At the 2026 IEEE International Symposium on Circuits and Systems (ISCAS), Huawei’s He Tingbo showcased the company’s new “LogicFolding Design” technology during the “New Semiconductor Path in Practice” keynote. Hindered due to the lack of access to specialized EUV machinery, Huawei’s only path to remain a competitive entity against its chipset rivals is to innovate on the packaging side, with the advantages of this design including an impressive 53.5 percent increase in transistor design, along with a frequency boost of 12.7 percent. As for the other benefits, those have been detailed below. With further innovation, Huawei targets 2031 to reach […]

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