Combining cutting-edge ergonomic design with convenient productivity features, the latest mouse in the Trust Home & Office range - the Vyran Ergonomic Multi-Wireless Hyperscroll Mouse - is the perfect choice for professionals looking for a comfortable mouse that works as hard as they do.

Designed with user wellness in mind, the Vyran features a vertical form with an optimal 50° angle and comfortable thumb rest that naturally reduces arm and wrist strain during extended use. Ideal for those working through lengthy documents, spreadsheets, and web pages, its premium metal hyperscroll wheel with tilt function enables effortless vertical and horizontal navigation, making marathon work sessions that bit more comfortable.

Samsung Display announced today that it will participate in Display Week 2026, hosted by the Society for Information Display (SID), and showcase its latest display innovations.

The exhibition will take place from May 5 to 7 at the Los Angeles Convention Center in California. Display Week is one of the world's largest display industry exhibitions, where global companies and experts gather to share advanced technologies and research achievements. Under the theme "The Spectrum of Display Innovation with AI" Samsung Display will present its latest technologies as a leading OLED company.

Kensington, a worldwide leader of desktop computing and mobility solutions for IT, business, and home office professionals, today announced an expansion of its USB-C GaN charging portfolio with the addition of new multi-port power adapters and a 240 W USB-C fast-charging cable, designed to support fast, efficient charging across multiple devices.

The expanded lineup adds 70 W and 140 W USB-C GaN chargers that allow users to power laptops, tablets, smartphones, and accessories from a single compact adapter, reducing the need for multiple chargers and outlets.

Intel Corporation today announced two key leadership appointments to strengthen its core product business and advance the company's innovation agenda.

Alex Katouzian Appointed to Lead Client Computing & Physical AI Group
Alex Katouzian will join Intel as executive vice president and general manager of the Client Computing and Physical AI Group. In this role, Katouzian will align Intel's client computing business with emerging physical AI systems that span robotics, autonomous machines, and other AI devices.

Commodore has announced the C64C Ultimate, a new variant of its well-received Commodore 64 Ultimate edition from 2025 that swaps the original 1982 "bread-bin" case for the sleeker C64C form factor introduced in 1986. The standout detail here is the case manufacturing. Commodore tracked down and reacquired the original injection molds used to produce the C64C plastic housing back in the '80s. The tooling has had quite a journey. Originally used in Japan, then at Commodore's Pennsylvania and Dallas operations, the molds were discovered at auction in 2014, survived a factory fire, and eventually ended up at Individual Computers before Commodore bought them back from IComp.de. The cases produced from these molds even carry the original subtle flow marks caused by a two-point plastic cooling pattern from the 1986 production run, an unintentional quirk that Commodore is now treating as a mark of authenticity.

Under the hood, the C64C Ultimate is identical to the existing "bread-bin" model, FPGA-based, cycle-accurate C64 emulation, bundled demos and games, and a spiral-bound user guide covering everything from basic use to BASIC programming. Three editions are available for pre-order with shipping expected in late 2026. The standard BASIC Beige is $299.99, the Starlight Edition adds a translucent case with game-reactive LED lighting at $349.99, and the Founder's Edition goes all out with PVD (Physical Vapor Deposition) gold keycaps, 24k gold-plated badges, and a translucent white case at $499.99. Commodore says that this announcement is the first of several new products planned for 2026.

Arch Linux has released its May 2026 ISO snapshot, version 2026.05.01, the first Arch ISO to ship with the Linux 7.0 kernel series, version 7.0.3 to be more precise. The new kernel brings improved hardware detection, particularly useful on newer machines but also on older hardware where previous ISOs sometimes failed to detect certain components. Linux 6.18.25 LTS is still available for those who prefer to remain on the long-term support branch. The updated Archinstall 4.3 installer introduces a new "Additional Fonts" section in the Applications menu. From there, users can pick from Noto Unicode for broad language coverage, Noto Emoji for color emoji support in browsers and apps, and Noto CJK variants for Chinese, Japanese, and Korean characters. The installer now also automatically enables power management services after package installation, fixes bugs with encrypted partition selection and file copying, and adds a completed Hindi translation locale.

On the desktop side, KDE gets updated to Plasma 6.6.4 with KDE Frameworks 6.25 and KDE Gear 26.04, while GNOME is at version 50.1 across Shell, Mutter, and core components. Other environments include Cinnamon 6.6.8, Hyprland 0.54.3, and COSMIC 1.0.11. Graphics and audio come through Mesa 26.0.6, PipeWire 1.6.4 and BlueZ 5.86. Firefox 150, LibreOffice 26.2.3 and Blender 5.1.1 are among the updated apps in this new Arch Linux ISO snapshot. Worth mentioning that this is not a reinstallation situation for existing Arch users, a full system upgrade getting everything from the new ISO. The snapshot is mainly useful as a current starting point for fresh installs, with all packages updated through April 2026.

Apple today announced financial results for its fiscal 2026 second quarter ended March 28, 2026. The Company posted quarterly revenue of $111.2 billion, up 17 percent year over year. Diluted earnings per share was $2.01, up 22 percent year over year.

"Today Apple is proud to report our best March quarter ever, with revenue of $111.2 billion and double-digit growth across every geographic segment," said Tim Cook, Apple's CEO. "iPhone achieved a March quarter revenue record, fueled by such extraordinary demand for the iPhone 17 lineup. During the quarter, Services achieved yet another all-time record, and we were excited to introduce remarkable new products to our strongest lineup ever. That included the addition of the iPhone 17e and the M4-powered iPad Air, along with the launch of MacBook Neo, which is captivating customers all around the world."

Sandisk Corporation (Nasdaq: SNDK) today reported fiscal third quarter financial results.

"This quarter marks a fundamental inflection point for Sandisk—where our technology leadership is enabling a deliberate shift in our mix toward the highest-value end markets, led by Datacenter," said David Goeckeler, CEO of Sandisk. "We are also advancing to a new business model built on multi-year customer engagements backed by firm financial commitments. Together, this transformation is driving structurally higher and more durable earnings power," continued Mr. Goeckeler. "With a zero-debt balance sheet, strong cash generation, and a recently authorized share repurchase program, we are positioned to deliver substantial long-term value creation for our shareholders."

Western Digital Corporation (Nasdaq: WDC) today reported fiscal third quarter 2026 financial results for the period ended April 3, 2026.

"WD started calendar year 2026 with great execution, driving strong sequential and year-over-year revenue growth in all our end markets, while expanding gross and operating margins. Gross margin exceeded 50%, reflecting our continued delivery of innovation across an expanding set of customers. Given our confidence in the durability of our business, we are also announcing a 20% increase in the quarterly cash dividend on the company's common stock to $0.15 per share," said Irving Tan, CEO of WD. "The demand drivers are clear: Virtually every AI workload, from training, inference, agentic AI to physical AI, creates data that is stored persistently and cost-efficiently on HDDs."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced milestones from its JC-40 and JC-45 Committees for Logic and DRAM Modules: the publication of a new DDR5 multiplexed rank data buffer (MDB) standard; progress toward a multiplexed rank registering clock driver (MRCD) standard; and continued work on the DDR5 multiplexed rank DIMM (MRDIMM) Gen 2 roadmap to enable higher-bandwidth DDR5 MRDIMM designs.

• Published: JESD82-552 (DDR5MDB02) Multiplexed Rank Data Buffer
• Expected soon: JESD82-542 (DDR5MRCD02) Multiplexed Rank Registering Clock Driver
• In progress: MRDIMM Gen 2 module standard nearing completion
• In development: Gen 2 DDR5 MRDIMM raw card designs targeting 12,800 MT/s and MRDIMM Gen 3 module standard development, with the underlying memory interface logic nearing finalization

Razer today announced the availability of two new configurations of the Razer Blade 16, expanding its flagship ultraportable gaming laptop lineup with NVIDIA GeForce RTX 5080 and RTX 5090 Laptop GPU options paired with a new 64 GB memory tier. The new models join the previously announced RTX 5080 and 5090 32 GB configurations and are available now, exclusively at Razer.com and select RazerStores.

Pricing and availability for the new Razer Blade 16 (2026) configurations:

• Razer Blade 16 with NVIDIA GeForce RTX 5080 Laptop GPU | 64 GB LPDDR5X-9600 MHz | $4,699.99 USD
• Razer Blade 16 with NVIDIA GeForce RTX 5090 Laptop GPU | 64 GB LPDDR5X-9600 MHz | $5,599.99 USD

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, announces the VECTOR V150 INF, a compact microATX chassis featuring a tempered glass infinity-mirror front panel, two pre-installed 140 mm ARGB PWM front fans, and a 120 mm rear fan. The V150 INF delivers both visual impact and effective cooling out of the box. A built-in hub enables fan and lighting control via standard motherboard software or Wireless mode, which, when paired with an L-Wireless controller (sold separately), allows full customization through L-Connect 3. Inside, a customizable side bracket offers a choice between additional cooling or expanded storage, while a pre-installed adjustable GPU anti-sag bracket ensures stable support for modern graphics cards. With support for standard and back-connect microATX motherboards, 400 mm of GPU clearance, and clean cable management, the V150 INF provides a refined and visually striking platform for compact gaming builds.

Infinity Mirror Design with Precision Airflow
The VECTOR V150 INF features a tempered glass front panel with a built-in infinity mirror, creating a strong, immersive visual effect. The panel includes precision-cutouts for the two pre-installed 140 mm front fans, ensuring direct airflow intake. These intakes are protected by removable mesh filters that can be easily detached by turning them left and pulling away, making maintenance simple and tool-free

Samsung Electronics today introduced Galaxy Book6 Enterprise Edition, the first Galaxy Book designed specifically for an enterprise environment. Powered by the latest Intel Core Ultra Series 3 processors with Intel vPro, Galaxy Book6 Enterprise Edition combines the reliable performance, security and manageability required for modern enterprise environments.

"Galaxy Book6 Enterprise Edition marks an important step in expanding the Galaxy Book series into enterprise computing," said Andrew Chun, CVP & Head of B2B NPC Group, Mobile eXperience (MX) Business at Samsung Electronics. "We're excited to bring the connected Galaxy experience to enterprise IT environments to help enable seamless workflows across devices and businesses."

Samsung has reported a record quarterly profit for Q1 2026, with chip division operating income jumping to 53.7 trillion won ($36.15 billion), a 49% increase from the 1.1 trillion won ($745 million) posted in the same quarter last year. That figure accounted for 94% of the company's total operating profit of 57.2 trillion won ($38.7 billion), which itself was up from 6.69 trillion won a year prior. Overall revenue rose 69% year over year to 133.9 trillion won ($90.6 billion). Its record profit came mostly from the AI data center sector that pushed demand for advanced memory well beyond what Samsung and its peers can supply. The company has signed multi-year binding supply contracts with customers looking to lock in capacity, though it hasn't disclosed names or terms. Samsung's memory chief Kim Jaejune told analysts that supply is already falling well short of demand, and that based on orders already received, the gap in 2027 is expected to be even wider than in 2026.

On HBM specifically, Samsung said it began mass-production sales of HBM4 for NVIDIA's Vera Rubin platform in February and is on track to more than triple HBM revenue this year versus last. However, rising memory prices are affecting the profit of other Samsung businesses. Mobile and network division profit fell 35% to 2.8 trillion won, due to higher component costs, and the display division saw operating profit drop 20% to 400 billion won ($270 million). Reuters also reports the risk of a strike, with unions representing a large portion of Samsung's South Korean chip workforce considering work stoppages over pay disputes. For the rest of 2026, Samsung expects that increasing demand will keep pushing memory, foundry, and display businesses.

As data sovereignty and compute performance become strategic differentiators for enterprises adopting AI, the demand for private, on-premises AI infrastructure continues to grow. In response to this shift, QNAP Systems, Inc., a leading innovator in computing, networking, and storage solutions, today introduced the QAI-h1290FX, a next-generation Edge AI storage server designed to empower private deployment of large language models (LLMs), Retrieval-Augmented Generation (RAG) search engines, and generative AI applications.

Built with server-grade AMD EPYC processing, with support for NVIDIA RTX GPU acceleration, and twelve U.2 NVMe/SATA SSD slots, the QAI-h1290FX delivers a high-performance, on-prem AI infrastructure for organizations that demand low-latency inference, full data privacy, and operational control—without relying on the cloud.

Qualcomm Incorporated (NASDAQ: QCOM) today announced results for its fiscal second quarter ended March 29, 2026.

"We are pleased to deliver results in line with our guidance, reflecting solid execution as we navigate a challenging memory environment," said Cristiano Amon, President and CEO of Qualcomm Incorporated. "We are in a period of profound industry transformation—the rise of AI agents is reshaping our roadmap across every platform we develop. We are equally excited by our entry into the data center, where a leading hyperscaler custom silicon engagement is on track for initial shipments later this calendar year. We look forward to providing an update on our growth initiatives, including opportunities in Data Center and Physical AI, at our Investor Day on June 24."

Microsoft Corp. today announced the following results for the quarter ended March 31, 2026, as compared to the corresponding period of last fiscal year:

• Revenue was $82.9 billion and increased 18% (up 15% in constant currency)
• Operating income was $38.4 billion and increased 20% (up 16% in constant currency)
• Net income was $31.8 billion and increased 23% on a GAAP basis, and increased 20% (up 18% in constant currency) on a non-GAAP basis
• Diluted earnings per share was $4.27 and increased 23% on a GAAP basis, and increased 21% (up 18% in constant currency) on a non-GAAP basis
• Non-GAAP results exclude the impact from investments in OpenAI, explained in the Non-GAAP Definition section below

"We are focused on delivering cloud and AI infrastructure and solutions that empower every business to eval-max their outcomes in the agentic computing era," said Satya Nadella, chairman and chief executive officer of Microsoft. "Our AI business surpassed an annual revenue run rate of $37 billion, up 123% year-over-year."

The SEMI Silicon Manufacturers Group (SMG) reported today, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025. Sequentially, shipments declined 4.7% quarter-over-quarter from the 3,437 MSI recorded during the fourth quarter of 2025 in line with typical seasonality.

"Silicon wafer demand related to AI data centers continues to be strong, including advanced logic and memory, and also now extending to power management devices," said Ginji Yada, Chairman of SEMI SMG and Managing Executive Officer, General Manager, Sales and Marketing Division at SUMCO Corporation. "Overall, silicon wafer demand has improved, but the recovery is not uniform. Many device companies have noted improvements in the industrial semiconductor segment, and this is creating a more broad-based recovery as wafer inventory is absorbed. Weaker smartphone and PC shipments in the first quarter of this year may show the impact of tighter supply of memory due to AI high bandwidth memory (HBM) allocation decisions."

Announcing Pop 2 Vision, a new addition to the Pop 2 series, combining panoramic design with a sleek dual-chamber layout. Pop 2 Vision is crafted to provide a clean, uncluttered view into its refined interior. With support for graphics cards up to 412 mm, top-mounted radiators up to 360 mm, and compatibility with reverse connector motherboards, it offers flexibility for modern gaming components. Out of the box, it features four pre-installed reverse-blade fans, integrated with hidden cables and frames to make achieving a clean build effortless.

On the outside, Pop 2 Vision offers easy access through removable glass panels, together with a ventilated right-side panel and magnetically attached top mesh filter. Inside, dedicated cable routing space, a large cable grommet, and modular power supply mounting help create a smooth building experience. A top-mounted I/O provides quick connectivity with two USB ports and an audio jack, while RGB versions also include integrated controls for effortless lighting adjustments.

[Editor's note: Our in-depth review of the Fractal Design Pop 2 Vision is now live]

Philips Evnia is expanding its ambient lighting ecosystem for gamers who use lighting to enhance atmosphere, pace, and immersion beyond the screen. Building on its established AI-Enhanced Ambiglow technology and Windows Dynamic Lighting support, Evnia now introduces AmbiScape; a new feature designed to extend synchronized lighting from the display into the surrounding room.

Together, Ambiglow, AmbiScape, and Dynamic Lighting integration enable a more unified setup where on-screen action can influence both the monitor's ambient lighting and compatible devices across the gaming environment. The experience is enabled via USB upstream and configured through the Philips Evnia Precision Center.

Seagate Technology Holdings plc (NASDAQ: STX) (the "Company" or "Seagate"), a leading innovator of mass-capacity data storage, today reported financial results for its fiscal third quarter ended April 3, 2026.

"Seagate delivered outstanding March quarter results, exceeding the high end of our revenue and EPS guidance, achieving record margin performance, and generating close to $1 billion in free cash flow," said Dave Mosley, Seagate's chair and chief executive officer.

Fanatec, a brand of Corsair (NASDAQ: CRSR) and global leader in sim racing hardware, presented a series of product announcements and platform updates during its Spring Showcase event, introducing new hardware and software updates designed to expand flexibility across its ecosystem.

ClubSport Formula V3 launched
Fanatec introduced the ClubSport Formula V3, a reworked version of its iconic Formula-style steering wheel. The new model is a direct replacement for the Formula V2.5 and features a larger display with Intelligent Telemetry Mode, allowing drivers to switch between layouts such as lap times and deltas, tire temperatures, and other telemetry. The diameter increases to 290 mm, with revised ergonomics suited to a wider range of race cars.

Logitech G today announced the new Logitech G512 X TMR Analog/Mechanical Gaming Keyboard. Designed for players who view their setups as living, breathing ecosystems, the G512 X marks a shift from static hardware to a modular, performance-driven system built to be tuned, tweaked, and mastered. The G512 X is the first keyboard engineered to adapt to the nuance of your unique playstyle, rather than forcing you to adapt to your hardware.

"At Logitech G, we see a player's setup as something that grows with them as they improve," said Robin Piispanen, Vice President and General Manager of Logitech G. "With the G512 X, we combine craftsmanship with performance. This keyboard isn't just a tool—it's an extension of the gamer, giving you the control and precision to play at your best."

Your desk has evolved. Sharper displays, better keyboards, devices designed to work together across a full Apple ecosystem—your workspace already looks like the future. Now picture a charger built to match. Meet the Satechi ChargeView 140 W Desktop Charger: a charging station with a live digital display, four USB-C ports, and 140 W of GaN-powered output, engineered to be a working part of your desk setup.

Power You Can See
Charging used to be a guessing game. ChargeView ends the guessing, in real time. Each port shows its current wattage at a glance, so you know exactly what's flowing where. No more cable-swapping just to figure out what's charging. No more wondering whether your MacBook Pro is at full speed or barely sipping. No more guessing whether the cable is the problem, or the port.

SAPPHIRE Technology unveils the revolutionary PhantomLink connectivity feature in the distinctively special Polar edition on the SAPPHIRE NITRO+ AMD Radeon RX 9070 XT PhantomLink Edition Graphics Card and SAPPHIRE NITRO+ X870EA PhantomLink Edition Motherboard for the ultimate SAPPHIRE NITRO+ ecosystem in a glacial white-color themed pairing.

The SAPPHIRE NITRO+ AMD Radeon RX 9070 XT PhantomLink Polar Edition Graphics Card and the SAPPHIRE NITRO+ X870EA PhantomLink Polar Edition Motherboard were designed conjunctively to be used together for a premium SAPPHIRE NITRO+ ecosystem. For the first time, this ecosystem has been created in a silver-white aesthetic for powerful systems where innovative cooling meets enthusiast performance on an icy-metallic and elegant backdrop.

Acemagic has launched the F5A, a mini PC built around AMD's Ryzen AI 9 HX 470, a 12-core, 24-thread chip combining Zen 5 and Zen 5c cores with boost clocks up to 5.2 GHz. Graphics come from the integrated Radeon 890M (RDNA 3.5, 16 compute units), and the XDNA2 NPU is rated at 55 TOPS, pushing total platform AI performance to up to 86 TOPS. Memory is fixed at 32 GB of LPDDR5X-8000, paired with a PCIe 4.0 NVMe SSD. Storage expansion is a strong point since Acemagic F5A mini PC features three M.2 2280 slots giving you up to 12 TB of total capacity. Networking covers Wi-Fi 7, Bluetooth 5.4, and dual 2.5 GbE LAN ports.

For a system this compact (130 x 132 x 62 mm) the connectivity is solid. You get HDMI 2.1, DisplayPort 2.1, and dual USB4 ports with DisplayPort output and 40 Gbps transfer speeds, plus an OCuLink port for eGPU or high-speed storage expansion. Multiple 8K display outputs are supported. Cooling is handled by a dual-fan setup with a vapor chamber, rated up to 65 W. The F5A is available as a barebones configuration at $759 or as a preconfigured 32 GB / 1 TB model at $1,299, however, availability seems limited at launch.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 8.30 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 8.30 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 8.30 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 8.20 software, a dedicated network audit toolset to collect and manage corporate network inventories.

The latest AIDA64 update introduces AIDA FPS, a new module that captures real-time frame rate data in DirectX 11 and 12 games. It also adds support for Adaptec RAID controllers and the latest Turing-based external displays, along with expanded support for the newest graphics and GPGPU technologies from AMD, Intel, and NVIDIA.

DOWNLOAD: FinalWire AIDA64 v8.30

Corsair (Nasdaq: CRSR) is proud to announce the launch of ThermalProtect, a 12V-2x6 GPU power cable featuring innovative technology that monitors the temperature of a GPU's power cable in real time to help prevent damage to the GPU.

Corsair ThermalProtect
ThermalProtect enables additional Over Temperature Protection (OTP) for GPUs by actively monitoring the 12V-2x6 cable. Housed discreetly inside a cable comb 30 mm from the connection point, the hardware offers a clean, unobtrusive appearance. If the sensor detects extreme temperatures, ThermalProtect activates, causing the GPU to shut down to prevent potential damage.

ASUS today announced the TUF Gaming Platinum series of power supplies, available in 850-watt, 1000-watt and 1200-watt versions. These PSUs feature a next-generation GaN MOSFET, military-grade durability, flagship fan design, and PCB protection for efficient and consistent power delivery. Compared to traditional silicon-based MOSFETs, the GaN variety delivers advanced energy efficiency, faster switching speeds, lower heat generation, and higher voltage resistance, positioning it as a server-grade material for demanding applications such as AI development, high-end gaming, and video editing. This MOSFET's compact size also enables a streamlined layout with larger heatsinks and enhanced airflow for additional heat dissipation.

GaN MOSFETs for maximum efficiency and cooler operation
Gallium Nitride MOSFET technology has been instrumental in making premium ROG Strix Platinum PSUs and ROG Thor III PSUs efficient powerhouses, so ASUS is excited to bring this tech to a range of TUF Gaming Platinum PSUs.

Kyocera Corporation (President: Shiro Sakushima; "Kyocera") today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs and switch ASICs, which are rapidly scaling in complexity as AI data center architectures evolve. The new product will be unveiled at ECTC 2026, an international conference on semiconductor packaging technologies, in Orlando, Florida, USA, May 26-29, 2026.

Built from Kyocera's proprietary Fine Ceramic materials, the new core substrate is engineered for high‑density wiring and exceptional rigidity. According to the company, these characteristics dramatically reduce deformation (warpage) in high-performance semiconductor packages, a key challenge as demand for greater device integration and higher processing speed continues to rise.

Lenovo Group Limited (HKSE: 992) (ADR: LNVGY) (together with its subsidiary, "Lenovo" or the "Group") today announced it has completed the acquisition of Phoenix Technologies' firmware (BIOS) technology business registered in Dublin, Ireland, including its related intellectual property and expertise. The acquisition brings firmware development and additional core software expertise in‑house, enhancing Lenovo's ability to manage critical firmware across its entire PC portfolio and, over time, across other AI‑enabled devices.

"This transaction is a strategic step forward for Lenovo," said Luca Rossi, President of Intelligent Devices Group, Lenovo. "By bringing firmware development in-house, we are strengthening our core engineering capabilities and gaining greater control over one of the most critical layers of the computing experience. This will enable us to accelerate innovation, enhance security, and deepen our vertical integration, while also unlocking meaningful cost efficiencies. With its strong heritage and leadership in firmware, Phoenix Technologies brings differentiated expertise that will further strengthen our portfolio."

JBL Tour ONE M3 headphones and JBL Tour PRO 3 earbuds, delivering improvements in audio performance and user experience to new and existing listeners, as well as a fresh new color drop.

The combination of premium design, high-quality sound and class-leading features has made the flagship Tour over-ear headphones and TWS standout performers since their introduction. But JBL isn't standing still. Subtle yet meaningful changes reimagine the JBL sound curve for clearer, more accurate audio than ever before. This joins a powerful user-interface update transforming how you interact with the Smart Charging Case and JBL SMART Tx.