Samsung is showcasing an upcoming Galaxy phone that looks so attractive in its first teaser. The company is set to unveil the Galaxy M47 mid-range smartphone in India, and the product page has also gone live on Amazon.

From what we’re seeing in the first teasers, the Galaxy M47 is gearing up to be one of the most attractive Samsung phone models in the segment.

The phone’s Red/Maroon color variant has a matte backpanel, pairing a Black chassis. The color combination itself looks so catchy and something new that everyone has been waiting for.

The side frame also boasts a key island design to house volume buttons. The vertical island features three camera sensors on the back. It’s not as gorgeous as the flagship phones, but still decent.

If you have a desire to own a Samsung phone with a design that stands out, the Galaxy M47 should be your bet. What makes it more appealing is the camera island, inpired from the Galaxy S26 flagship phones.

Samsung hasn’t revealed the launch date or timeline of this phone. The company is just highlighting it as a device that is “coming soon.” India debut is confirmed and expansion may cover certain markets in the Asia region.

The Galaxy M47 is expected to come with a Snapdragon 6 Gen 3 processor. It would run Android 16-based One UI 8.5 software. The chipset could be paired with 8GB of RAM as standard to offer seamless experience.

Watch the teasers here:

The wait for the next level is almost over.#GalaxyM47 5G is coming soon. Stay tuned for the #NextLevelMonster.#ComingSoon #LoveforMonster #Samsung pic.twitter.com/Aas3qojhEf

— Samsung India (@SamsungIndia) June 19, 2026

You have seen what a Monster can do.
But this is THE NEXT LEVEL MONSTER.

Gear up for 4X!
More multitasking.
More hours of endless gaming.
More strength for the outdoors!

This is the 4X Monster upgrade.
The new #GalaxyM47 5G is arriving soon.
Stay tuned!
#NextLevelMonster… pic.twitter.com/OTrHEqqikA

— Samsung India (@SamsungIndia) June 19, 2026

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Lenovo has released a new wired gaming headset in China, the EY130. Priced at 99 yuan (roughly $14) on JD.com, it is an entry-level over-ear model that manages to include a few hardware features usually reserved for slightly more expensive peripherals, such as 50mm drivers and built-in 7.1 surround sound processing.

Lenovo EY130 Specifications

Inside the earcups, the EY130 relies on 50mm composite diaphragm drivers. These are built with a dual-magnet design and a polyurethane and fiber paper construction, covering the standard 20Hz to 20kHz frequency response range. According to Lenovo, the headset’s audio profile is specifically tuned for first-person shooters.

Additionally, the headset handles virtual 7.1 surround sound directly through an integrated acoustic chip. This is a convenient inclusion, as it means the surround sound processing happens on the hardware level, bypassing the need to install separate software or proprietary drivers on your PC to get it working.

For voice communication, the headset features an attached omnidirectional boom microphone with a sensitivity rating of -42dB ±3dB. The mic is flexible for easy positioning and includes Environmental Noise Cancellation (ENC) technology.

The physical design of the EY130 sticks to standard PC gaming conventions. It features an all-black exterior accented by dynamic RGB lighting on the earcups. Lenovo opted for a dual-layer, self-adjusting headband that stretches to fit different head sizes while distributing the headset’s weight. The ear cushions are made from a breathable fabric to reduce heat buildup during longer sessions. The entire unit measures 230 by 206 by 95 mm.

Connectivity is handled by a combined USB and 3.5mm cable. As a fully wired device, it operates as a plug-and-play peripheral for desktops, laptops, and consoles, avoiding the latency and battery management issues associated with wireless models.

In related news, Lenovo has recently introduced a budget-friendly mechanical keyboard featuring tri-mode connectivity and hot-swappable switches, alongside a compact AI Mini PC powered by a 12-core processor and equipped with its Tianxi Claw AI assistant.

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(JD)

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Samsung is working on the Exynos 2700 processor, which would power the Galaxy S27 series next year. The prototype version of this chip has already appeared on benchmark platforms, revealing its potential direction.

On June 18, Park Yong-in, President and Head of Samsung Electronics’ System LSI Business, shared the progress of the next-gen Exynos chipset, the Exynos 2700, which is being developed to be used in the Galaxy S27 series.

President Park revealed that the development of Exynos 2700 is on track. The LSI Division is aiming to secure supply for the Galaxy S27 series. Samsung’s MX Division will assess the SoC before approving it for the smartphones.

Park stated (via NewsIS), “We are developing the Exynos 2700 without any setbacks, aiming for its inclusion in flagship models.”

Samsung used Exynos 2600 in the Galaxy S26 series and plans to expand it to the Galaxy Z Flip 8 this year. Meanwhile, the chip designing division may flag an annual deficit due to market shifts and contracting demand.

Galaxy S27 and S27 Plus may get the Exynos 2700 chip, while the S27 Pro and S27 Ultra may prioritize the Snapdragon SoC. Adoption of Exynos 2700 is expected to grow as the Exynos 2600 is doing a better job than its predecessors.

Samsung is gradually gaining trust for its in-house mobile platform. Snapdragon is still ahead in terms of real performance, but the gap is narrowing. Exynos 2700 may grab an even larger share in the Galaxy S27 series next year.

The Korean tech giant is preparing to hold the next Unpacked event in July 2026. It will be focussed toward new foldable phones and smartwatches. Meanwhile, the Galaxy S27 series may land sometime in February 2027.

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Samsung may have a total of eight chip choices for the Galaxy S27 series, with Snapdragon 8 Elite Gen 6 Pro alone coming in six configurations.

A closer look at the leaked data (via Reptalica) reveals Qualcomm is testing a diverse mix of hardware samples for the Snapdragon 8 Elite Gen 6 Pro chipset. That said, Samsung would have a total of eight chip options for its upcoming flagships.

The structural breakdown of the processors could be as follows:

• Snapdragon 8 Elite Gen 6 Pro: 6 configurations
• Snapdragon 8 Elite Gen 6 (Standard): 1 configuration
• Exynos 2700 (in-house): 1 configuration

This heavily diversified approach indicates that Qualcomm is moving away from a one-size-fits-all model for its premium tiers. Instead, the chipmaker is exploring a multi-variant strategy to combat the soaring costs.

The upcoming Snapdragon 8 Elite Gen 6 Pro is shaping up to be an absolute powerhouse built on an advanced 2nm architecture. This next-generation hardware is primarily engineered to power next year’s elite “Ultra” flagships.

By offering multiple tiers of the same chip, device makers can keep their component expenditures under control without completely sacrificing premium performance.

Qualcomm is actively testing prototypes designed for the upcoming LPDDR6 RAM, alongside the current LPDDR5X standard. Specifically, the leak outlines three primary model tiers, each split into two distinct sub-variants:

• “AC” Version: Fully optimized for the next-generation LPDDR6 RAM. Top-tier flagships will likely pair these variants with ultra-fast UFS 5.0 storage.
• “BC” Version: Configured for the existing LPDDR5X standard. Budget-conscious phone manufacturers can opt for these versions to save costs.

Beyond memory differences, these six configurations point to a silicon-binning strategy similar to Apple’s approach. By adjusting CPU and GPU clock speeds across different variants, Qualcomm can sell slightly dialed-back versions.

Final retail configurations could surface before an official launch event, but it gives us an exciting glimpse into how Samsung and Qualcomm plan to tackle future flagships.

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Soaring memory prices due to the AI boom affected every electronics manufacturer. The industry assumed Apple was unaffected, but the myth has been debunked by Tim Cook himself, who has just teased a potential price hike across products, including the iPhone 18 Pro.

In a recent interview with the Wall Street Journal, Apple CEO Tim Cook dropped a major bombshell: price increases for Apple products are becoming “unavoidable.”

While Apple braces for these unsustainable supply chain pressures ahead of its rumored iPhone 18 Pro and foldable launches, a massive window of opportunity is opening up for its biggest rival: Samsung Electronics.

iPhone 18 price hike to be the next Samsung opportunity

The company faced its own backlash in the US market after implementing selective price hikes across the Galaxy S26 lineup, which saw the base model jump to $899 and the Plus variant climb by a steep 10% to $1,099.

However, Apple’s upcoming pricing shift gives Samsung a perfect clean slate to rewrite the narrative with the future Galaxy S27 series.

If Apple passes these massive memory expenses directly onto US consumers, the iPhone 18 Pro series risks pricing itself out of the comfort zone for average buyers.

Samsung can strategically exploit this by aggressively stabilizing or subsidizing its Galaxy S27 launch pricing. Rumors suggest Samsung is also making a Galaxy S27 Pro, which should open up a broad consumer base in the US.

Tim Cook didn’t specifically highlight iPhone 18 Pro price hike, but the timing makes it the strongest victim. Rising memory prices aren’t leaving any consumer electronics item and Apple can no longer absorb the cost shock.

If the Galaxy S27 series offers superior on-device AI integration, next-gen hardware, and a lower or equivalent price than the iPhone 18 Pro Max model, Samsung stands a massive chance to capture frustrated premium buyers across the US.

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Samsung Galaxy Z Flip 8, Galaxy Z Fold 8 (Wide), and Galaxy Z Fold 8 Ultra are actively clearing certification hurdles ahead of launch.

The South Korean tech giant is preparing three foldable phones for 2026. The lineup reportedly includes a flip phone and two book-style foldables. The company has also revamped its naming strategy for the next foldable lineup.

Galaxy Z Fold 8 would feature wide cover and main screens. It was earlier rumored to launch as the Galaxy Z Fold 8 Wide, but Samsung plans differently. The Galaxy Z Fold 8 Ultra will be a true successor to the Galaxy Z Fold 7.

Samsung is rumored to hold its Summer Unpacked in late July 2026. If supply chain reports are to be believed, the event would be held on July 22 in London. That said, the official reveal is roughly 40 days away.

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Galaxy Z Fold 8 Ultra price rumor [Update – June 18]

Samsung may launch Galaxy Z Fold 8 Ultra at higher prices than the Fold 7. The company would offer a 256GB version of the new foldable phone at around the same cost as the 512GB model of last year’s Fold device.

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Galaxy Z Fold 8 series emerges on FCC [Update – June 15]

Galaxy Z Fold 8 Ultra has appeared on FCC certification database. Following the certification, the device is now approved to launch in the United States. Samsung’s SM-F976U has surfaced along with a design render on the database, via DroidLife.

 

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Galaxy Z Fold 8 appears on BIS certification [Update – June 11]

Samsung will launch its Galaxy Z Fold 8 (Wide) model in India as well. This has been confirmed after the device’s model number SM-F971B surfaced on the country’s BIS certification database; however, it doesn’t reveal any other details.

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Galaxy Z Flip 8 obtains FCC certification [Update – June 9]

Samsung’s upcoming Galaxy Z Flip 8 has surfaced on the FCC database with the SM-F776U model number. The device has reportedly gone through an RF exposure test, specifically a SAR (Specific Absorption Rate) test report.

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Galaxy Z Flip 8 and Fold 8 series clear BIS certification [Initial post]

Ahead of their official reveal, Samsung’s Galaxy Z Fold 8, Fold 8 Ultra, and Flip 8 have cleared the BIS certification in India. This milestone hands the three foldables a mandatory regulatory approval for official release in the market.

Our friends over at SammyGuru spotted Samsung’s unreleased SM-F776B, SM-F-971B and SM-F976B models on the BIS database.

Qualcomm’s Snapdragon 8 Elite Gen 5 for Galaxy SoC will power the upcoming Samsung foldables. The clamshell model, which is rumored to be the last of its kind, is slated to bring Exynos 2600 chips to certain markets.

Galaxy Z Fold 8 Ultra is reportedly getting a 5000mAh battery with 45W charging support. The camera system is staying the same, which should have been improved to justify the company’s decision to slap the Ultra tag.

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