2025 has already welcomed three flagship chips, including Apple A19 Pro, Qualcomm Snapdragon 8 Elite Gen 5, and MediaTek Dimensity 9500. Samsung has also confirmed Exynos 2600, which would be launched early next year.

The three chips compete with each other in terms of performance and efficiency. Apple’s chip exclusively powers the iPhone, while Qualcomm and MediaTek provide AP solutions to Android smartphone makers.

Recently, X user Kurnal shared an image that shows a size comparison of Apple A19 Pro, Snapdragon 8 Elite Gen 5, and Dimensity 9500. Apple’s silicon beats both of its rivals in terms of die efficiency, being the smallest.

Chip size – Apple vs Qualcomm vs MediaTek

• Apple A19 Pro – 98.69 square millimeter
• Snapdragon 8 Elite Gen 5 – 126.2 square millimeter
• MediaTek Dimensity 9500 – 140.57 square millimeter

Notably, these chips are fabricated on TSMC’s 3nm process technology. Samsung’s upcoming Exynos 2600 is manufactured using its cutting-edge 2nm node. It would surely be smaller than Qualcomm and MediaTek chips.

The image also sheds light on the chip’s components, including CPU, GPU, and NPU. Overall, it’s a pretty nice showdown of Apple’s incredible engineering. Despite being the smallest, it doesn’t compromise performance and efficiency.

Source – Kurnal / X

Apple’s latest iPhone 17 Pro and Pro Max are equipped with the A19 Pro chip. Qualcomm’s Snapdragon 8 Elite Gen 5 powers Android flagships such as the OnePlus 15 and is confirmed to be featured in the Galaxy S26 Ultra in early 2026.

Chinese vendors also utilize MediaTek’s Dimensity 9500 in their flagship devices. Samsung’s upcoming Exynos 2600 is slated to power Galaxy S26 and S26 Plus either in South Korea or in a handful of countries.

The post Can Samsung beat Apple where Qualcomm and MediaTek failed? appeared first on Sammy Fans.

Samsung officially launched its Heat Path Block technology, featured in the Exynos 2600. The company believes that it would be able to sell this chip packaging solution to Apple and Qualcomm for their future mobile chips.

Exynos 2600 is packaged using the new Heath Path Block technology. Samsung Foundry has now officially revealed the new technological breakthrough, which helped it keep the 2nm Exynos cool even with intense processing.

Heath Path Block aims to resolve overheating issues on cutting-edge chips. Exclusively featured in Exynos 2600, the new technology has been opened up and can be used by Apple and Qualcomm – a strikingly bold move.

A source familiar with the matter stated, “Samsung Electronics has decided to offer the internally developed Exynos HPB packaging technology to other potential customers, including Qualcomm and Apple.”

With Exynos 2600 featuring an advanced cooling tech, Samsung MX has reportedly asked Qualcomm to offer its Snapdragon with HPB-level thermal dissipation packaging so the processor stays cool during the process.

Thanks to HPB, Exynos 2600 runs about 30% cooler than Exynos 2500. The new packaging tech replaces the legacy method by using a copper-based heat spreader placed on top of the mobile AP to maximize heat dissipation.

The source added, “Demand for this technology has already grown in the market, with Samsung’s MX Business, the final customer for mobile APs, even requesting HPB-level thermal dissipation packaging from Qualcomm.”

Industry insiders believe that HPB is a key driver behind the success of Exynos 2600. The company has impressively reduced overheating through the Heat Path Block. Exynos 2600 is set to power Galaxy S26 and Plus in 2026.

BREAKING: Samsung teases Galaxy S26’s Exynos 2600 processor

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The Snapdragon 8 Elite Gen 5 might be a little too pricey for Qualcomm’s partners’ liking, but it is the preferred chipset for consumers when they are shopping for the latest and greatest Android flagship. According to a market research firm survey, respondents are three times more willing to pay for a Snapdragon SoC and do not mind forking over a 16 percent premium just as long as the silicon powers their next device. For Samsung, this is a major conundrum as the company looks to reduce its chipset expenditure heavily by introducing the Exynos 2600 to the Galaxy S26 family early next […]

Read full article at https://wccftech.com/qualcomm-survey-customers-three-times-willing-to-pay-for-snapdragon-smartphones/