Samsung was considering removing Fan-Out Wafer-Level Packaging (FOWLP) from the Exynos 2700 as part of its cost-cutting strategy to make its upcoming Galaxy S27 series more affordable for the masses amid the DRAM shortage. Fortunately, a new rumor has dispelled these claims, stating that the Korean giant fully intends to treat its next 2nm chipset with the best in-house technologies possible to raise the competitive bar. Maintaining FOWLP technology on the Exynos 2700 helps the latter to maintain better performance when running taxing workloads Aside from removing FOWLP from the Exynos 2700, Samsung was also rumored to switch to BOE’s […]

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The Galaxy S27 lineup arriving in early 2027 will be treated to a few watered-down features as Samsung is currently losing its skirmish with the DRAM crisis, along with the rest of the industry. Previously, it was rumored that the base model would need to feature BOE-made OLED panels to keep prices low, and now, the Exynos 2700 powering a percentage of these handsets is going to be missing a key technological feature, despite utilizing Samsung’s newest second-generation 2nm GAA process. Exynos 2700 may not leverage Samsung’s newest chip packaging, leaving some performance on the table So far, the biggest cost-cutting […]

Read full article at https://wccftech.com/exynos-2700-to-see-one-feature-removed-as-part-of-cost-cutting-move/