As Nvidia is ramping up production of the Rubin platform, other 3nm-class process suffer

Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts.

Intel demonstrates 8X reticle size prototype system-in-package that features four logic tiles, two I/O tiles, and 12 HBM4-class stacks.

The ongoing trade war puts Taiwan and TSMC in a difficult position. As negotiations continue, the country risks giving up its most precious commodity, the might of TSMC.

Nvidia's Huang claims that Taiwan will not lose its silicon shield as TSMC expands overseas because demand for leading-edge semiconductor production is so high that a global chipmaking footprint is essential to meet it.

ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records.