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Yesterday β€” 29 June 2026Tech

Apple’s A20 Pro Borrows Samsung’s Side-by-Side DRAM Trick, And Places A Vapor Chamber On The Die, Echoing Exynos 2700’s Heat Path Block Strategy

29 June 2026 at 21:07

A20 Pro packaging and logic board leaked

Apple has thoroughly established itself as a leader when it comes to designing its custom silicon. Even so, it's not above emulating innovative ideas, as it appears to be doing with the upcoming A20 Pro chip, which borrows heavily from Samsung's new 'Side-by-Side' (SbS) architecture. Both Samsung's Exynos 2700 and Apple's A20 Pro chip place the DRAM alongside the AP, and employ a thermal solution that remains in contact with the AP Samsung's Exynos 2600 broke the prevailing mobile chip architecture mold by placing the DRAM on top of a part of the AP, right alongside a copper-based heat sink, […]

Read full article at https://wccftech.com/apples-a20-pro-borrows-samsungs-side-by-side-dram-trick-and-places-a-vapor-chamber-on-the-die-echoing-exynos-2700s-heat-path-block-strategy/

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