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Multiple Snapdragon 8-series chipsets in works for this year, key specifications tipped

26 June 2026 at 08:45
Snapdragon 8 Elite Gen 6

Qualcomm’s next generation of Snapdragon 8-series chipsets has surfaced through a new leak, hinting at a broader portfolio than before. The information suggests the company is preparing multiple premium processors with different performance targets, while also facing fresh competition from MediaTek’s upcoming flagship silicon.

Multiple Snapdragon 8-series chips in works

According to tipster Digital Chat Station, Qualcomm is working on two 2nm flagship chipsets. The first is the SM8975, which is tentatively expected to launch as the Snapdragon 8 Elite Gen 6 Pro. It is tipped to feature a new 2+3+3 Oryon CPU architecture, 16MB shared L2 cache, an Adreno 850 GPU with 18MB GMEM, and support for both LPDDR6 and LPDDR5X memory. The chip is said to focus on delivering the highest possible performance.

The second chipset, carrying the SM8950 model number, is expected to arrive as the Snapdragon 8 Elite Gen 6. While it is also built on a 2nm process and shares the same next-generation Oryon CPU architecture with 16MB shared L2 cache, it reportedly comes with an Adreno 845 GPU featuring 12MB GMEM. Unlike the Pro version, this chipset is said to strike a balance between performance and power efficiency while supporting LPDDR5X memory.

The tipster also listed several 3nm platforms that are in Qualcomm’s roadmap, including the existing SM8850 (Snapdragon 8 Elite Gen 5) and the upcoming ones, such as the SM8850Q, which may be branded as the Snapdragon 8 Elite Gen 5XX Edition, and the SM8845 Pro, which could be called the Snapdragon 8 Gen 5 Pro or Gen 6 but will be a minor upgrade over the existing Snapdragon 8 Gen 5.

MediaTek rivalry could heat up

In the comments, Digital Chat Station claimed that MediaTek’s upcoming 2nm Dimensity 9600 Pro could theoretically outperform the Snapdragon 8 Elite Gen 6 (SM8950), particularly in GPU performance.

The chip is said to feature the Magni architecture and an integrated NGP neural accelerator, enabling console-level frame interpolation, improved ray tracing performance, and higher rendering efficiency.

As per other reports, this year’s Dimensity 9-series lineup is expected to include three models, namely the 3nm Dimensity 9500+, an overclocked version of the existing Dimensity 9500, along with the 2nm Dimensity 9600 and 9600 Pro.

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The post Multiple Snapdragon 8-series chipsets in works for this year, key specifications tipped appeared first on Gizmochina.

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