Samsung Foundry has a new thermal packaging solution called Heat Path Block (HPB), aiming to solve one of the most critical issues in advanced semiconductor design, heat buildup. The company is preparing to license this innovation to external clients, including Apple and Qualcomm, as it works to reestablish its position in the foundry market.

What is HPB and Why Does It Matter?

HPB is a copper-based thermal plate that sits directly above the application processor. In previous designs, Samsung placed the DRAM stack directly on top of the processor using Fan-Out Wafer-Level Packaging (FOWLP). The new Exynos 2600 design moves the DRAM to the side to make room for the HPB block, which now makes direct contact with the processor cores.

This repositioning improves heat transfer efficiency. Samsung claims a 30% reduction in average chip temperature compared to the previous generation. The thermal improvements are expected to help maintain peak performance in mobile processors during extended workloads, particularly in gaming and other intensive applications.

Rebuilding Trust with Apple and Qualcomm

Samsung plans to license HPB to potential clients, including Qualcomm and Apple. Both companies shifted major chip orders to TSMC in recent years. Qualcomm moved its Snapdragon 8 Gen 1 Plus production in 2022, and Apple made the switch with the A10 back in 2016. Samsung now sees HPB as a potential draw to win back these customers.

The timing may work in Samsung’s favor. Qualcomm’s new Snapdragon 8 Elite Gen 5 reportedly consumes 19.5W under full load, significantly more than Apple’s A19 Pro at 12.1W. This high power draw results in greater heat generation, creating demand for better cooling at the chip level. Samsung’s HPB could directly address this concern.

Samsung’s own MX division, which buys Snapdragon chips for Galaxy devices, has already requested cooling performance at HPB levels. This request signals that the market is taking the technology seriously.

Strategic Timing with 2nm and GAA

HPB will debut with the Exynos 2600, which also serves as Samsung’s proof-of-concept for its 2nm chip manufacturing process. The company has already implemented gate-all-around (GAA) transistor architecture with its 3nm node and will continue using it at 2nm. TSMC, by contrast, plans to adopt GAA starting at the 2nm node.

Reports from South Korea suggest Samsung’s 2nm yield has reached between 55% and 60%. The company expects profitability in its foundry division by 2027, once its new Taylor, Texas fab ramps up. The fab is scheduled to begin operations in 2026 and will help double Samsung’s 2nm capacity by the end of that year.

Samsung’s early use of GAA and new thermal solutions could give it an edge as more chipmakers explore alternatives to TSMC.

The Bigger Picture

Samsung is using HPB as part of a broader strategy to revive its foundry business. The company has reorganized its packaging teams under the foundry and memory divisions to focus more closely on advanced chip integration.

Samsung has also taken a more flexible pricing approach to attract new clients. TSMC’s 2nm wafers are reportedly priced 50% higher than previous generations due to strong demand from clients like Nvidia and Apple. Samsung is using competitive pricing to secure contracts with smaller AI semiconductor firms such as Charbright, Anaplash, and South Korea’s DeepX.

In July, Samsung also secured a $16.5 billion deal to manufacture Tesla’s next-generation AI6 chips. The company is producing image sensors for Apple, ASICs for Chinese mining companies, and smartphone APs for its System LSI division. These contracts signal early momentum as Samsung works to diversify its client base.

Samsung is betting that HPB, combined with its 2nm and GAA advancements, will help close the gap with TSMC and restore confidence in its advanced nodes. If the Exynos 2600 performs well, it could mark a turning point in Samsung’s efforts to regain share in the global foundry market.

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Asus has introduced the RT-BE58 Go in China, a compact WiFi 7 portable router that was announced earlier this year. The device is priced at 899 yuan ($127) and supports power bank input for on-the-go use.

Asus RT-BE58 Go Specifications

The RT BE58 Go supports dual-band WiFi 7 (802.11be) and offers a combined wireless throughput of up to 3600 Mbps. It delivers up to 2882 Mbps on the 5GHz band and 688 Mbps on the 2.4GHz band. Asus includes features like 4K QAM modulation and Multi-Link Operation to enhance speed and efficiency, especially in dense environments.

The router runs on a Broadcom 2.0GHz quad-core processor paired with 1GB DDR4 RAM and 256MB of flash storage. This hardware allows it to manage multiple devices and tasks simultaneously. It also includes two independent front-end modules (FEMs) to improve signal strength and stability.

Measuring 9.8 × 9.4 × 3.1 cm and weighing just 232 grams, the RT BE58 Go fits easily into a backpack or pouch. It includes foldable antennas and supports USB-C 18W PD input, allowing it to operate using a standard power bank. Asus says the router is ideal for outdoor work, hotel stays, road trips, and compact living spaces.

The router is equipped with multiple network access options. It includes a 2.5Gbps WAN port for wired broadband, USB tethering for 4G/5G smartphones or dongles, and a WISP mode that converts public WiFi networks into private secure hotspots. It also supports Asus AiMesh, which allows it to extend an existing mesh network using a single SSID.

For security and customization, the RT BE58 Go features AiProtection for real-time threat detection and malicious site blocking. It supports up to five guest SSIDs with branding support, as well as isolated child and IoT networks. VPN support is also built in for secure remote access.

Asus includes additional features such as smart scenario acceleration for streaming, gaming, and online meetings. The router also provides a dedicated USB-A port for mobile network tethering and a Gigabit LAN port for wired connections.

In related news, Ubiquiti has recently unveiled the Dream Router 5G Max with Wi-Fi 7, 10G SFP+, and full UniFi OS integration, while TP-Link has introduced the entry-level Wi-Fi 7 gaming router Archer GE400.

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If 2024 was a year of incremental updates, 2025 was the year the foldable form factor truly matured. We moved past the era of engineering curiosity and fragility into a time where these devices stood confidently alongside and often surpassed traditional flagship phones.

From Samsung’s meticulous refinement of its ecosystem to Huawei and Oppo pushing the physical limits of camera optics and hinge mechanics, this year’s lineup proved that foldables are no longer just experiments. They are now among the very best smartphones money can buy.

Here are our picks for the best foldable smartphones of 2025.

Samsung Galaxy Z Fold 7

Samsung’s seventh-generation book-style foldable feels like the device the series was always destined to be. The Galaxy Z Fold 7 eliminates previous compromises, most notably in its weight; at just 215g, it is the lightest Fold yet, thanks to a new titanium-backed display and slimmer FlexHinge. The viewing experience has been significantly upgraded with an 8-inch main display featuring thinner bezels and the removal of the under-display camera, which has been swapped for a sharper 10MP sensor.

However, the headline feature is the camera system. For the first time, Samsung has integrated a 200MP flagship-grade sensor, allowing the Fold 7 to capture images that rival the best slab phones on the market. On the software front, the device acts as a premier mobile workstation. Running One UI 8 and Android 16, it leverages Galaxy AI for seamless multitasking, such as side-by-side editing and context-aware interactions with Gemini Live.

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Samsung Galaxy Z Flip 7

Samsung also elevated its Flip line this year, turning the clamshell form factor into a productivity tool. The Galaxy Z Flip 7 introduced the biggest and brightest cover screen ever seen on the series, a 4.1-inch FlexWindow that genuinely feels like a standalone phone. This expanded real estate allows users to reply to messages, run full apps, or interact with Gemini Live without ever needing to unfold the device.

Beyond the screen, the Flip 7 is a powerhouse in its own right. It is the first in the series to support Samsung DeX, allowing it to double as a desktop computer, and it packs a larger 4300mAh battery despite being slimmer than ever. This combination of portability and power ensures that the Flip 7 offers a premium flagship experience that goes far beyond simple nostalgia.

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Huawei Mate X7

While others focused on refinement, Huawei chose to experiment with aggressive hardware. The Mate X7 turned heads with its unique Yun Brocade Collector’s Edition design, but it is the camera system that truly sets it apart. It features a 50MP main sensor with a variable aperture, a 50MP telephoto lens with 3.5x optical zoom, and Huawei’s Red Maple color sensor, all of which combine to deliver stunning results in any lighting condition.

The display technology is equally impressive, with a foldable OLED screen that reaches a peak brightness of 2500 nits. Running on HarmonyOS, the device makes excellent use of this extra screen real estate with improved multitasking features and satellite messaging support. To top it off, the 5600mAh battery and titanium-reinforced body make the Mate X7 one of the most rugged and longest-lasting foldables released this year.

Oppo Find N5

If Samsung and Huawei aimed for raw performance and camera versatility, the Find N5 focused on ergonomic perfection. This was arguably the most comfortable and polished foldable to hold in 2025, featuring a crease so shallow it is barely noticeable. This is made possible by an aerospace-grade titanium hinge that is both lighter and tougher than anything Oppo has shipped before.

The experience is just as premium on the inside. The 8.12-inch LTPO inner display supports stylus input, while the outer display has been upgraded for higher brightness. The Hasselblad-powered triple camera system, which includes a 50MP periscope lens and 6x optical zoom, holds its own in low-light and portrait scenarios. Furthermore, Oppo addressed battery anxiety by packing a massive 5600mAh silicon-carbon battery into the device, complete with fast wired and wireless charging, features its predecessor sorely lacked.

Huawei Pura X

Huawei’s Pura X took the idea of a flip phone and flipped expectations. The device features a unique 6.3-inch inner display with a 16:10 aspect ratio, a rarity in foldables, while the 3.5-inch outer OLED is a perfect square, giving the phone a distinctive, mirror-like aesthetic. Both screens are top-tier, supporting high-frequency PWM dimming and full 120Hz LTPO refresh rates.

Unlike many flips that compromise on cameras, the Pura X is a serious imaging device. It houses a 50MP RYYB main camera, a 40MP ultra-wide, and a 3.5x telephoto lens, offering flagship versatility in a playful form factor. When you add in IPX8 water resistance, satellite communication support, and a 4720mAh battery with 66W wired charging, the Pura X stands out as a flip phone that feels like a true flagship.

In related news, we recently covered the best global smartphones of 2025. You can check them out as well.

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Tiiny AI, a US-based startup, has announced the Tiiny AI Pocket Lab, which it claims is the world’s smallest personal AI supercomputer. The device weighs just 300 grams, fits in one hand, and delivers up to 190 TOPS of AI compute performance. It has been officially certified by Guinness World Records as the ‘Smallest MiniPC (100B LLM Locally)’ and can run up to 120-billion-parameter large language models (LLMs) entirely on-device.

The Pocket Lab features a 12-core ARMv9.2 CPU paired with a custom-designed NPU, achieving an AI compute performance of approximately 190 TOPS. It includes 80GB of LPDDR5X memory and a 1TB SSD to support large-scale inference workloads. Tiiny AI has built the device to operate within a 30W TDP and a typical 65W system power envelope, offering high performance with reduced energy consumption.

Tiiny AI says the Pocket Lab addresses the growing concerns around cloud dependency, data privacy, and rising energy costs. The company believes local AI processing offers a more sustainable and secure alternative to cloud-based systems. The device stores all user data and model interactions locally with bank-level encryption, eliminating the need for internet access or external servers.

The Pocket Lab supports one-click deployment of several open-source LLMs and agent frameworks. These include GPT-OSS, Llama, Mistral, DeepSeek, Qwen, and Phi, along with automation tools like ComfyUI, SillyTavern, and Flowise. The system runs entirely offline and enables use cases like multi-step reasoning, content generation, deep context understanding, and secure personal memory.

The company plans to showcase the Tiiny AI Pocket Lab at CES 2026. It has positioned the product for developers, researchers, professionals, and students who require portable and private AI capabilities. The device aims to serve real-world use cases in the 10B to 100B parameter range, which the company says accounts for over 80% of practical AI demands.

In related news, Xiaomi is reportedly developing a new AI assistant called Mi Chat, and reports indicate that GPUs are no longer the main barrier to AI progress, with other system-level constraints now becoming the limiting factor.

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