China is targeting 70% local wafer sourcing as firms like Eswin scale 12-inch production, aiming to reduce reliance on foreign suppliers and support growing AI chip demand.

ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.

Intel details improvements of 18A-P that include higher performance, lower power, reduced variability, improved yields, and more.

TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.

Google announced its eighth-gen TPUs at Cloud Next, shipping two distinct chip designs for the first time in the TPU program's decade-long history.