Apple A20 Chip Likely To Miss Out On New WMCM Packaging Tech That Allows For Various CPU/GPU Core Combos
The ongoing DRAM shortages are now apparently compelling Apple to aggressively water down its ambitions for the upcoming A20 chip that is slated to power the base iPhone 18, clearly illustrating that even Apple is not entirely immune to the vagaries of the DRAM market these days. Apple's upcoming A20 chip is unlikely to leverage the new WMCM packaging tech that unlocks an unprecedented level of versatility Up until recently, Apple's upcoming A20 chip was expected to make a switch from TSMC's InFO (Integrated Fan-Out) packaging tech, which integrates components like the AP and DRAM onto a single die without [β¦]
Read full article at https://wccftech.com/apple-a20-chip-likely-to-miss-out-on-new-wmcm-packaging-tech-that-allows-for-various-cpu-gpu-core-combos/

