As the race for the AI buildout continues to intensify, a shortage in the packaging industry has led memory manufacturer SK hynix to team up with Intel for chip packaging technology. After a strong comeback under CEO Lip-Bu Tan, Intel is now aiming to expand its presence in the packaging industry. The firm and SK hynix are collaborating on 2.5D packaging technology and Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology as shortages create tightness in the current packaging supply chain. Intel & SK hynix Collaborating On EMIB Packaging As Shortages Impact 2.5D Packaging Supply Chain Intel's EMIB packaging technology is […]

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As agentic AI now dominates the conversation when it comes to AI computing, investment bank Goldman Sachs is out with a report that agentic computing will drive a jump in token consumption. The bank believes that token consumption will grow 24 times by 2030 compared to 2026's figures as AI queries jump from five billion to 23 billion, driven particularly by non-human agents. Goldman Sachs Out With Optimistic Report About Agentic AI The central theme in Goldman Sachs' report concerns a rapid growth in the use of agentic AI. Agentic AI involves the use of software bots that compute through […]

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