Imitation remains the highest form of flattery. After Samsung won plaudits for the Exynos 2600's novel Heat Path Block (HPB) thermal technology, Qualcomm, whose recent chips iterations have resembled a veritable inferno when it comes to their runaway heat issues, now appears to be flattering Samsung by copying its HPB tech for the upcoming Snapdragon 8 Elite Gen 6 Pro, albeit sloppily so. Qualcomm appears to be trying to tame the furnace-like credentials of its Snapdragon chips by emulating Samsung's most innovative thermal solution While clarifying that Qualcomm has prepared two and not six versions of its Snapdragon 8 Elite […]

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