A new leak from well-known tipster Digital Chat Station gives us a pretty detailed look at MediaTek’s upcoming Dimensity 8500 chip.

According to the leak, the Dimensity 8500 is built on TSMC’s 4nm process and uses an 8-core setup based on ARM’s A725 architecture. That means all cores are big cores, like the Dimensity 8400.

The prime apparently hits 3.4GHz, which is slightly higher than 3.25GHz on its predecessor. Whereas the remaining cores could also have higher clock speeds than before. 

On the graphics side, the Mali-G720 GPU is reportedly scaled up and running around 1.5GHz. It’s still early numbers, but the chip reportedly lands around 2.2 million on AnTuTu.

Digital Chat Station claims the GPU’s theoretical performance could beat Qualcomm’s Snapdragon 8 Gen 3 and 8s Gen 4 — at least on paper. Of course, theory doesn’t always match real-world gaming, heat control, or battery life, so it’s better to wait for actual phones before jumping to conclusions. 

The first wave of phones with the Dimensity 8500 is already in testing, according to the leak. One is a mid-range phone with a standard-sized display, while the other is focused on battery life with a large-capacity battery. The rollout has reportedly started quietly.

There’s also a familiar brand name tied to this chip. Back in August, the blogger hinted that the Dimensity 8500 may debut on Xiaomi’s Redmi Turbo line. Honor, OPPO, OnePlus, and vivo are expected to follow with their own models soon after. 

For context, the Redmi Turbo 4 series split its chips between MediaTek and Qualcomm — the base model launched with the Dimensity 8400-Ultra, while the Pro variant picked the Snapdragon 8s Gen 4. 

If the leak pans out, the Dimensity 8500 might slot in as the next step for Xiaomi’s mid-range performance phones. No release date yet, and no confirmation from MediaTek.

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The post MediaTek Dimensity 8500 specs leak, to feature all-big core design appeared first on Gizmochina.