Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer for AI semiconductors, with prototype production targeted for later this year.

According to TheElec (via SemiconductorsX), Samsung Display has already formed a dedicated R&D team focused on Redistribution Layer (RDL), while Samsung Electronics is working with external partners on manufacturing.

The initiative is intended to improve foundry competitiveness, reduce packaging costs, and build a stronger alternative to TSMC’s advanced packaging ecosystem.

Rather than manufacturing display panels, Samsung Display will focus on one of the most demanding parts of glass interposer production: forming high-precision Redistribution Layers through photolithography.

Samsung Display still has technical hurdles to overcome.

One of the biggest is the “SeWaRe” phenomenon, an interlayer delamination issue caused by differences in thermal expansion between glass and organic materials during the Redistribution Layer process.

Samsung Electronics reportedly plans to manufacture glass interposer prototypes before the end of the year. The company could outsource processes such as Through Glass Via formation and copper filling to specialized partners, including Soulbrain, Chemtronics, and Jungwoo M-Tech.

The South Korean tech giant is attempting to build an integrated platform that combines its foundry services with advanced packaging capabilities, creating a more complete manufacturing solution for AI chip customers.

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