Samsung is betting on laser tech that fires a quadrillion times per second. It is one of those moves that won’t show up in a spec sheet, but you will probably feel the difference when your phone doesn’t randomly die due to aging.

The company is pushing femtosecond laser cutting across its whole semiconductor operation. This tech uses ultrafast pulses measured in femtoseconds to slice wafers without the heat damage and debris that older methods leave behind.

Laser cutting process

Samsung started small last year with HBM4 memory, testing a handful of units. Worked well enough that the company has just placed orders for at least ten more machines, a mix of grooving rigs and full-cut units.

The speed minimizes the heat-affected zone without material loss and debris creation during the process. Traditional methods use diamond blades or nanosecond lasers, which sounds fast until you realize nanoseconds are a billion times slower than femtoseconds.

Compared to traditional blade and nanosecond/picosecond laser dicing methods, this approach demonstrates superior thermal confinement and structural integrity control.

The tech expanding beyond HBM4

Samsung brought in a few femtosecond units for HBM4 in mid-2024. Now, the company is talking about expanding this across DRAM, NAND flash, and system chips.

The company has started mass production of HBM4 chips in February 2026 at its Pyeongtaek campus, and femtosecond cutting is apparently key to hitting its yield targets on that.

Your Galaxy doesn’t use HBM4, but it uses plenty of other Samsung chips. NAND for storage and system chips for processing. If this laser tech spreads like Samsung claims it will, that is better quality control across the board.

The post Samsung doesn’t need HBM in Galaxy if this laser tech delivers appeared first on Sammy Fans.