Apple is reportedly in early talks with Intel and Samsung to secure more production for its advanced chips, as the company is constrained by the limited availability of advanced nodes that its SoCs are produced on.

China is targeting 70% local wafer sourcing as firms like Eswin scale 12-inch production, aiming to reduce reliance on foreign suppliers and support growing AI chip demand.

ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.

Intel details improvements of 18A-P that include higher performance, lower power, reduced variability, improved yields, and more.

TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.

Google announced its eighth-gen TPUs at Cloud Next, shipping two distinct chip designs for the first time in the TPU program's decade-long history.