The MacBook Neo has turned into an instant hit, and even with the price bumps that Apple introduced that made the company’s most affordable notebook $100 more expensive for both configurations, the bigger figure isn’t what’s derailing the portable Mac’s momentum. It’s the lack of chip supply for the A18 Pro, and according to an analyst, Apple’s MacBook Neo shipments are expected to suffer considerably, with up to a whopping 40 percent drop. It appears that AI firms gobbling up the entire supply have made the situation quite uncomfortable for both TSMC and Apple. Updated shipment forecast states the MacBook Neo will […]

Read full article at https://wccftech.com/a18-pro-supply-constraints-can-lead-to-a-40-percent-drop-in-macbook-neo-shipments/

Samsung plans to build a new DRAM factory on the Giheung campus in Yongin, which could output around 100,000 wafers per month.

According to KEDGlobal, Samsung is scrapping its R&D ambitions and betting on brute production instead. The company’s new DRAM factory, set to rise on the Giheung campus in Yongin, will crank out 100,000 wafers per month when it’s running.

Korean businessman Lee Byung-chull built it in 1987 and told his people to embrace “infinite exploration.” Samsung demolished it late last year; the plan was to replace it with two R&D buildings but that plan is now dead.

HBM demand has grown so quickly that DRAM makers can’t keep pace, and the shortage is bleeding into commodity chips used in phones and laptops.

Counterpoint Research reports that the global DRAM market revenue is projected to surge from $150 billion (223 trillion won) this year to $210 billion (312 trillion won) due to skyrocketing product prices.

Samsung’s internal team is already formed and eyeing a Q3 groundbreak. The company is even considering tearing down existing Giheung buildings to make room for auxiliary production infrastructure.

The company’s new DRAM factory joins a broader capacity push at Pyeongtaek, where Line 4 is getting a 100,000-wafer-per-month HBM4-capable production line.

The post Samsung’s giant new DRAM factory could output 100,000 wafers every month appeared first on Sammy Fans.

Furiosa AI is all set to double its chip production to 50,000 units as it preps its 2nm "Stork" chip to break NVIDIA's inference dominance. Furiosa AI Claims Its 3rd Gen "Stork" 2nm Chip To Feature The Best Inference Capabilities On The Market, Will Also Double The Production of 2nd Gen Chips Next Year To Break NVIDIA's Monopoly Back in May, Furiosa AI announced its third-generation AI accelerator chip called Stork for its RNGD (Renegade) platform. The chip is built on Broadcom's 2nm technology, and the startup claims it will challenge NVIDIA with leading efficiency and the lowest cost per […]

Read full article at https://wccftech.com/furiosa-ai-doubling-chip-production-50000-units-next-year-2nm-stork-chip-challenges-nvidia-with-worlds-best-inference/

The Pixel 11 family is being prepped for a launch next month, and with it, Google will announce its brand-new Tensor G6 silicon. Irrespective of whether Mountain View titan cannot be included in the same conversation as Apple, Qualcomm, and MediaTek regarding chipset advancements, there’s one area in which Google excels, but that doesn’t necessarily mean that the company has the upper hand. Pixel 11’s Tensor G6 to be TSMC’s first 2nm chipset, obtaining a one-month lead over Apple’s A20 Pro While Apple, Qualcomm, and MediaTek will be busy unveiling their chipsets in September, Google has an upper hand because its […]

Read full article at https://wccftech.com/tensor-g6-to-have-one-milestone-over-a20-pro-unveiling-next-month/

Tesla is all set to begin production of its AI5 chip on Samsung's 2nm process technology after a successful tapeout back in April. Samsung & TSMC To Produce Tesla's AI5 Chip With The Former Leveraging Its 2nm Capabilities Last month, Elon Musk announced the successful tape-out of its AI5 AI chip. Elon shared pictures of the chip, featuring a large primary die in the middle that will handle all of the compute and 12 DRAM modules on the outskirts, offering high capacity and efficiency-optimized bandwidth. The DRAM modules in the picture are from SK hynix, and while the DRAM SKU […]

Read full article at https://wccftech.com/samsung-2nm-node-lands-tesla-ai5-chip-at-its-texas-taylor-fab-silencing-yield-doubters/

The family of TSMC’s first 2nm chipsets is yet to grace the industry, and the Taiwanese giant is already experiencing unprecedented advancements with its next-generation lithography, A14, or 1.4nm. Previously, it was Samsung that would obtain bragging rights over introducing the first cutting-edge technology, but that title now seemingly belongs to its foundry rival, which will reportedly complete the construction of its first fabrication plant for the new process in 2027, with trial production happening shortly after. First fabrication plant reported to be completed in April 2027, with mass manufacturing of the 1.4nm process starting in 2028 Construction of the […]

Read full article at https://wccftech.com/tsmc-1-4nm-process-no-roadblocks-first-fab-to-be-completed-in-2027/

The proliferation of AI has certainly caused a long-term crisis in the computing landscape, but if there’s one positive to gain from all of this, it’s that companies are aggressively pushing towards designing chips of superior capabilities to tackle the competition at a fiercer pace. Unsurprisingly, one of those companies is Apple, which reportedly taped out the M7 just six months after the same process was completed for the M6. This would explain why the M6 Pro and M6 Max won’t arrive at all, as they will instead be replaced by the M7 Pro and M7 Max. The M7 will […]

Read full article at https://wccftech.com/apple-m7-chip-design-finalized-six-months-after-m6-due-to-ai/

Apple is planning to skip the M6 Ultra launch, instead choosing to launch the M5 Ultra later this year, followed by the M7 Ultra after it unveils the M7 Pro and M7 Max sometime in 2027. Fortunately, the new workstation-class silicon will be worth the wait, especially for those who aspire to run multi-billion-parameter AI models on their systems but are limited by memory constraints. This is because a new report states that the M7 Ultra will feature double the unified memory of the M5 Ultra, and you’ll want to know how much RAM you can pack for the top-end […]

Read full article at https://wccftech.com/m7-ultra-to-offer-double-unified-memory-as-m5-ultra/

In the AI race, Apple isn’t the first name that you’d expect to be ahead of its rivals, but when it comes to chipsets that are tailor-made to tackle the aforementioned workloads, we doubt other names come to mind. While we have reported that the M7 is being designed to bring even better on-device AI performance to the table, the M8 is expected to surpass its predecessor in this aspect, while also being one of the company’s first silicon ranges to leverage a new manufacturing process. M8 could be Apple’s first 1.4nm SoC designed for powerful computing, bringing superior efficiency […]

Read full article at https://wccftech.com/apple-working-on-m8-with-superior-ai-and-efficiency-features/

TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand. Intel & Other Advanced Packaging Chip Manufacturers See Surge In Orders From TSMC Customers As CoWoS Unable To Meet Industry Demand AI and HPC chip demand has reached an unprecedented level, and the chips that are being built are based on some of the most advanced packaging technologies that the world has ever seen. Leading this advanced packaging race is none other than TSMC, […]

Read full article at https://wccftech.com/tsmc-cant-keep-up-with-cowos-demand-advanced-packaging-orders-spilling-over-to-intel-rival-fabs/

A smart tactic currently employed by companies to minimize the DRAM shortage risk is bringing in as many suppliers as possible, just like how Apple is doing by testing CXMT’s memory chips. However, Huawei has formed a different strategy, and with the help of various entities, the Chinese firm aims to circumvent the U.S. trade sanctions and the pitfalls of the AI boom by establishing its own memory manufacturing facility. With the help of the government and Swaysure, Huawei could introduce its own DRAM manufacturing plant with a capacity of 140,000 wafers per month Crucial details shared by @SemiconductorsX reveal that […]

Read full article at https://wccftech.com/huawei-building-its-own-dram-fabrication-plant-to-curb-shortages/

SK Hynix plans to invest nearly US$4 billion in an AI memory R&D facility in Indiana.

King Yuan Electronics plans a US$1.4 billion investment to build a new US facility.

Nanya expects to spend more than NT$50 billion (US$1.56 billion) this year.

The company sold 216.2 million shares at HK$32.30 (US$4.10) each, the top of its indicated range.

The industry is hyping up the alliance between Chinese memory manufacturer CXMT and Apple, with the latter previously reported to have begun testing the company’s DRAM chips for use in future products. Unfortunately, a new rumor buries any hope that these modules will be found in the upcoming iPhone 18 Pro and iPhone 18 Pro Max, and it’s not due to any political pressure. Apparently, it’s a technological limitation involving the A20 Pro’s Wafer-Level Multi-Chip Module Packaging (WMCM). All hope isn’t lost because Apple’s standard A20 found in the iPhone 18 and iPhone 18e could still be paired with CXMT DRAM For […]

Read full article at https://wccftech.com/iphone-18-pro-unlikely-to-use-cxmt-dram-due-to-deep-a20-pro-packaging-integration/

Their combined spending over the next decade could reportedly reach as much as 2,000 trillion won (US$1.3 trillion).

CXMT accounted for about 6% of global DRAM output in Q1 2025 and offers DDR5 products.