Samsung officially launched its Heat Path Block technology, featured in the Exynos 2600. The company believes that it would be able to sell this chip packaging solution to Apple and Qualcomm for their future mobile chips.

Exynos 2600 is packaged using the new Heath Path Block technology. Samsung Foundry has now officially revealed the new technological breakthrough, which helped it keep the 2nm Exynos cool even with intense processing.

Heath Path Block aims to resolve overheating issues on cutting-edge chips. Exclusively featured in Exynos 2600, the new technology has been opened up and can be used by Apple and Qualcomm – a strikingly bold move.

A source familiar with the matter stated, “Samsung Electronics has decided to offer the internally developed Exynos HPB packaging technology to other potential customers, including Qualcomm and Apple.”

With Exynos 2600 featuring an advanced cooling tech, Samsung MX has reportedly asked Qualcomm to offer its Snapdragon with HPB-level thermal dissipation packaging so the processor stays cool during the process.

Thanks to HPB, Exynos 2600 runs about 30% cooler than Exynos 2500. The new packaging tech replaces the legacy method by using a copper-based heat spreader placed on top of the mobile AP to maximize heat dissipation.

The source added, “Demand for this technology has already grown in the market, with Samsung’s MX Business, the final customer for mobile APs, even requesting HPB-level thermal dissipation packaging from Qualcomm.”

Industry insiders believe that HPB is a key driver behind the success of Exynos 2600. The company has impressively reduced overheating through the Heat Path Block. Exynos 2600 is set to power Galaxy S26 and Plus in 2026.

BREAKING: Samsung teases Galaxy S26’s Exynos 2600 processor

The post Samsung offers its coolest invention to Apple and Qualcomm appeared first on Sammy Fans.