Galaxy S26 matches S26 Ultra-level thermal performance, thanks to new 3D TIM cooling
New details surfacing about the Exynos 2600’s cooling tech, which delivers S26 Ultra-level thermal performance to the standard Galaxy S26 flagship.
Samsung may have finally solved one of the biggest compromises with smaller flagship phones: heat. If the latest findings hold up, this is a major win for Galaxy fans who prefer compact phones without sacrificing sustained performance.
According to a new report, the regular Galaxy S26 delivers thermal performance close to the Galaxy S26 Ultra, despite the Ultra traditionally having a much larger cooling advantage.
The credit apparently goes to Samsung’s redesigned “Tailor 3D TIM (Thermal Interface Material)” cooling solution paired with the Exynos 2600 chip.
TIM is the layer that sits between the processor and cooling hardware, helping transfer heat away from the chip as efficiently as possible. The company describes the new 3D TIM as being shaped like custom-fitted clothing for the components inside the phone.
Instead of a simple flat layer, it is molded to match the uneven heights and gaps between surrounding chips and heat-generating parts on the motherboard.
It’s said that this new design increased the effective thermal contact area by around 118% compared to the previous 2D TIM solutions. According to internal findings, the new design dramatically improved contact coverage for these hotspots.
Modern smartphone processors are no longer the only major heat source. Components like power management chips and UFS storage also generate significant heat under load.
The company says the upgraded cooling setup lowered AP temperatures by 1.18°C and reduced rear surface temperatures by 0.73°C compared to older designs.
That suggests Samsung is taking a more aggressive approach to sustained performance rather than relying purely on larger vapor chambers.
![]()
The post Galaxy S26 matches S26 Ultra-level thermal performance, thanks to new 3D TIM cooling appeared first on Sammy Fans.