OpenAI has published a new patent in which it discloses an AI chip housing several compute chiplets, surrounded by a large number of HBM memory stacks. One Compute Chiplet, Several HBM Memory Stacks: This Could Be OpenAI's Future AI Chip Plans In a new patent titled "Non-Adjacent Connection of High-Bandwidth Memory Chiplets, I/O Chiplets, And Compute Chiplets Through Embedded Logic Bridges", OpenAI shares plans for an AI chip solution that is going to house several HBM chiplets and compute chiplets, all connected using Embedded Logic Bridges. The research proposes the idea of leveraging these embedded logic bridges for high-speed interconnects […]

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