Apple is beginning to lay the critical groundwork for its next-gen custom chips, including a much-anticipated server chip, dubbed Baltra, as per a new analysis from Morgan Stanley Apple is increasing its reservation slots for TSMC's SoIC packaging tech in anticipation of its next-gen custom chips, including the Baltra ASIC Morgan Stanley has noted in a fresh analysis that Apple is "ramping up" SoIC-related activity at TSMC: "Apple is materially ramping SoIC capacity at TSMC, pointing to a major push in Apple silicon for AI servers. TSMC (covered by Charlie Chan) is expanding its SoIC (System on Integrated Circuit) capacity, […]

Read full article at https://wccftech.com/apple-is-materially-ramping-soic-capacity-at-tsmc-as-it-prepares-for-its-baltra-asic-m5-pro-max-m6-pro-max-chips-with-60k-capacity-equivalent-wafers-reserved-for-2027/