JEDEC is nearing completion of SPHBM4, a standard that enables full HBM4 bandwidth over a 512-bit interface using a 4:1 serialization, reusing standard HBM DRAM dies and a base die. The tech promises to enable a 2.5D integration on organic substrates to support up to 64 GB per stack and more stacks than HBM4 and HBM4E.

A leaked Samsung Securities roadmap teases massive AI upgrades in 2027. The company has plenty of hardware upgrades and innovations in its pipeline. 2027 is going to be a year that will welcome grand inventions for Samsung fans.

Here’s what to expect in 2027:

Agent AI integration

The analysis suggests 2027 will be the year of splendid AI upgrades from Samsung. Mobile devices are slated to introduce enhanced real-time AI responsiveness.

Samsung is prepping to launch Ambient AI with the Galaxy S26 series. The following year, bringing the S27 series, will likely bring even more advancements.

Solid-state battery

Samsung also plans to commercialize a solid-state battery for mobile devices. The company would first use the new battery tech in wearable devices. After successful utilization and assessment, it would expand to phones.

Smart glasses

Smart Glasses would also see upgrades in 2027. Samsung and Google are also working on smart glasses with a display. Meanwhile, the roadmap mentions glasses from Meta and the second-generation Apple Vision Pro.

New mobile DRAM

Samsung may release the next-gen DRAM, LPDDR6, in the second half of next year. This technology is expected to be used in the Galaxy S27 series smartphones.

Beyond that, Samsung has expanded plans for mobile DRAM in 2027. However, the technologies coming in 2027 wouldn’t be seen in consumer devices soon. New solutions include:

• LPW – Low-Power Wide I/O DRAM or Mobile HBM
• VCS – Visual Computing System
• FC-SIP – Flip Chip System-in-Package

Apart from this, Samsung revealed that Tesla Optimus could finally enter factories, marking the first commercialization in the second half of next year. Snapdragon X Gen 2 chip could also see upgrades in its Oryon chips.

Galaxy S26 is coming in the first half of next year and focuses on a personal-data AI search service. Mobile chiplet could arrive in 2028 or 2029 along with LBS Display, while the high-res uLED lands sometime in 2026.

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Galaxy S26 series launches next month, and Samsung is facing a shortage of RAM, forcing it to approach Micron. The company’s DS Division is focusing more on HBM than DRAM to make money riding the wave of AI.

Korea’s DealSite reports that TM Roh will meet Sanjay Mehrotra on the first day of CES 2026. Given the issues of DRAM prices and supply, the Korean tech giant has requested the US memory giant for a rare meeting.

Usually, the two companies do not meet separately during CES because they are extremely busy, but this time, they urgently needed to discuss the matter and coordinate DRAM supply schedules with Micron.

Samsung Mobile Head is set to meet Micron CEO during the CES 2026. Heads of the two firms will be having a meeting at the former’s request. TM Roh from the Samsung side will meet CEO Sanjay Mehrotra, probably eyeing the Micron RAM deal for the Galaxy S26 series.

Galaxy S25 series features LPDDR5X RAM from Samsung and Micron. The supply volume is divided between the two firms to maintain a smooth supply.

Samsung seems worried about the Galaxy S26 series’ RAM supply.

Galaxy S26 lineup will be equipped with LPDDR5X RAM. Increased prices of DRAM have prevented Samsung MX from finalizing contracts with suppliers, which include Samsung DS Division and Micron.

Notably, LPDDR5X with 12GB capacity cost $30 earlier this year, but soared to $70 at the end of November. The prices of DRAM more than doubled within the year, causing an urgency to sign a long-term deal for Galaxy phones.

Samsung MX is negotiating DRAM prices with DS Division and Micron. The company is expected to secure contracts for the first quarter of the next year. Meanwhile, a smooth supply is necessary to avoid any post-launch hurdle.

Micron has an improved version of LPDDR5X RAM, which would be used in the Galaxy S26 series. The company has reportedly enhanced the process for testing, surpassing the productivity of chips used in the Galaxy S25 series.

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Samsung Semiconductor reached out to us and shared an update on the memory shortage situation. The statement reads:

“Recent reports that Samsung’s DS division has rejected certain customer requests are baseless and not true. We are in close communication with global customers to address industry needs.”

December 1 

Turns out that everything isn’t fine inside Samsung. A new report sheds light on an internal war, alleging that the Samsung chip team (DS Division) has refused Galaxy’s (MX Division) request, putting Galaxy S26 at risk.

Samsung will launch the Galaxy S26 series early next year, but the MX Division has reportedly failed in securing a long-term deal with the DS Division on memory chip.

Sources citing SEDaily claim that Samsung’s DS Division has recently rejected the MX Division’s request for a long-term contract of DRAM for a year or more. The Division is only entertaining contracts on a quarterly basis at its best.

The report also suggests that there were high executive level discussions between the MX and DS divisions. However, the Mobile Team has just managed to secure DRAMs for the fourth quarter of the year, ending on December 31.

DS Division falls under Samsung Elec’s umbrella, but the business is reportedly sidelining DRAM and NAND contracts. The present focus is aimed at securing orders for beneficial products like HBM for AI data centers.

Galaxy S26 series will use DRAMs from Samsung Electronics and Micron. The supply will be split between the two firms, while the exact proportion is currently unknown.

Earlier this year, the price of Samsung’s 12GB LPDDR5X RAM was around $33. The prices have been skyrocketed in the past few months, with the same DRAM now costing around $70.

Seeing a potential spike, MX Division tried to score a long-term deal with DS Division. At this stage, the chip team is prioritizing its growth opportunity, but it has led the mobile business to face a chipflation and profit decline.

There’s a simple logic: MX is concerned about increasing DRAM and NAND costs. At the same time, DS isn’t bowing down, even for its sister division, as it aims to secure growth and revenue, benefiting from the memory super cycle.

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