While all makers of microelectronics are set to benefit from the AI supercycle, the memory industry is projected to generate more than twice the revenue of the foundry industry.

TSMC's board of directors approves spending on new production capacities and promotes a key executive leading the development of A10 fabrication process due in 2030 or later.

Specifications of Intel's B960, Z970, Z990, Q970, and W980 platforms leak out, showcasing up to 48 PCIe lanes and an all-new chipset category.

We take a look at the Ultra Ethernet 1.0.1 specification in a bid to find out what has changed compared to the traditional Ethernet — and how it will change tomorrow's data-center connectivity.

Taiwan authorities have no problems with TSMC investing in the U.S. as long the bulk of its fabs and leading-edge process technologies remain in Taiwan.

Intel seemingly discontinues its 'Intel On Demand' technology that let its customers activate certain accelerators inside Xeon CPUs after purchase.

Only 0.3% of cryptocurrency exchange transaction clients got rich as a result of a major error.

After recording a $791.7 billion revenue in 2025, the semiconductor industry is on track to hit $1 trillion in sales in 2026.

Infineon reportedly notifies customers about price hikes effective April 1, 2026

After years of job cuts, Intel is about to get behind TSMC in terms of the headcount.

Western Digital outlines vision for hard drive platforms in 2030 and beyond: 14 platters, new laser technology, capacities of 140TB and beyond.

Western Digital to give large customers a tool to manage storage fleets of 200+ PB consisting of SSDs, HAMR HDDs, and UltraSMR drives.

Western Digital reveals hard disk drives tailored for higher performance and lower power consumption, targeting QLC NAND-based solid-state storage.

Western Digital announces HDD roadmap till 2029 at its Innovation Day.

As Nvidia is ramping up production of the Rubin platform, other 3nm-class process suffer

Intel demonstrates 8X reticle size prototype system-in-package that features four logic tiles, two I/O tiles, and 12 HBM4-class stacks.

Nvidia's Huang claims that Taiwan will not lose its silicon shield as TSMC expands overseas because demand for leading-edge semiconductor production is so high that a global chipmaking footprint is essential to meet it.

ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records.