Exynos 2700 chip might finally solve the one problem that’s quietly followed Samsung’s in-house chips for years, the cooling segment, by leveraging SBS technology.

The Exynos 2700, expected to be utilized inside next year’s Galaxy S27 series, is reportedly built around a side-by-side architecture designed to keep temperatures in check better than Snapdragon chips.

Most chips use a stacked design, with RAM sitting directly on top of the SoC. Two hot components pressed against each other, and heat was trapped between them.

SBS flips the script

Instead of stacking, Samsung places the RAM beside the SoC using a Fan-out Wafer-Level Packaging process. Think of two heating components side by side instead of one sitting on top of the other.

Shorter interconnects mean memory bandwidth is expected to jump somewhere between 30 and 40 percent, with power efficiency improving too.

This shift addresses multiple problems at once, which is exactly the kind of engineering bet Samsung needs to make right now.

Exynos 2600 benchmarks against the Snapdragon 8 Elite Gen 5 show Samsung’s chip running more stably under sustained load.

The Exynos 2700 has already surfaced on Geekbench. Early numbers are underwhelming, but that’s completely normal at this stage in development.

It remains to be seen how the new Exynos chip handles the cooling segment in the next year’s Galaxy flagships.

The post Galaxy S27’s Exynos 2700 may pack new SBS cooling tech and bandwidth appeared first on Sammy Fans.