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Google Pixel 11 Pro Fold Design Revealed in CAD Renders, Thinner Body and New Camera Module

Google Pixel 11 Pro Fold CAD Renders

A new leak has revealed what the upcoming Google Pixel 11 Pro Fold smartphone might look like. OnLeaks shared these renders in collaboration with Android Headlines. Based on the renders, Google is not making major changes to the overall design.

Google Pixel 11 Pro Fold CAD Renders
Google Pixel 11 Pro Fold CAD Renders

The Pixel 11 Pro Fold keeps the same general shape as its predecessor. The corner curvature also appears largely unchanged. The foldable main display still has a hole-punch camera cutout in the top right corner. The bezels around the display look uniform and thin. Like most book-style foldables, the bezels are slightly raised to help protect the flexible display when the device is folded. The bottom edge houses a USB-C port, microphone, speaker grille, and SIM tray. Small openings on the top edge likely accommodate microphones or antennas.

Google Pixel 11 Pro Fold CAD Renders
Google Pixel 11 Pro Fold CAD Renders

The primary visual update is a redesigned camera island. The module features cleaner lines and improved integration with the rear panel. The LED flash and microphone now sit inside the upper pill-shaped cutout alongside one camera, rather than outside the module. A curved junction between the camera island and backplate creates smoother visual flow. The flat rear panel keeps the centered Google logo.

Physical buttons maintain their positions: the power button above volume controls. The frame uses aluminum construction with a glass back panel. Dimensions show incremental thinning. Height remains 155.2mm with an unfolded width of 150.4mm. Folded thickness drops to 10.1mm (14.9mm with camera bump), down from the Pixel 10 Pro Fold’s 10.8mm. Unfolded thickness measures 4.8mm (9.6mm with bump), compared to the previous 5.2mm. This represents reductions of 0.7mm folded and 0.4mm unfolded.

The device is also expected to bring internal upgrades, including the upcoming Tensor G6 processor. This chip is rumored to be built on TSMC’s 3nm process and may feature a 7-core CPU configuration. Improvements to the camera system are also anticipated compared to the previous model, although specific details about the camera setup have not been revealed yet. More information is likely to surface as the expected August 2026 launch approaches.

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