595
• HomePod mini 2 — B525

iPads

• iPad 12 — J581, J582 (Wi-Fi and Cellular)
• M4 iPad Air (11/13-inch)  — J707, J708, J737, J738 (Wi-Fi and Cellular)

iPhones

• iPhone 17e — V159
• iPhone Air 2 — V62
• iPhone 18 Pro — V63
• iPhone 18 Pro Max — V64
• Foldable iPhone — V68

Macs

• Low-cost MacBook (A18 Pro) — J700
• M5 Pro / Max MacBook Pro (14/16-inch) — J714c, J714s, J716c, J716s
• M5 MacBook Air (13/15-inch) — J813, J815
• M5 Mac Studio (M5 Max / Ultra) — J775c, J775d
• M5 Mac mini (M5 / Pro) — J873g, J873s
• M6 14-inch MacBook Pro — J804
• M6 Pro / Max MacBook Pro (14/16-inch) — K114c, K114s, K116c, K116s

Wearables and Spatial Devices

• Vision Air — N100
• AR glasses prototype — N421
• Mac-connected AR glasses — N107
• Cheaper Vision Pro / second-generation Vision Pro — N109
• AI smart glasses — N50 / N401
• Apple Watch Series 12 — N237, N238 (Wi-Fi and Cellular)
• Apple Watch Ultra 4 — N240

Chips

The beta also references several upcoming Apple silicon projects:

• U3 (Ultra Wideband) — T2034
• M5 Pro / Max / Ultra — T6050
• M6 — T8152
• A20 / A20 Pro — T8160
• S11 — T8320

Unknown Codenames

Several identifiers appear without clear links to existing rumors:

• N110
• N209
• N216
• J349
• J190
• J226

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FEVM, a China-based brand focused on compact mini PCs, has launched its second system, the FAEX1. The new machine adopts a familiar cheese-grater aesthetic reminiscent of Apple’s designs, but incorporates a 16-core AMD APU and up to 128GB of LPDDR5X-8533 memory into a compact 1-liter chassis.

FEVM FAEX1 Specifications 

The FAEX1 measures 220 × 133 × 35mm and uses a CNC-machined aluminum alloy shell to achieve its glossy, industrial look. Despite its size, the mini PC is unusually generous with ports. 

Both the front and rear panels include two USB-C 40Gbps ports, two USB-A 10Gbps ports, HDMI 2.1, DisplayPort 2.0, an SD 4.0 card reader, a 3.5mm headphone jack, and an OCuLink 4i port for connecting external GPUs.

For connectivity, FEVM sticks to the latest standards. The FAEX1 supports dual-band Wi-Fi 7 and Bluetooth 5.4, alongside a 2.5GbE RJ45 port for wired networking.

Powering the system is AMD’s Ryzen AI Max+ 395 “Strix Halo” processor. It’s a 16-core APU built on AMD’s Zen 5 architecture, offering 32 threads, a Radeon 860S GPU with 40 RDNA 3.5 compute units, and an integrated XDNA 2 AI accelerator for on-device AI workloads.

To keep all of that in check, FEVM says the FAEX1 uses a 160W cooling solution that combines two active fans with a large vapor chamber. According to the company, this setup allows the mini PC to maintain peak performance even under sustained heavy loads.

Memory options include either 64GB or 128GB of soldered RAM, and storage is handled through three PCIe 4.0 x4 M.2 2280 slots for SSDs.

In China, the FAEX1 starts at 10,999 yuan for the 64GB barebones configuration with no SSD. The 128GB version costs 13,999 yuan, which roughly translates to $1,550 and $1,970, respectively, at current exchange rates.

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