Samsung was considering removing Fan-Out Wafer-Level Packaging (FOWLP) from the Exynos 2700 as part of its cost-cutting strategy to make its upcoming Galaxy S27 series more affordable for the masses amid the DRAM shortage. Fortunately, a new rumor has dispelled these claims, stating that the Korean giant fully intends to treat its next 2nm chipset with the best in-house technologies possible to raise the competitive bar. Maintaining FOWLP technology on the Exynos 2700 helps the latter to maintain better performance when running taxing workloads Aside from removing FOWLP from the Exynos 2700, Samsung was also rumored to switch to BOE’s […]

Read full article at https://wccftech.com/exynos-2700-to-be-treated-to-the-best-packaging-and-technologies-from-samsung/

Samsung has reportedly decided not to use a signature chip tech in the Exynos 2700 of the Galaxy S27 series. A new supply chain report signals the shift to a new cooling solution and the exclusion of a legendary one.

According to SisaJournal, Samsung’s Exynos 2700 for the Galaxy S27 series may not feature FOWLP chip packaging technology. This move would help the company as a cost-cutting measure, amid mounting pressure.

Samsung debuted HPB thermal tech with the Exynos 2600 this year. This new chip packaging solution helps the chip stay cooler. Exynos 2700 is said to be retaining the HPB solution, while adding SbS heat dissipation.

That said, the removal of the FOWLP chip packaging tech may require architectural design tweaks on the Exynos 2700 chipset. Additionally, the utilization of Samsung Foundry’s second-generation 2nm process tech is certain.

Samsung’s upcoming Exynos 2700 could come with a deca-core CPU and an upgraded Xclipse 970 GPU, based on AMD RDNA 5. The company may also bring faster LPDDR6 RAM and UFS 5.0 NAND flash memory chips.

Exynos 2600 share in the Galaxy S26 series is near 30 percent. Early reports suggest the Exynos share would hit about 50 percent in the Galaxy S27 series. Meanwhile, Qualcomm is almost sure that Ultra will prefer Snapdragon.

Related article:

• Samsung Galaxy S27 Ultra could become more expensive

On the software side, the Galaxy S27 series is rumored to launch with One UI 9.5. The company has recently started the Beta Program of One UI 9, which would go official with the Galaxy Z Fold 8 and Z Flip 8 in the summer of 2026.

The post Galaxy S27’s Exynos 2700 excludes a signature chip tech appeared first on Sammy Fans.

The Galaxy S27 lineup arriving in early 2027 will be treated to a few watered-down features as Samsung is currently losing its skirmish with the DRAM crisis, along with the rest of the industry. Previously, it was rumored that the base model would need to feature BOE-made OLED panels to keep prices low, and now, the Exynos 2700 powering a percentage of these handsets is going to be missing a key technological feature, despite utilizing Samsung’s newest second-generation 2nm GAA process. Exynos 2700 may not leverage Samsung’s newest chip packaging, leaving some performance on the table So far, the biggest cost-cutting […]

Read full article at https://wccftech.com/exynos-2700-to-see-one-feature-removed-as-part-of-cost-cutting-move/