MediaTek is not just about powering Android smartphones with its Dimensity or Helio line. The company continues to expand its reach across connected devices, and its latest effort in doing so is the Kompanio 540, a new processor built specifically for Chromebooks.
Kompanio 540 Specifications
MediaTek says the Kompanio 540 is a chip built for superior performance and all-day battery life in student Chromebooks. The chipmaker claims it delivers up to 35% better power efficiency compared to the previous Kompanio 520.
While that is to be proven in real-world usage, the Kompanio 540 brings an architecture upgrade designed to improve overall performance.
It features an eight-core CPU based on a 2+6 configuration, which includes two high-performance Cortex-A78 cores clocked at 2.6GHz and six power-efficient Cortex-A55 cores running at 2.0GHz. In comparison, the Kompanio 520 includes two Cortex-A76 cores (2.0GHz) and six Cortex-A55 cores (2.0GHz).
The chip also comes with ARM’s Mali-G57 MC2 GPU that enables support for 4K displays at 60Hz or dual 2.5K monitors when connected to external screens. For a Chromebook, that’s a notable step forward in display flexibility and graphical capability, especially for users who rely on multitasking setups.
The Kompanio 540 supports Wi-Fi 7, Bluetooth 6.0, and Bluetooth Low Energy (LE) for connectivity. Storage and memory options are also flexible. The chip supports both LPDDR5-6400 and LPDDR4x-4266 RAM, as well as eMMC 5.1 and faster UFS 3.1 storage.
Last but not least, it’s also compatible with USB 3.2 Gen 2 and PCIe Gen 2 for peripheral expansion. The Kompanio 540 will make its debut in consumer devices starting January 2026.
For more daily updates, please visit our News Section.
Qualcomm continues to push more power into affordable chips by incorporating modern chip technologies and premium features. The newly announced Snapdragon 6s Gen 4 aims to strengthen Qualcomm’s presence in the affordable and lower mid-range smartphone market. But there’s strong competition from MediaTek in that segment.
The Dimensity 7300, announced in June 2024, has a similar spec sheet, featuring four Cortex-A78 and four Cortex-A55 cores. The chipset already powers many phones from different brands, such as Vivo, Oppo, and Nothing. Here, we’ll compare it against the Snapdragon 6s Gen 4 to see which one has the edge.
Snapdragon 6s Gen 4 vs Dimensity 7300
As of writing this post, no smartphone has been launched with the Snapdragon 6s Gen 4. So, we don’t have the benchmark data as yet. So, we’ll be focusing on the rest of the details for this comparison. We’ll update this comparison with benchmark data once available.
CPU, GPU, & NPU
The Snapdragon 6s Gen 4 is manufactured using Samsung’s 4nm process node, while the Dimensity 7300 uses TSMC’s 4nm process node. The difference here is that TSMC’s manufacturing facility generally produces chips that offer higher performance and power efficiency than Samsung’s.
Furthermore, the Snapdragon chip uses four Cortex-A78 performance cores and four Cortex-A55 power-efficiency cores. The Dimensity 7300 also has the same CPU configuration, but the cores run at higher speeds, which should offer higher peak performance.
The Snapdragon 6s Gen 4 is equipped with an Adreno GPU (the exact model hasn’t been disclosed yet) that promises 59% better performance than its predecessor, the Snapdragon 6s Gen 3. Qualcomm says the chip is capable of delivering ultra-smooth 144fps gaming at FHD+ resolution. Additionally, the chip supports Variable Rate Shading and Qualcomm Game Quick Touch for an enhanced gaming experience.
The Dimensity 7300, on the other hand, uses a dual-core Mali-G615 GPU. It also brings MediaTek HyperEngine optimizations, which improve performance, battery efficiency, and latency. In short, both GPUs promise smooth gaming. However, to see which chip offers better gaming performance, we’ll have to wait until a device with the Snapdragon 6s Gen 4 chip arrives in the market.
Both chipsets also feature NPUs for on-device AI capabilities: Qualcomm Hexagon NPU on the Snapdragon 6s Gen 4 and MediaTek APU 655 on the Dimensity 7300.
Camera & Imaging
The Snapdragon chip features dual 12-bit Spectra ISPs, allowing up to 200MP photo capture and 2K HDR video recording at 30fps. Additionally, it supports 720p slow-motion video recording at 240 fps.
The Dimensity 7300 has a 12-bit Imagiq 950 ISP, which also allows up to 200MP photo capture. It supports hardware-based noise reduction, as does the Snapdragon 6s Gen 4, but the Dimensity chip can record HDR videos at up to 4K resolution, while the Snapdragon chip is capped at 2K.
Connectivity
The Snapdragon 6s Gen 4 uses a 5G modem from Qualcomm that offers up to 2.9 Gbps download speed. The peak speed over a Wi-Fi connection is also limited to 2.9 Gbps. The chip supports Wi-Fi 6E, Bluetooth v5.4, and both 5G mmWave and sub-6 GHz networks. Additionally, it features Qualcomm 5G PowerSave 2.0, Qualcomm SmartTransmit 2.0, and Qualcomm Wideband Envelope Tracking for strong connectivity and improved power saving.
The Dimensity 7300, with its in-house 5G modem and 3CC carrier aggregation, can achieve up to 3.27Gbps download speed over a 5G connection. The chip supports Wi-Fi 6E and Bluetooth v5.4 and features MediaTek 5G UltraSave 3.0+ technology for improved power savings.
Snapdragon 6s Gen 4 vs Dimensity 7300: spec sheet
Snapdragon 6s Gen 4
Dimensity 7300
Announced
October 2025
June 2024
Manufacturing
4nm (Samsung)
4nm (TSMC)
CPU
4 x 2.4 GHz — Cortex-A78 4 x 1.8 GHz — Cortex-A55
4 x 2.5 GHz — Cortex-A78 4 x 2 GHz — Cortex-A55
GPU
Qualcomm Adreno GPU
Mali-G615 MP2
NPU
Qualcomm Hexagon NPU
MediaTek APU 655
Memory
LPDDR5, up to 3.2GHz
LPDDR5, up to 3.2GHz
Storage
UFS 3.1
UFS 3.1
Camera
Dual 12-bit ISPs up to 200MP single camera up to 36MP single camera at 30 fps with zero shutter lag up to 16+16MP dual cameras at 30 fps with zero shutter lag up to 2K HDR video recording at 30 fps Hardware-based noise reduction support
Imagiq 950 ISP (12-bit) up to 200MP single camera up to 4K HDR video recording at 30 fps Hardware-based noise reduction support
Connectivity
Qualcomm 5G modem up to 2.9 Gbps download speed Wi-Fi 6E (peak speed: 2.9 Gbps) Bluetooth 5.4
MediaTek 5G modem up to 3.27 Gbps download speed Wi-Fi 6E Bluetooth 5.4
AI-related demand for high-bandwidth memory (HBM) is now producing tangible aftershocks across the global semiconductor industry. This is tightening wafer foundry capacity and squeezing out the supply of DRAMs often used in smartphones' SoCs, such as the DDR5. And, MediaTek is likely to be the first major SoC manufacturer to be affected. LPDDR5x delivery period is now stretching out to between 26 and 39 weeks, which means orders placed right now won't be delivered until the middle of 2026 As per a report by Taiwan's Commercial Times, the high demand for HBM is now affecting the smartphone SoC manufacturers in […]
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