SMIC, China's biggest chip manufacturing company, is now looking to advanced packaging, given how NVIDIA and others have leveraged it to scale performance beyond the norms of Moore's Law. SMIC Plans to "Strengthen" Cooperation With OSAT Partners, In Order to Effectively Develop Packaging Solutions Advanced packaging has been a key resource for chip manufacturers to scale performance significantly over the past few years. Scaling laws have pushed beyond the traditional transistor-shrinking approach towards newer techniques, and one way to do so is to bring innovation to backend semiconductors, such as TSMC's CoWoS. According to a DigiTimes report, SMIC is now […]

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