A collaborative research team has demonstrated what it says is the first monolithic 3D integrated circuit manufactured at a commercial U.S. foundry.

This would be Rapidus’ first major private-sector loan, with details still under discussion.

Nvidia is evaluating whether to increase production of its H200 data center GPUs after demand from Chinese customers is expected to exceed current supply.

TechInsights says Huawei's Kirin 9030 is built on SMIC’s N+3 process: an incremental, DUV-based extension of its 7nm-class technology that pushes density without EUV but falls well short of true 5nm nodes amid rising yield challenges.

Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison have demonstrated what they describe as the first regenerative photonic memory latch.

Intel has evaluated wet etch tools from ACM Research for its 14A fabrication process, raising political and national security concerns.

Cambricon Technologies is preparing one of the most aggressive production ramp-ups attempted by a Chinese AI chipmaker.

TSMC reportedly mulls making 4nm chips in Japan amid putting construction of Fab 23 phase 2 on pause.

China convened emergency meetings with its largest technology companies on Wednesday to assess how many of Nvidia’s H200 accelerators they intend to buy.

A growing body of forecasts from AMD, Nvidia, Broadcom, and major research firms now points toward a semiconductor market that passes the trillion-dollar threshold before the decade closes.

Intel’s new partnership with Tata signals a transformative step for India’s chip ecosystem, enabling domestic manufacturing, advanced packaging, and enterprise compute solutions.

The U.S. will allow Nvidia to export its H200 data center accelerators to “approved customers” in China, President Donald Trump announced on Monday.

Several suspects have been apprehended for allegedly violating export control laws regarding the supply of Nvidia H100 and H200 AI chips to China.

TSMC may be accelerating its advanced packaging facility in Arizona to package the first processors as early as 2028, ahead of its partner Amkor.

TSMC clarifies A14 specifications: Even more performance, but better tools might be needed to extract the full potential of the latest process technologies.