Apple is planning to skip the M6 Ultra launch, instead choosing to launch the M5 Ultra later this year, followed by the M7 Ultra after it unveils the M7 Pro and M7 Max sometime in 2027. Fortunately, the new workstation-class silicon will be worth the wait, especially for those who aspire to run multi-billion-parameter AI models on their systems but are limited by memory constraints. This is because a new report states that the M7 Ultra will feature double the unified memory of the M5 Ultra, and you’ll want to know how much RAM you can pack for the top-end […]

Read full article at https://wccftech.com/m7-ultra-to-offer-double-unified-memory-as-m5-ultra/

In the AI race, Apple isn’t the first name that you’d expect to be ahead of its rivals, but when it comes to chipsets that are tailor-made to tackle the aforementioned workloads, we doubt other names come to mind. While we have reported that the M7 is being designed to bring even better on-device AI performance to the table, the M8 is expected to surpass its predecessor in this aspect, while also being one of the company’s first silicon range to leverage a new manufacturing process. M8 could be Apple’s first 1.4nm SoC designed for powerful computing, bringing superior efficiency […]

Read full article at https://wccftech.com/apple-working-on-m8-with-superior-ai-and-efficiency-features/

TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand. Intel & Other Advanced Packaging Chip Manufacturers See Surge In Orders From TSMC Customers As CoWoS Unable To Meet Industry Demand AI and HPC chip demand has reached an unprecedented level, and the chips that are being built are based on some of the most advanced packaging technologies that the world has ever seen. Leading this advanced packaging race is none other than TSMC, […]

Read full article at https://wccftech.com/tsmc-cant-keep-up-with-cowos-demand-advanced-packaging-orders-spilling-over-to-intel-rival-fabs/

A smart tactic currently employed by companies to minimize the DRAM shortage risk is bringing in as many suppliers as possible, just like how Apple is doing by testing CXMT’s memory chips. However, Huawei has formed a different strategy, and with the help of various entities, the Chinese firm aims to circumvent the U.S. trade sanctions and the pitfalls of the AI boom by establishing its own memory manufacturing facility. With the help of the government and Swaysure, Huawei could introduce its own DRAM manufacturing plant with a capacity of 140,000 wafers per month Crucial details shared by @SemiconductorsX reveal that […]

Read full article at https://wccftech.com/huawei-building-its-own-dram-fabrication-plant-to-curb-shortages/

SK Hynix plans to invest nearly US$4 billion in an AI memory R&D facility in Indiana.

King Yuan Electronics plans a US$1.4 billion investment to build a new US facility.

Nanya expects to spend more than NT$50 billion (US$1.56 billion) this year.

The company sold 216.2 million shares at HK$32.30 (US$4.10) each, the top of its indicated range.

The industry is hyping up the alliance between Chinese memory manufacturer CXMT and Apple, with the latter previously reported to have begun testing the company’s DRAM chips for use in future products. Unfortunately, a new rumor buries any hope that these modules will be found in the upcoming iPhone 18 Pro and iPhone 18 Pro Max, and it’s not due to any political pressure. Apparently, it’s a technological limitation involving the A20 Pro’s Wafer-Level Multi-Chip Module Packaging (WMCM). All hope isn’t lost because Apple’s standard A20 found in the iPhone 18 and iPhone 18e could still be paired with CXMT DRAM For […]

Read full article at https://wccftech.com/iphone-18-pro-unlikely-to-use-cxmt-dram-due-to-deep-a20-pro-packaging-integration/

Intel demonstrates the various use cases of its EMIB-T advanced packaging solution at ECTC26, as the tech is poised to become an industry favorite. EMIB-T, Advanced Packaging Solution, Will Be Intel's Biggest Win To Data As Industry Faces Shortages & Limits In Existing Packaging Technologies The era of advanced packaging solutions is in full swing, and there are only a few companies that offer the level of technical expertise and precision to make next-generation chips that are going to power AI, HPC and the Client segments. At IEEE 2026 (ECTC), Intel demonstrated its next-generation packaging and substrate solution in full […]

Read full article at https://wccftech.com/intel-emib-t-breaks-past-existing-ai-hpc-scaling-limits-enabling-ultra-large-die-complexes/

The quest to be the first foundry in advanced lithography is slowly being less and less prioritized by Samsung, as a new Exynos chipset roadmap reveals that the Korean giant will stick to its 2nm GAA node for a few years before finally taking a leap of faith towards 1.4nm. Thanks to this delay, TSMC will potentially beat Samsung as the first semiconductor manufacturer to introduce its sub-2nm process, but that’s no disadvantage. Exynos 2900 rumored to be Samsung’s first 1.4nm SoC, gravitating from 2nm to give Samsung time to refine its yields With TSMC expected to commence mass production […]

Read full article at https://wccftech.com/samsung-to-take-three-generations-before-1-4nm-exynos-arrives/

Their combined spending over the next decade could reportedly reach as much as 2,000 trillion won (US$1.3 trillion).

CXMT accounted for about 6% of global DRAM output in Q1 2025 and offers DDR5 products.