ASML's roadmap for chipmaking lithography tools examined β from DUV to Low-NA, High-NA, Hyper-NA, and beyond Latest from Tom's Hardware 1 May 2026 at 15:30 ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating β¬32.7 billion in total revenue and ending the year with a β¬38.8 billion order backlog.
Intel details 18A-P process node, touts higher performance, lower power, and better thermals β 9% more performance, thermal conductivity improved by 50% Latest from Tom's Hardware By:ashilov@gmail.com (Anton Shilov) 1 May 2026 at 15:00 Intel details improvements of 18A-P that include higher performance, lower power, reduced variability, improved yields, and more.
TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 β Fujitsu's Monaka CPU to benefit from face-to-face chiplet stacking Latest from Tom's Hardware By:ashilov@gmail.com (Anton Shilov) 29 April 2026 at 17:26 TSMC adds support for face-to-face stacking, 6.5 Β΅m and 4.5 Β΅m pitches for the next generation of SoIC 3D stacking.
Inside Google's TPU V8 strategy, delivering two chips for two crucial tasks at incredible scale β network scales up to 1 million TPUs per cluster, an advantage over Nvidia AI accelerators Latest from Tom's Hardware 27 April 2026 at 21:12 Google announced its eighth-gen TPUs at Cloud Next, shipping two distinct chip designs for the first time in the TPU program's decade-long history.
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