AI-related demand for high-bandwidth memory (HBM) is now producing tangible aftershocks across the global semiconductor industry. This is tightening wafer foundry capacity and squeezing out the supply of DRAMs often used in smartphones' SoCs, such as the DDR5. And, MediaTek is likely to be the first major SoC manufacturer to be affected. LPDDR5x delivery period is now stretching out to between 26 and 39 weeks, which means orders placed right now won't be delivered until the middle of 2026 As per a report by Taiwan's Commercial Times, the high demand for HBM is now affecting the smartphone SoC manufacturers in […]

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Xiaomi President Lu Weibing stated in a social media post that the rising costs of memory chips are far beyond expectations and could intensify further.