Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more performance, thermal conductivity improved by 50%

1 May 2026 at 15:00

Intel details improvements of 18A-P that include higher performance, lower power, reduced variability, improved yields, and more.

TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's Monaka CPU to benefit from face-to-face chiplet stacking

29 April 2026 at 17:26

TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.

29 April 2026 at 15:00

According to analyst reports, Intel is reducing wafer yield variability to get more useful CPU dies from wafer edges amid AI-driven demand.

27 April 2026 at 15:56

TSMC claims that CoWoS innovations will enable 48x more compute and 34x more memory bandwidth for 2029 AI processors.