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Yesterday — 1 April 2026Main stream

MediaTek Dimensity 9600 to feature dual prime cores in a first for the Dimensity 9-series

1 April 2026 at 11:10
MediaTek-Dimensity-9600-two-prime-cores

Just as rumors begin to swirl around Qualcomm’s Snapdragon 8 Elite Gen 6, a new leak from tipster Digital Chat Station is shedding light on what MediaTek has in store next.

According to recent reports, the Dimensity 9600 will be built on TSMC’s 2nm N2P process. But the more interesting shift could be in its CPU design. The chip is rumored to adopt a new 2+3+3 layout, two “prime” cores paired with six high-performance cores.

If true, this would be the first time MediaTek’s Dimensity 9 series will move to a dual prime-core configuration. For context, Dimensity 9500 has one ARM C1-Ultra (4.21GHz) for peak performance, three ARM C1-Premium (3.5GHz) for sustained power, and four ARM C1-Pro (2.7GHz) for efficiency. 

Digital Chat Station says the dual prime-core setup in Dimensity 9600 is internally referred to as “Canyon.”

Even its competitor has a similar setup

On paper, this setup should make the Dimensity 9600 better equipped to handle demanding workloads, especially as AI tasks continue to grow more complex. Paired with the new process node, the chip is expected to deliver a noticeable jump over its predecessor.

As for graphics, the Dimensity 9600 is said to include a new GPU with neural network shader technology that should improve coordination between the GPU and NPU. Better collaboration between these components could reduce power draw while maintaining smoother performance.

Meanwhile, its competition isn’t standing still. The Snapdragon 8 Elite Gen 6 is also rumored to adopt a similar 2+3+3 CPU layout. Not to forget, Qualcomm’s solution relies on its in-house Oryon cores, while the Dimensity 9600 will feature ARM’s upcoming Cortex-C2 series cores. 

This sets up a familiar situation where both companies are chasing similar architectural goals, even if their execution differs.

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The post MediaTek Dimensity 9600 to feature dual prime cores in a first for the Dimensity 9-series appeared first on Gizmochina.

Before yesterdayMain stream

MediaTek Partners With SpaceX To Bring Starlink Support To Its M90 Modem

4 March 2026 at 18:08

A MediaTek M90 chip is displayed with glowing edges, set against a dark background.

Satellite-based communication and the internet are the next big tech frontier for smartphones, and MediaTek is trying to position itself as a tech leader by formalizing a high-stakes partnership with SpaceX to bring native Starlink compatibility for emergency messages to the M90 modem. MediaTek and SpaceX partner to bring native Starlink compatibility for emergency messages to the M90 modem MediaTek has now announced that it is collaborating with SpaceX's Starlink to "support wireless emergency alert messages via satellite communication," allowing global smartphone users "to receive alerts from the Commercial Mobile Alert System (CMAS), Wireless Emergency Alerts (WEA) framework, and the […]

Read full article at https://wccftech.com/mediatek-partners-with-spacex-to-bring-starlink-support-to-its-m90-modem/

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