Being limited to older-generation DUV equipment hasn’t deterred Huawei’s efforts to develop and mass produce competitive chipsets, as the Kirin 2026 will be a prime example of the company’s next-generation packaging. Now, in the latest paper, the Chinese giant has detailed how a hybrid bonding process will allow for SoCs to flaunt a 3D stacking approach, which is the first step of removing one of the major obstacles of mobile silicon innovation; lack of access to advanced lithography. Despite having no access to advanced chipmaking equipment, Huawei’s mastery in smartphone chipset packaging for the Kirin 2026 looks promising During Huawei’s […]

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