Intel has hired Seok-Hee Lee as EVP of its Foundry's Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO. Intel Foundry Gets SK Hynix's Ex-CEO, Seok-Hee Lee, Bringing Years of Experience In The Advanced Packaging & Back-End Technology Segment Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for customers. […]

Read full article at https://wccftech.com/sk-hynix-former-ceo-returns-to-intel-taking-charge-as-evp-of-foundry-business-advanced-packaging-technologies/

Trump confirms that Apple is working to design and build Apple Silicon on US soil US President Donald Trump has stated on Truth Social, his social media platform, that Apple has agreed to work with Intel to design and build its chips in America. So far, neither company has confirmed the deal, though that hasn’t […]

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Intel's deal with Apple is now confirmed by the US President himself, with Chipzilla all set to build and design chips on American soil. Intel Will Design & Build Chips For Apple As US Moves Chip Making Back To American Soil Well, if it needed confirmation, the President of the United States, Donald J. Trump, has now confirmed that Apple has agreed to work with Intel. In this deal, Apple will leverage Intel tech to design and build its next-generation chips. The statement from Trump comes as part of the historic turnaround that Intel has achieved under the current US […]

Read full article at https://wccftech.com/apple-to-design-build-chips-at-intel-on-american-soil-us-president-confirms/