Qualcomm is jointly developing custom DRAM with CXMT, formally ChangXin Memory Technologies, China’s fourth-largest DRAM producer. Qualcomm is also working with GigaDevice on a discrete smartphone NPU targeting Chinese brands.

The NPU delivers roughly 40 TOPS of compute. It’s paired with 4GB of customized 3D DRAM manufactured by CXMT, using TSV and hybrid bonding stacking to push memory bandwidth beyond what standard LPDDR5X can offer.

Shipments are expected in late 2026 or early 2027, aimed at devices priced above RMB 4,000 (~ $585) to 4,500 (~ $660). That’s not a minor spec tweak, but a purpose-built AI memory stack for mid-to-premium Android phones.

CXMT already covers around 30% of the Chinese smartphone market with its LPDDR5X production. The capacity exists, the manufacturing knowledge exists and now there’s a Qualcomm-backed design riding on top of it.

Samsung, SK Hynix, and Micron have been operating in a seller’s market for mobile memory while they prioritize AI server contracts. A qualified CXMT with custom designs in hand is pressure, even if it never ships a single unit outside China.

Samsung sits in an uncomfortable position here

Samsung is one of the companies causing the mobile memory squeeze by chasing AI server contracts, and one of the Android ecosystem players that suffers when memory costs push OEMs toward cheaper silicon choices.

The company could have moved on custom DRAM partnerships for mobile AI. Now, Qualcomm is building an alternative stack with Chinese suppliers, targeting the exact price tier where Samsung’s Galaxy A and mid-range lines compete hardest.

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