NVIDIA has released GeForce driver version 595.79 WHQL, adding Game Ready support for Crimson Desert and Death Stranding 2: On the Beach. On the bug fix side, three game-specific crashes are resolved. Crimson Desert and Star Citizen were both crashing on launch, and Resident Evil Requiem had a white glowing dots issue when Subsurface Scattering was enabled. Two general fixes are also included in this release. First is the one addressing GPU voltage being incorrectly capped when overclocked (previously resolved in GeForce Hotfix Display Driver version 595.76), and another fixing intermittent crashes or driver timeouts when playing multi-key DRM content in a browser on HDCP 1.x monitors.

Known issues still present include missing terrain in some areas of Enshrouded and occasional stutter in Arknights: Endfield. The release also adds G-Sync support for a batch of new monitors from Acer, AOC, ASUS, GIGABYTE, LG, MSI, Philips, and ViewSonic.

DOWNLOAD: NVIDIA GeForce 595.79 WHQL

Applied Materials, Inc. today announced it is working with Micron Technology to develop next-generation DRAM, high-bandwidth memory (HBM) and NAND solutions that increase the energy-efficient performance of AI systems, bringing together advanced R&D capabilities from Applied's EPIC Center in Silicon Valley and Micron's state-of-the-art innovation center in Boise, Idaho to strengthen the semiconductor innovation pipeline in the United States.

"Applied Materials and Micron have a long-standing partnership focused on driving higher performance and more energy-efficient advanced memory chips by pushing the boundaries of materials engineering and manufacturing innovation," said Gary Dickerson, President and CEO of Applied Materials. "We are excited to deepen our collaboration with Micron as a founding partner at the EPIC Center as next-generation memory technologies play an increasingly vital role in the future of AI systems."

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300 mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade.

"As AI workloads continue to increase package size, power density, and integration complexity, we believe new materials foundations will be increasingly important to extend advanced packaging roadmaps," said Elif Balkas, Chief Technology Officer at Wolfspeed. "Our 300 mm silicon carbide platform is designed to align SiC's material advantages with industry‑standard manufacturing infrastructure and expand the solution space for next‑generation AI and HPC packaging architectures."

As OpenClaw gains global traction, AI agents are reshaping productivity. Yet, many users face technical hurdles in deployment, from system setup to driver configuration. Beelink bridges this gap with a full-stack AI solution: ranging from exclusive "Lobster Red" models with preinstalled OpenClaw to dual-OS switching versions and plug-and-play SSD upgrade kits. This comprehensive lineup meets diverse user needs while significantly lowering the barrier to AI deployment.

1. New Hardware: Preinstalled OpenClaw Series—AI-Ready Out of the Box
Featuring a premium all-metal chassis in exclusive Lobster Red, these new models offer a distinctive look built for the AI era.

Razer, the leading global lifestyle brand for gamers, today unveils Dynamic Haptics, a new dual-source haptic system that unifies developer‑authored Razer Sensa HD Haptics effects with Audio‑to‑Haptics (A2H). Dynamic Haptics delivers a richer and more consistent haptic landscape across both handcrafted gameplay moments and the ambient world.

A New Level of Haptic Detail
For decades, immersion in games has been defined by what players see and hear. Higher resolutions, faster refresh rates, and spatial audio have pushed realism forward, but often stop short of one critical element: physical sensation.

At Embedded World, MediaTek unveiled a range of new Genio platforms ideal for powering a wide variety of IoT products and applications: MediaTek Genio Pro, Genio 420 and Genio 360. The Genio Pro series is MediaTek's premium offering for high-performance IoT and embedded offerings, while Genio 420 and Genio 360 bring efficient system-level edge AI performance to smart home, retail, industrial, and commercial IoT devices.

With its impressive AI, multimedia, and display capabilities, along with rich OS support, Genio Pro enables OEMs to develop the next generation of autonomous mobile robotics, commercial drones, edge AI devices, machine vision systems, and transportation and logistics platforms.

IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) today announced a collaboration aimed at developing new processes and materials to support sub-1 nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and High-NA EUV lithography processes to advance IBM's logic scaling roadmap.

IBM and Lam have collaborated for more than a decade to advance logic fabrication, notably enabling early generations of 7 nm, nanosheet, and EUV process technologies. Under this new five-year agreement, the companies intend to extend logic scaling to the sub-1 nm node. The work will focus on developing new materials, advanced etch and deposition capabilities for increasingly complex device architectures, and new High-NA EUV lithography processes to enable next-generation interconnect and device patterning and accelerate industry adoption.

Nightdive Studios—renowned video game remaster developer and subsidiary of Atari—is thrilled to announce that SiN: Reloaded, the long-awaited remaster of the 1998 cult classic FPS, will launch in 2026 for PC and consoles. This faithful new edition of SiN boasts enhanced remastered visuals, modernized control schemes, and includes the Wages of SiN extra mission pack. It's time to pay for your sins, #$!%&!

Set in a near-future dystopian world, SiN: Reloaded puts you in control of security consultant Colonel John R. Blade as you take on the seductively evil Doctor Elexis Sinclaire. When Elexis, CEO of SinTEK Industries, begins injecting the streets with a DNA-altering drug, it's time to reassess the laws of morality by facing off against Elexis' unholy army of genetically-engineered mutants. Known for pushing the Quake II engine to its limits, the original SiN was lauded for introducing a groundbreaking amount of interactivity in every level. Players can hack their way into computer terminals using DOS-style code, use elevators and security cameras to wreak havoc, and traverse levels using a variety of vehicles, including a forklift, a patrol boat, and a helicopter. Your actions have consequences, creating branching paths as the game progresses.

AMD has released Ryzen Chipset Driver version 8.02.18.557, a maintenance update focused on bug fixes and restoring a couple of components that went missing in a previous package. Specifically, support for the AMS Mailbox driver and the S0i3 filter driver are back, both needed for power management and system communication on supported Ryzen platforms. A few known issues are still present. Users on chipset installer version 7 can't directly roll back to version 6 or older. If you need to do that, you'll have to uninstall the newer installer first, delete the Qt_Dependencies folder, and then install the older package.

Other minor fixes include driver names showing up in English on non-English operating systems, occasional failures when installing or upgrading the Ryzen PPKG component, and some compatibility issues with the AMS and S0i3 filter drivers on non-English OS environments.

DOWNLOAD: AMD Chipset Software 8.02.18.557

At Embedded World 2026, Intel launched the Intel Core processor Series 2 with P-cores, an industrial-ready platform engineered for mission-critical edge applications. Intel also announced its latest Edge AI suite for Health & Life Sciences, providing validated reference pipelines and benchmarking tools for AI-powered patient monitoring solutions.

"Intel continues to lead in edge computing, which remains one of our fastest-growing business segments," said Dan Rodriguez, Intel corporate vice president and general manager of the Edge Computing Group. " With the introduction of Core Series 2, our CES launch of Core Ultra Series 3, and our expanding Edge AI Suites, we continue to deliver comprehensive platforms that meet diverse edge customer needs with breakthrough performance, reliability, and integrated AI acceleration."

MONTECH, a global leader in PC cases, power supplies, and cooling solutions, proudly announces the launch of SKY 3, the next evolution of its iconic SKY series PC cases. SKY 3 introduces a reimagined modular internal architecture and integrated horizon lighting, designed to meet the demands of next-generation hardware while delivering a remarkably clean and adaptable build experience. With support for back-connect motherboards and next-gen GPUs, SKY 3 blends future-ready performance with refined, modern aesthetics.

Adaptive Modular Bottom Chamber
At the heart of SKY 3 is an innovative adaptive modular bottom chamber, featuring a fully swappable PSU compartment and bottom fan bracket that allow builders to customize internal layouts based on cooling priorities. In GPU Mode, intake fans are positioned directly beneath the graphics card to maximize static pressure and cooling efficiency. In CPU Mode, airflow is redirected toward the motherboard area, helping dissipate heat from VRMs and surrounding components while supporting stable CPU operation. This flexible design empowers users to tailor airflow behavior to their specific system configuration.

[Editor's note: Our in-depth review of the Montech Sky 3 is now live]

Akasa, a leading provider of thermal solutions, announced the Pascal MX, an IP65-rated dust-tight and water jet resistant aluminium fanless case designed for Mini-ITX and Thin Mini-ITX motherboard systems operating in industrial, outdoor or mission-critical environments. The Pascal MX addresses one of the core challenges in harsh-environment embedded computing: maintaining system reliability where conventional fan-cooled cases fail due to dust ingress and moisture. For engineers and system integrators attending Embedded World 2026 in Nuremberg from 10 to 12 March, the Pascal MX will be on display at Hall 1, Booth 640, alongside Akasa's wider range of fanless cases, CPU coolers, heatsinks, and thermal solutions.

At the heart of the Pascal MX is Akasa's patented spring-loaded CPU mounting system, which maintains consistent, uniform contact pressure across all supported sockets (Intel LGA1851, LGA1700, and LGA1200). This enables the same chassis to support Intel Core processors from 10th-14th Generation and the latest Intel Core Ultra (15th Gen) processors, all at up to 65 W TDP. Heat from the CPU and M.2 2280 SSD is conducted into the aluminium chassis via dedicated thermal modules, dissipating passively through the external fins. With no fans and no moving parts, the Pascal MX eliminates the primary sources of mechanical failure and particulate ingress that limit system uptime in demanding deployments.

Factory automation, physical AI in mobile robotics, and other AI-driven edge applications are rapidly evolving and driving the need for computing platforms that provide real-time AI processing, deterministic performance, and long-term reliability in always-on environments.

To meet these needs, AMD is expanding its AMD Ryzen AI Embedded P100 Series processor portfolio. New processors feature up to 2x higher CPU core counts, up to 8x higher graphics processing unit (GPU) compute, and an estimated 36% higher system tera operations.

ASRock Industrial announces new industrial motherboards supporting AMD EPYC 4005/4004, Ryzen 9000/8000/7000, and Ryzen Embedded 9000/7000 Series processors, expanding its platform portfolio across IMB-A1700, IMB-A1302, IMB-A1003, and IMB-A1002. Powered by AMD EPYC 4005 Series processors with up to 16 cores and 32 threads, delivering high-performance and energy efficiency for edge servers and enterprise workloads, alongside Zen 5-based Ryzen 9000 Series for exceptional computing power and Ryzen Embedded 9000 Series for long-term availability in reliable edge computing. Supporting ATX, microATX, and Mini-ITX form factors, these platforms feature DDR5 memory, PCIe Gen 5 expansion, multi-display capability, and rich industrial I/O to enable flexible system designs for computer vision, video analytics, AI-enhanced workloads, software development, gaming platforms, and professional-grade productivity systems.

IMB-A1700 Series: ATX Motherboard for high-performance
The IMB-A1700 ATX motherboard supports AMD EPYC 4005/4004, Ryzen 9000/8000/7000, and Ryzen Embedded 9000/7000 Series processors, delivering robust computing performance for demanding workloads. The board features four DDR5 5600 MHz ECC/non-ECC U-DIMM slots supporting up to 256 GB of memory, providing a stable foundation for high-throughput and multitasking environments. Expansion capability includes two PCIe x16 (Gen 5) slots, configurable as either one PCIe x16 (Gen 5) or two PCIe x8 (Gen 5), one PCIe x4 (Gen 4), and four PCIe x1 (Gen 4) slots, enabling flexible integration of GPUs, AI accelerators, and add-on cards. Storage support includes one M.2 key M for NVMe SSD and four SATA3 ports with RAID 0/1/10 support, enabling high-speed storage deployment. I/O connectivity is comprehensive, featuring seven USB 3.2 Gen 2 ports, eight USB 2.0 ports, and six COM ports, complemented by three 2.5G LAN and one 1G LAN. Supporting quad-display output via HDMI 2.0b and DisplayPort 1.2++ and built in an ATX form factor (12 x 9.6 inches), the IMB-A1700 is well-suited for AI-driven video analytics platforms, computer vision servers, high-end development systems, and performance-focused computing deployments.

Following the recently launched InfinityBook Max 16 - INTEL with Core Ultra 9 275HX, the AMD-based variant of the thin and light Linux gaming workstation is now ready to hit the market.

Despite its robust high-quality full-metal chassis, the InfinityBook Max 16 weighs just over 2 kg and is powered by up to a Ryzen AI 9 HX 370, an NVIDIA GeForce RTX 5060 or 5070, and a 99 Wh battery, while the 500 nits, 100 % DCI-P3 display qualifies the Linux ultrabook workstation for software development, professional media design, and gaming.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, is excited to introduce the H810MT-E 2.0 motherboard, a smart and future-ready platform engineered to power modern everyday computing. Built around Intel's latest Core Ultra 9, 7, and 5 processors in the LGA1851 package and driven by the Intel H810 single-chip architecture, the H810MT-E 2.0 brings next-generation technologies together with proven stability. Designed for office productivity, home entertainment, and versatile system builds, it delivers consistent performance for daily workloads while providing the flexibility to grow alongside evolving user demands.

The H810MT-E 2.0 fully embraces next-generation DDR5 memory technology, supporting up to 128 GB across dual DIMM slots to ensure smooth and responsive multitasking. Delivering significantly higher bandwidth than previous-generation DDR4 while operating with improved power efficiency, DDR5 accelerates application performance, enhances workflow fluidity, and strengthens overall system responsiveness. From handling office applications and multiple browser sessions to streaming high-resolution media at home, users benefit from a platform built to keep pace with today's computing requirements while maintaining balanced efficiency.

AYANEO Pocket AIR Mini, AYANEO's first entry-level product, carries with it the memories and nostalgia of classic gaming while setting a new benchmark for retro handhelds in its class. With AYANEO's flagship DNA fully integrated, players can experience top-tier handheld design and features at an entry-level price, turning the vision of a "retro handheld that everyone can afford" into reality.

Since its release, AYANEO Pocket AIR Mini has quickly won the hearts of players and truly lived up to its reputation as a high-quality retro handheld that everyone can enjoy. With its exquisite mini form factor, classic retro control layout, and excellent performance, it not only satisfies players' nostalgia for traditional handheld gaming but also makes every gaming session more immersive and enjoyable. Whether you are a longtime retro gaming enthusiast or a newcomer to handheld gaming, this device offers a fun and engaging experience for everyone.

Advantech (TWSE: 2395), a global leader in Edge Computing and IoT automation solutions, today announced the launch of the EKI-6333BE-4GD, its first industrial-grade Wi-Fi 7 Access Point designed to deliver deterministic wireless connectivity for next-generation smart factories, autonomous logistics, and AI-driven industrial environments.

As mobile automation, robotics, and Edge AI applications rapidly expand across industrial environments, reliable wireless infrastructure has become critical for ensuring uninterrupted operations. The EKI-6333BE-4GD addresses these challenges with high-throughput Wi-Fi 7 connectivity, industrial-grade resilience, and advanced network management, enabling enterprises to build secure and scalable wireless infrastructure for mission-critical industrial systems.

Over a decade ago, the BC1 Open Benchtable launched with one clear goal: the ultimate portable platform for traveling overclocking enthusiasts. Its minimalist, toolless, flat pack design proved so effective that it quickly became the benchmark for open air builds, evolving from road warrior to permanent showcase platform for hobbyists and professionals alike.

Portability demanded compromises: slim profile, simple brackets, no native support for complete vertical builds. Today we close those gaps with precision engineered accessories that extend the BC1's legendary versatility without changing its core DNA.

imec, a global leader in nano-electronics and digital innovation, and Atlas Data Storage, a pioneer of production-scale DNA data storage, today announce a new strategic partnership to accelerate the development of digital data storage using synthetic DNA. The collaboration combines Atlas' ASIC design expertise and scalable DNA synthesis technology with imec's deep expertise in advanced chip development, fabrication, and integration. In addition to prototyping and strategic support, imec is investing in Atlas.

As data creation and storage accelerates in the AI age, magnetic media such as tape and hard disk drives face unavoidable limits in density, sustainability, cost, and long-term reliability. DNA data storage compresses vast datasets into tiny volumes while ensuring ultra-long durability with minimal energy and maintenance.

System76 has refreshed its Launch mechanical keyboard lineup with a new Prism Black finish and doubleshot PBT shine-through keycaps, the latter being corrosion-resistant and keeping the RGB backlighting visible without washing it out. For the unfamiliar, System76 is based in Denver, Colorado, US, and is primarily known for its Linux-first laptops, desktops, and servers, plus the in-house Pop!_OS operating system. Both the Launch and Launch Heavy keyboards are milled from solid aluminium blocks and built around a custom open-source PCB. Switch swapping is tool-free thanks to Kailh MX hot-swap sockets, with Jade, Royal, Silent Pink, and Silent Brown variants available at purchase. The keyboards also feature per-key RGB and full N-key rollover. Firmware is QMK-based and fully open source, with layout and lighting customization handled through the System76 Keyboard Configurator app on Linux, Windows, and macOS.

Connectivity on both keyboards is wired, using a detachable USB connection, and System76 includes both USB-C to USB-C and USB-A to USB-C cables in the box. The compact Launch measures 308.3 mm x 135.1 mm x 30.6 mm, with an 84-key layout, and includes a four-port USB hub with two USB-C and two USB-A ports, all running at 10 Gbps. The Launch Heavy offers a 105-key layout, measures 394 mm x 135.1 mm x 30.3 mm, and comes with the same SuperSpeed four-port USB hub to match. The Launch starts at $285 and the Launch Heavy at $299.

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the industry's leading HBM4E Memory Controller IP, extending its market leadership in HBM IP. This new solution delivers breakthrough performance with advanced reliability features enabling designers to address the demanding memory bandwidth requirements of next-generation AI accelerators and graphics processing units (GPUs).

"Given the insatiable bandwidth demands of AI, it's imperative for the memory ecosystem to continue aggressively advancing memory performance," said Simon Blake-Wilson, SVP and general manager of Silicon IP, at Rambus. "As a leading silicon IP provider for AI applications, we are bringing the industry's leading HBM4E Controller IP solution to the market as a key enabler for breakthrough performance in next-generation AI processors and accelerators."

NVIDIA has rolled out GeForce Hotfix Display Driver version 595.76, based on the recently released 595.71 WHQL Game Ready driver. The update specifically targets a GPU voltage cap issue affecting overclocked graphics cards, which prevented them from boosting to expected frequency levels. The voltage limitation surfaced shortly after the March 3 release of the 595.71 WHQL driver, which itself was meant to resolve problems introduced by the earlier 595.59 build. Users with RTX 50-series "Blackwell" GPUs reported reduced boost clocks and performance degradation under load, with observed core voltages sitting lower than on prior drivers. The new 595.76 hotfix restores proper voltage behavior when overclocking is applied.

Beyond the voltage fix, the hotfix addresses several game-related issues. In Resident Evil Requiem, it resolves white glowing artifacts that appeared when Subsurface Scattering was enabled and improves path tracing performance. It also fixes launch crashes in Star Citizen and corrects intermittent application crashes or driver timeouts when playing multi-key DRM content in browsers on HDCP 1.x monitors. As with all NVIDIA hotfix releases, version 595.76 is a beta, optional driver distributed through the company's Customer Care support site. It undergoes a shortened QA cycle and will be pulled once its fixes are rolled into the next official WHQL-certified release. Users seeking maximum stability may prefer to wait for that broader driver update.

DOWNLOAD: NVIDIA GeForce Hotfix Display Driver 595.76

NVIDIA is reportedly planning a second RTX 5050 variant with 9 GB of memory instead of the standard 8 GB, according to leaker MEGAsizeGPU who has a decent track record on NVIDIA leaks. Unlike the existing RTX 5050, which uses 8 GB of 20 Gbps GDDR6 memory on a 128-bit bus for 320 GB/s of bandwidth, the new model is said to adopt 3 GB GDDR7 modules. The updated configuration would total 9 GB across a 96-bit memory bus. While the narrower bus reduces interface width, the move to 28 Gbps GDDR7 would raise total memory bandwidth to 336 GB/s, a roughly 5% increase, alongside a 12.5% boost in VRAM capacity. Core specifications are expected to remain unchanged. The card would continue to use the GB207 GPU, based on the Blackwell architecture, with 2560 CUDA cores and a 130 W TDP. No changes to clock speeds or core counts have been mentioned.

The report also claims NVIDIA is preparing adjustments higher up the stack. A revised GeForce RTX 5060 may transition to the larger GB205 die, currently used in the RTX 5070, in a cut-down configuration. That would reportedly reduce the GPU from 6144 CUDA cores and a 192-bit bus to 3840 cores and a 128-bit interface. Such a move would require board partners to adopt new PCBs compatible with GB205 and standard 8-pin power connectors. According to the leak, these changes are tied to supply constraints affecting lower-tier RTX 50-series GPUs, including the RTX 5050 and RTX 5060. The GeForce RTX 5060 12 GB, which appeared in earlier roadmaps, is now reportedly canceled.

Lamptron has added silver colorways to its HC060 and HM049 hardware monitors, two compact displays built for real-time system monitoring inside or alongside a PC. The bigger of the two is the HC060, a 6-inch LCD running at 1024 x 768 and 60 Hz. It connects over HDMI and Micro USB, draws power via USB, and ties into AIDA64 for live system data, however, it can also handle photos, video, or light gaming if you want to use it that way. The unit measures 148.5 x 8.5 x 70 mm with a visible screen area of 133 x 74.5 mm and an 80° viewing angle. It can sit on a desk or be mounted inside a chassis, and supports custom skins from Lamptron or your own.

The HM049 is the smaller option at 4.9 inches, with a 960 x 320 panel at 60 Hz. Same connectivity and AIDA64 support, same skin customization, just in a more compact 148.5 x 42.5 x 66 mm body with a 111×37.5 mm display area and matching 80° viewing angle. Both models are available through the Lamptron AliExpress store and regional resellers across Europe, North America, and Asia. The HC060 starts at €149.90 and the HM049 at €79.90.

Panmnesia, an AI infrastructure link solution provider, today announced the signing of a strategic Memorandum of Understanding (MOU) with SK Telecom, South Korea's largest telco and a leading AI company. The agreement, signed at MWC26 in Barcelona, aims to jointly develop a CXL-based next-generation AI data center architecture.

As large-scale AI services continue to expand, data centers are investing heavily in massive deployments of high-performance GPUs, resulting in astronomical costs. Recognizing the need for sustainable scalability, SK Telecom and Panmnesia are focusing beyond simple GPU expansion to technologies that enable more efficient utilization of existing computing resources. Through this collaboration, the two companies aim to simultaneously improve cost efficiency and performance by innovating data center interconnect architecture based on Compute Express Link (CXL) technology.

Asustor has rounded out its AS72 rackmount NAS lineup with the AS7224RDX Lockerstor 24R Pro Gen 2, adding a 24-bay option to sit alongside the existing 12-bay AS7212RDX and 16-bay AS7216RDX models that launched back in August 2025. The new model supports drives up to 32 TB, giving it a raw internal capacity of 768 TB. It can be expanded to 36 bays with the AX7012R expansion unit, at which point it can pass the 1 PB internal capacity. The AS72 family runs on an AMD Ryzen 7 Pro 7745 (8 cores, up to 5.3 GHz) and comes with 16 GB of DDR5-4800 ECC memory, upgradeable to 192 GB. Networking covers dual 10 GbE and dual 1 GbE out of the box, with PCIe Gen 5 x8 and x4 slots available for 25/40/50 GbE NICs or SAS cards if you need more. Asustor quotes SMB multichannel speeds of up to 2,309 MB/s read and 1,886 MB/s write over 10 GbE in RAID 5.

The rest of the feature set is what you'd expect at this level: RAID 0/1/5/6/10/50/60, hot-swap bays, a hardware encryption engine, M.2 PCIe Gen 5 SSD support, four USB 3.2 Gen 1 Type-A ports, and dual redundant 550 W 80 Plus Platinum PSUs. No pricing has been announced.

Razer, the leading global lifestyle brand for gamers, today unveiled the Razer BlackShark V3 X HyperSpeed for Xbox - White Edition and Razer BlackShark V3 X HyperSpeed for PlayStation - White Edition.

Bringing a clean new colorway to one of Razer's most lightweight, high-performance wireless console headsets, the White Edition is designed to complement next-generation consoles while delivering the same esports-ready performance that the BlackShark line is known for.

QNAP Systems, Inc., a leading innovator in computing, networking, and storage solutions, today introduced the TS-h1077AFU, a compact 10-bay SATA-based all-flash NAS designed for businesses seeking fast, reliable, and cost-effective flash storage. Built on the ZFS-based QuTS hero operating system, powered by AMD Ryzen PRO 7000 Series processors, and equipped with ECC DDR5 memory, the TS-h1077AFU delivers exceptional performance, data integrity, and deployment value. Engineered with speed, density, and reliability at its core, the TS-h1077AFU is ideal for virtualization, high-speed media workflows, database operations, and multi-site backup consolidation.

"Following the strong market reception of our 30-bay TS-h3077AFU, we developed the TS-h1077AFU to bring the same enterprise flash performance to a more compact and versatile form factor," said Alex Shih, Product Manager at QNAP. "This 10-bay model gives businesses greater flexibility when designing high-performance flash storage architectures, while retaining the reliability and data integrity that QuTS hero is known for."

Today at MWC 2026, Lenovo announced its latest consumer device innovations targeted at creators, gamers, and productivity-focused users. This includes powerful creative convertibles like the Yoga 9i 2-in-1 Aura Edition (14", 11), ultralight laptops like the IdeaPad Slim 5i Ultra (14", 11), productivity-on-the-go tablets like the Idea Tab Pro Gen 2, and the Yoga Pro 7a (15", 11) and the Legion 7a (15", 11)—laptops both powered by AMD Ryzen AI Max+ Series processors, delivering next-generation improvements in performance, AI experiences, and graphics.

Lenovo also unveiled proofs of concept from both its Yoga and Legion sub-brands—the Yoga Book Pro 3D Concept and the Legion Go Fold Concept—that embody Lenovo's commitment to pushing the envelope with its consumer innovations. The Yoga Book Pro 3D Concept addresses gaps in the 3D creative process by shedding the need for peripherals and streamlining user interactions. The Legion Go Fold Concept pushes the adaptability ethos of the Legion Go line of gaming handhelds even further with modularity to fit even more use cases.

AMD is seeing server CPU demand it didn't fully anticipate, with CEO Lisa Su describing it as having "far exceeded" her expectations. Speaking at the Morgan Stanley Technology, Media & Telecom Conference earlier today, Su outlined how the landscape has shifted as agentic AI applications have taken off, pushing CPUs back into the spotlight alongside accelerators. The CPU-to-GPU ratio in AI compute workloads has evolved dramatically over the past few months, and top customers reportedly told Su that CPU demand sitting alongside AI was "under-forecasted." Supply is tightening as a result. The sudden spike in customer commitments left little time for the supply chain to adjust, though AMD says it's working closely with partners to ease existing bottlenecks and expects capacity to expand over the coming year. Su expressed confidence that AMD's product lineup is well positioned to address training, inference, and agentic workloads going forward. We've also seen this play out at the customer level, with hyperscalers like Meta signing CPU agreements with AMD and NVIDIA, a sign that compute is diversifying away from a pure GPU focus.

Back in late January, Intel disclosed it had to reallocate wafer capacity from its PC division to Xeon production after hyperscalers started ordering larger quantities than anticipated, triggering a temporary shortage. Then, in early February, both Intel and AMD warned customers in China about tightening supplies, with Intel Xeon delivery times stretching to as long as six months and prices up more than 10%. AMD's situation is somewhat less difficult, but lead times have still pushed out to eight to ten weeks for some orders. On the consumer side, AMD's next-gen Ryzen 'Olympic Ridge' desktop processors based on Zen 6 are rumored to have slipped to 2027, possibly another sign that AMD is prioritizing Zen 6 chiplets for EPYC server processors.

Micron Technology, Inc. (Nasdaq: MU) today extended its leadership in low-power server memory by shipping customer samples of the industry's highest-capacity LPDRAM module—256 GB SOCAMM2. Enabled by the industry's first monolithic 32 Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures.

The convergence of AI training, inference, agentic AI and general-purpose compute are driving more demanding memory requirements and reshaping data center system architectures. Modern AI workloads drive large model parameters, expansive context windows and persistent key value (KV) caches, while core compute continues to scale in data intensity, concurrency and memory footprint.

Elgato, a brand of CORSAIR, today announced Wave Next, the company's next generation of audio products and the most significant evolution of the Wave platform since its debut in 2020. Wave Next brings together six deeply integrated products: Wave Link 3.0 software, Wave:3 MK.2, Wave XLR MK.2, XLR Dock MK.2, Wave XLR Pro, and Stream Deck + XL. Together, they form a cohesive ecosystem spanning audio capture, processing, and control, built for how modern creators and professionals actually work.

"When we launched the first Wave microphone in 2020, we set out to make audio workflows easier for creators," said Julian Fest, SVP and General Manager of Elgato. "Since then, hundreds of thousands of real-world setups have taught us what works, what is still too complicated, and where the real bottlenecks are. Wave Next is the synthesis of everything we have learned, reimagined into a single platform offering powerful software that is now free for everyone, hardware that processes audio at the source, and physical controls that make managing it all feel effortless."

Apple today announced a new family of displays engineered to pair beautifully with Mac and meet the needs of everyone, from everyday users to the world's top pros. The new Studio Display features a 12MP Center Stage camera, now with improved image quality and support for Desk View; a studio-quality three-microphone array; and an immersive six-speaker sound system with Spatial Audio. It also now includes powerful Thunderbolt 5 connectivity, providing more downstream connectivity for high-speed accessories or daisy-chaining displays.

The all-new Studio Display XDR takes the pro display experience to the next level. Its 27-inch 5K Retina XDR display features an advanced mini-LED backlight with over 2,000 local dimming zones, up to 1000 nits of SDR brightness, and 2000 nits of peak HDR brightness, in addition to a wider color gamut, so content jumps off the screen with breathtaking contrast, vibrancy, and accuracy. With its 120 Hz refresh rate, Studio Display XDR is even more responsive to content in motion, and Adaptive Sync dynamically adjusts frame rates for content like video playback or graphically intense games. Studio Display XDR offers the same advanced camera and audio system as Studio Display, as well as Thunderbolt 5 connectivity to simplify pro workflow setups. The new Studio Display with a tilt-adjustable stand starts at $1,599, and Studio Display XDR with a tilt- and height-adjustable stand starts at $3,299. Both are available in standard or nano-texture glass options, and can be pre-ordered starting tomorrow, March 4, with availability beginning Wednesday, March 11.

Apple today announced M5 Pro and M5 Max, the world's most advanced chips for pro laptops, powering the new MacBook Pro. The chips are built using a new Apple-designed Fusion Architecture. This innovative design combines two dies into a single system on a chip (SoC), which includes a powerful CPU, scalable GPU, Media Engine, unified memory controller, Neural Engine, and Thunderbolt 5 capabilities. M5 Pro and M5 Max feature a new 18-core CPU architecture. It includes six of the highest-performing core design, now called super cores, that are the world's fastest CPU core. Alongside these cores are 12 all-new performance cores, optimized for power-efficient, multithreaded workloads. Collectively, the CPU significantly boosts performance by up to 30 percent for pro workloads.

The GPU scales up the next-generation architecture introduced in M5 to an up-to-40-core GPU. With a Neural Accelerator in each GPU core and higher unified memory bandwidth, M5 Pro and M5 Max are over 4x the peak GPU compute for AI compared to the previous generation. The GPU substantially increases graphics capabilities—now up to 35 percent for apps using ray tracing than M4 Pro and M4 Max—enhancing advanced visual effects and 3D rendering. With M5 Pro and M5 Max, the new MacBook Pro is the ultimate powerhouse for pros and is available for pre-order starting tomorrow, with availability beginning Wednesday, March 11.

Each week, new games and apps integrating NVIDIA DLSS, NVIDIA Reflex, and advanced ray-traced effects are released or announced, delivering the definitive PC experience for GeForce RTX players. DLSS 4.5 is our latest upgrade to the ever-improving DLSS Super Resolution, adding a second generation transformer model that further enhances image quality. Via the NVIDIA app, you can apply DLSS 4.5 Super Resolution to your game library on all GeForce RTX PCs and laptops, instantly upgrading clarity and quality.

This week, you can upgrade Marathon and Black One Blood Brothers with DLSS 4.5 Super Resolution, followed by Monster Hunter Stories 3: Twisted Reflection on March 13th. And Demonologist now includes native support for DLSS 4.5 Super Resolution. On March 19th, DEATH STRANDING 2: ON THE BEACH launches, featuring DLSS 4 With Multi Frame Generation, and DLSS Super Resolution that can be upgraded to DLSS 4.5 Super Resolution via the NVIDIA app.

BenQ, the global leader in display and color-tuning innovation, today announced its MA270S, a new 27-inch 5K monitor designed to give Mac users the clarity, color, and intuitive experience they expect from a native Apple display. As the latest expansion to the Mac-optimized MA series, including the MA270U/MA270UP and MA320U/MA320UP, the BenQ MA270S is ideal for Mac users who rely on precise visual detail and text clarity to match the accuracy and sharpness of their MacBook display.

The MA270S features a Nano Gloss panel and true 5K resolution (5120x2880), matching macOS native pixel density for sharper text, lifelike images, and comfortable extended use. It delivers Mac-level color with 500-nit brightness, 99% P3 color, and a 2000:1 contrast ratio for vibrant color reproduction and crisp detail. With iKeyboard Control, users can adjust brightness and volume directly from the MacBook keyboard, creating a more seamless, native Mac experience.

Fraunhofer IIS and Airoha Technology are presenting a breakthrough multi-channel spatial audio solution for next-generation wireless headsets at Mobile World Congress (MWC) 2026. The collaboration integrates Fraunhofer's industry-leading LC3plus codec and Cingo spatial audio rendering solutions with Airoha's flagship Bluetooth SoC, the AB1595—enabling high-definition, low-latency, and resilient wireless multichannel audio tailored for premium mobile and XR applications.

At the core of this joint solution is a seamless, high-definition multichannel wireless transmission chain designed to meet the evolving demands of mobile devices, extended reality (XR), and immersive media ecosystems. By leveraging Airoha's proprietary High Data-rate Technology (HDT), the AB1595 platform provides the robust bandwidth required to support Fraunhofer's LC3plus codec. This combination delivers high-resolution audio with efficient bitrates and ultra-low latency—essential for scalable, multichannel headset designs that go far beyond traditional stereo limitations.

At MWC 2026, Fibocom (300638.SZ, 0638.HK) and MediaTek unveiled a flagship CPE solution powered by the FG390 5G module and Filogic 8800 Wi-Fi 8 chipset. The new design combines 5G-A's high-speed connectivity with Wi-Fi 8's enhanced wireless performance, delivering faster, smarter, and more reliable network access for global users.

Key Highlights:

• Powerful 5G + Wi-Fi 8 integration: The solution integrates with the Filogic 8800 Wi-Fi 8 platform and the FG390 5G module powered by MediaTek T930, bringing together the best of 5G-A and Wi-Fi 8 to create seamless, high-performance connectivity for homes and SMB.
• Smarter multi-AP collaboration: Reduces interference by over 40% and boosts spectrum efficiency for smoother multi-device operation.
• Extended coverage and stronger stability: With Enhanced Long-Range (ELR) and dRU technologies, wall penetration and coverage increase by up to 40%, keeping edge connections stable.
• Lower latency, higher throughput: Latency drops to sub-millisecond levels, while throughput doubles—even with 200+ devices connected simultaneously.
• Designed for the AI era: Supports 2.4/5/6 GHz tri-band concurrency, ensuring reliable connections for AI devices, AR/VR applications, and smart-home networks.

Samsung is overhauling the power delivery network in its HBM4E memory to tackle what's becoming one of the bigger engineering headaches in next-gen AI chips. This comes just two weeks after the company shipped its first commercial HBM4, already pushing 11.7 Gbps consistently with headroom up to 13 Gbps. As designs move from HBM4 to HBM4E, the number of power bumps grows from 13,682 to 14,457, packed into the same space with thinner, denser wiring. That drives up current density and resistance, causing IR drop (voltage weakens as it travels through the circuits) while the heat generated in the process makes things worse, creating a feedback loop that can affect performance or even cause circuit failure.

To fix this, Samsung segmented the power network. The large centralized MET4 power block on the base die, previously laid out in big honeycomb-like sections near the interposer, has been split into four smaller sections, with upper layers further broken up to reduce congestion and shorten routing paths. According to Samsung, the results were significant, metal circuit defects dropped 97% compared to HBM4, and IR drop improved by 41%, giving the chip more voltage headroom for higher speeds and better reliability.

ASRock Industrial announces the launch of the iEPF-11000S Series, a powerful Expandable Edge AIoT Platform engineered for next-generation edge AI applications. Powered by Intel Xeon 600 processors with W890 chipset, the iEPF-11000S Series delivers professional grade CPU performance, support for up to four graphic cards, PCIe Gen 5 connectivity, and up to 2 TB of RDIMM/RDIMM-3DS DDR5 memory with ECC protection for mission-critical edge processes. Designed for versatility, the iEPF-11000S Series features a comprehensive I/O with multiple expansion slots, high-speed networking including 10 GbE, and advanced storage capabilities. Built for professional computing environments, it includes a robust 1600 W power supply unit, TPM 2.0 security, and Intel vPro manageability. With support for both 4U tower or rack-mount configurations, the series is primed for advanced edge AI computing platforms, powering Gen AI LLMs, AI training and inference, visual computing, data analytics, and compute-intensive industrial applications that demand exceptional processing power and reliability.

iEPF-11000S: Quad-GPU Edge AI Platform with Intel Xeon 600
Powered by Intel Xeon 600 processors, the iEPF-11000S Series delivers high performance for edge AI computing, real-time analytics, and compute intensive industrial automation. Supporting up to 2 TB of quad-channel DDR5 ECC RDIMM memory, it ensures fast, reliable, and memory-intensive processing for AI model training, predictive maintenance, and automation. Designed for AI acceleration, deep learning, and high-performance visual computing, the iEPF-11000S Series supports up to four discrete GPUs, delivering the compute power needed for multimodel parallel inference, AI training, and intensive visual computing. Its powerful computing resources enable accelerated deployment of real-time AI inference, data analytics, and intelligent industrial automation.

At MWC Barcelona 2026, Huawei debuts its latest SuperPoD product Atlas 950 SuperPoD, TaiShan 950 SuperPoD and a series of computing solutions to the global market. This embodies the company's latest endeavor to open source and open collaboration with the aim of building a resilient computing foundation and creating a new option worldwide.

Tech innovation builds a resilient computing foundation
With AI technologies evolving rapidly and models now using trillions of parameters, agentic AI is beginning to penetrate into core production processes in many industries. This is driving up demand for larger computing scale and lower latency. However, these massive models are beyond the reach of conventional horizontal scaling; larger clusters often suffer from lower utilization and frequent training interruptions.

Akasa, a leading provider of thermal solutions, has launched the AK-CC7409BP01, a low-profile CPU cooler designed for thermally demanding, space-constrained environments. Compatible with Intel LGA1851 and LGA1700 sockets, the cooler integrates a copper vapor chamber heatsink and a UL-certified side blower fan to deliver reliable, sustained cooling at only 29.5 mm in height, making it well-suited to 1U servers, SFF systems and other applications where vertical clearance is limited.

The AK-CC7409BP01 supports 12th-14th Generation Intel Core desktop processors (LGA1700 socket) and Intel Core Ultra Series 2 processors (LGA1851 socket) up to 125 W TDP.

Rich color options, powerful features, and an ultra-lightweight build—the Yunzii M1 is designed to deliver exceptional comfort and precision in every move. With its sleek design and pro-level performance, it's the perfect upgrade for your gaming desk setup and daily workflow alike.

Versatile Connectivity
The Yunzii M1 supports 2.4 GHz wireless, Bluetooth, and USB-C wired modes, offering flexible and low-latency performance across different usage scenarios. Compatible with both Windows and macOS, it transitions seamlessly between gaming, office work, and travel setups. Each package includes the Yunzii M1 mouse, a Type-C cable, a 2.4G receiver with a built-in storage compartment, and a user manual—everything you need right out of the box.

Today, the NanoIC pilot line, a European initiative coordinated by imec and dedicated to accelerating innovation in chip technologies beyond 2 nm, releases two first-of-a-kind advanced interconnect process design kits (PDKs): a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) hybrid bonding PDK. These early-access PDKs bring advanced packaging capabilities within reach of universities, start‑ups, and industry innovators and mark an important step in enabling high‑density, energy‑efficient chip‑to‑chip connectivity.

As the semiconductor industry moves toward ever more complex and heterogeneous system architectures, advanced packaging has become a key enabler in supporting this progress. Instead of merely enclosing individual chips, today's packaging technologies bring multiple dies (chiplets) together into tightly integrated systems where performance, energy efficiency, and bandwidth hinge on how effectively those components can interact. By enabling chiplets to be interconnected at high density, advanced packaging provides the foundation for the next generation of high‑performance computing, AI accelerators, and data‑intensive applications.

Apple today announced the new iPad Air featuring M4 and more memory, giving users a big jump in performance at the same starting price. With a faster CPU and GPU, iPad Air boosts tasks like editing and gaming, and is a powerful device for AI with a faster Neural Engine, higher memory bandwidth, and 50 percent more unified system memory than the previous generation. With M4, iPad Air is up to 30 percent faster than iPad Air with M3, and up to 2.3x faster than iPad Air with M1. The new iPad Air also features the latest in Apple silicon connectivity chips, N1 and C1X, delivering fast wireless and cellular connections—and support for Wi-Fi 7—that empower users to work and be creative anywhere. Available in two sizes and four gorgeous finishes that users love, the 11-inch iPad Air is super portable, and the 13-inch model provides an even larger display for those who want more space to multitask. With game-changing iPadOS 26 capabilities, advanced cameras, all-day battery life, a powerful app ecosystem, and support for accessories like Apple Pencil Pro and Magic Keyboard, iPad Air delivers a remarkable and versatile experience for anyone who wants to do more on iPad, from students and creators, to business users and gamers.

With the same starting price of just $599 for the 11-inch model and $799 for the 13-inch model, the new iPad Air is an incredible value. And for education, the 11-inch iPad Air starts at $549, and the 13-inch model starts at $749. Customers can pre-order iPad Air starting Wednesday, March 4, with availability beginning Wednesday, March 11.

Samsung Display participates in MWC26, the world's largest mobile communications exhibition, held in Barcelona, Spain from March 2 to 5. Marking its fourth consecutive year at the event, Samsung Display showcases a broad portfolio of OLED technologies that serve as both interfaces and component solutions optimized for AI edge computing. Notably, reflecting the growing importance of smartphone privacy alongside enhanced AI capabilities, the company has unveiled the "Flex Magic Pixel" zone, presenting its breakthrough panel-integrated privacy technology that demonstrates its OLED innovation to a global audience.

Under this year's exhibition theme, "The IQ Era," Samsung Display has designed its booth around the concept of "Intelligent OLED City." The booth is organized into four zones: AI Square, AI Edge District, AI Entertainment District and AI Sports District.